Abstract: A package device and a manufacturing method thereof are provided. The package device includes a redistribution layer including a first dielectric layer, a conductive layer, and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test mark, the test mark includes a plurality of conductive patterns formed of the conductive layer, and the conductive patterns are arranged in a ring shape.

Abstract: A gate structure includes a gate dielectric layer, a work function layer, a metal layer, and a barrier layer. The work function layer is surrounded by the gate dielectric layer. The metal layer is disposed over the work function layer. The barrier layer is surrounded by the work function layer and surrounds the metal layer. The barrier layer includes fluorine and silicon, or fluorine and aluminum. The barrier layer is a tri-layered structure.

Abstract: A package device and a manufacturing method thereof are provided. The package device includes a redistribution layer including a first dielectric layer, a conductive layer, and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test mark, the test mark includes a plurality of conductive patterns formed of the conductive layer, and the conductive patterns are arranged in a ring shape.

Abstract: Disclosed are methods for producing steviol glycosides, such as rebaudioside D and rebaudioside M, using engineered yeast. The methods include at least two phases: first and second phases where a glucose-containing feed composition is provided to the medium in different modes of feeding in each phase, such as variable feeding and then constant feeding. The two phase feeding can result in a growth rate that is slower in the second phase than in the first phase, and consequently increased steviol glycoside production rates, reduced fermentation times, and reduced biomass concentrations.

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for estimating a 3-D pose of an object of interest from image and point cloud data. In one aspect, a method includes obtaining an image of an environment; obtaining a point cloud of a three-dimensional region of the environment; generating a fused representation of the image and the point cloud; and processing the fused representation using a pose estimation neural network and in accordance with current values of a plurality of pose estimation network parameters to generate a pose estimation network output that specifies, for each of multiple keypoints, a respective estimated position in the three-dimensional region of the environment.

Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes a redistribution layer which includes a first dielectric layer, a conductive layer and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test pattern that includes a first conductive pattern, and the first conductive pattern is formed of the conductive layer.

Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes a redistribution layer which includes a first dielectric layer, a conductive layer and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test pattern that includes a first conductive pattern, and the first conductive pattern is formed of the conductive layer.

Abstract: An automatic recognition, management and control system for dangerous sources in wind turbines, including an intelligent service unit, a telecontrol platform, a graphic workstation, an intelligent analysis unit, a network unit, an intelligent binocular perception terminal, an intelligent perception terminal and an intelligent recognition terminal, where the telecontrol platform and the graphic workstation are both connected to the intelligent service unit, a signal output end of the intelligent analysis unit is connected to a signal input end of the intelligent service unit through a dedicated line, and signal output ends of the intelligent binocular perception terminal, the intelligent perception terminal and the intelligent recognition terminal are all connected to a signal input end of the intelligent analysis unit through the network unit.

Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).

Abstract: A bio-resin composition, a bio-resin composite, and a bio-foam material are provided. The bio-resin composition includes a polymer matrix, a toughener, and an antistatic agent. The weight ratio of the polymer matrix to the toughener is between 90:10 and 60:40. Based on the total weight of the polymer matrix and the toughener, the content of the antistatic agent is between 1% and 10%.

Abstract: Embodiments disclosed herein relate to a pre-deposition treatment of materials utilized in metal gates of different transistors on a semiconductor substrate. In an embodiment, a method includes exposing a first metal-containing layer of a first device and a second metal-containing layer of a second device to a reactant to form respective monolayers on the first and second metal-containing layers. The first and second devices are on a substrate. The first device includes a first gate structure including the first metal-containing layer. The second device includes a second gate structure including the second metal-containing layer different from the second metal-containing layer. The monolayers on the first and second metal-containing layers are exposed to an oxidant to provide a hydroxyl group (—OH) terminated surface for the monolayers. Thereafter, a third metal-containing layer is formed on the —OH terminated surfaces of the monolayers on the first and second metal-containing layers.

Abstract: A screwdriver rotation structure includes a main body, a control member, a driving member, multiple first rolls, and multiple second rolls. The main body has multiple first recesses and multiple first pillars. Each of the first recesses has a first face. Each of the first pillars has two second faces, two third faces, and a first pivot portion. The main body has multiple second pivot portions. The control member has multiple third pivot portions and multiple second pillars. Each of the second pillars has a fourth face, a fifth face, and a fourth pivot portion. The control member has a fifth pivot portion and a mounting portion. Each of the first rolls is received in one of the first recesses. Each of the second rolls is received in one of the first recesses.

Abstract: This disclosure relates to an apparatus and methods for applying X-ray reflectometry (XRR) in characterizing three dimensional nanostructures supported on a flat substrate with a miniscule sampling area and a thickness in nanometers. In particular, this disclosure is targeted for addressing the difficulties encountered when XRR is applied to samples with intricate nanostructures along all three directions, e.g. arrays of nanostructured poles or shafts. Convergent X-ray with long wavelength, greater than that from a copper anode of 0.154 nm and less than twice of the characteristic dimensions along the film thickness direction, is preferably used with appropriate collimations on both incident and detection arms to enable the XRR for measurements of samples with limited sample area and scattering volumes. In one embodiment, the incident angle of the long-wavelength focused X-ray is ?24°, and the sample area is ?25 ?m×25 ?m.

Abstract: Semiconductor devices having improved gate electrode structures and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a gate structure over a semiconductor substrate, the gate structure including a high-k dielectric layer; an n-type work function layer over the high-k dielectric layer; an anti-reaction layer over the n-type work function layer, the anti-reaction layer including a dielectric material; a p-type work function layer over the anti-reaction layer, the p-type work function layer covering top surfaces of the anti-reaction layer; and a conductive cap layer over the p-type work function layer.

Abstract: Embodiments disclosed herein relate to a pre-deposition treatment of materials utilized in metal gates of different transistors on a semiconductor substrate. In an embodiment, a method includes exposing a first metal-containing layer of a first device and a second metal-containing layer of a second device to a reactant to form respective monolayers on the first and second metal-containing layers. The first and second devices are on a substrate. The first device includes a first gate structure including the first metal-containing layer. The second device includes a second gate structure including the second metal-containing layer different from the second metal-containing layer. The monolayers on the first and second metal-containing layers are exposed to an oxidant to provide a hydroxyl group (—OH) terminated surface for the monolayers. Thereafter, a third metal-containing layer is formed on the —OH terminated surfaces of the monolayers on the first and second metal-containing layers.

Abstract: The present disclosure provides an electronic device including a substrate, a first pad, a second pad and an integrated circuit chip. The first pad is disposed on the substrate. The second pad is disposed on the first pad and electrically connected to the first pad. The integrated circuit chip is disposed on the second pad and is electrically connected to the second pad. The second pad has a plurality of curved corners.

Abstract: The present invention relates to a suitcase, including a case body and a plurality of wheel assemblies. The case body has a cuboid shape and includes a front portion, a rear portion, a plurality of top cylindrical projections, at least one bottom tubular projection, and four sidewalls. The rear portion is connected to the front portion. The top cylindrical projections are on the rear portion and protrude outwardly. The bottom tubular projection is on the rear portion and protrudes outwardly in the opposite direction of the top cylindrical projections. The sidewalls surround the bottom tubular projection. There is a space between the bottom tubular projection and the sidewalls. The wheel assemblies are connected to the case body by closely engaged the wheel assemblies to the top cylindrical projections, or by closely engaged the wheel assemblies in the space.

Abstract: The presently claimed invention relates to liquid crystal lipid particles. The presently claimed invention relates to liquid crystal lipid particles which are used in topical composition which has high moisturization efficacy, excellent skin feel, skin softness, and skin smoothness benefits.

Abstract: A power sequence monitoring system is disclosed, and comprises: a microprocessor and a control module. The microprocessor comprises a first conversion unit and a second conversion unit. The first conversion unit is used for converting a power-on signal received from a power management chip to a first digital signal, and the second conversion unit is adopted for converting a power-off signal received form the power management chip to a second digital signal. After receiving the first digital signal and the second digital signal from the microprocessor, and the control module outputs a plurality of power monitoring data to an electronic device, such that a user easily knows the power signal state of the host computer by the system of the present invention.

Abstract: The present disclosure relates to a device and a method for measuring a thickness of an ultrathin film on a solid substrate. The thickness of the target ultrathin film is measured from the intensity of the fluorescence converted by the substrate and leaking and tunneling through the target ultrathin film at low detection angle. The fluorescence generated from the substrate has sufficient and stable high intensity, and therefore can provide fluorescence signal strong enough to make the measurement performed rapidly and precisely. The detection angle is small, and therefore the noise ratio is low, and efficiency of thickness measurement according to the method disclosed herein is high. The thickness measurement method can be applied into In-line product measurement without using standard sample, and therefore the thickness of the product can be measured rapidly and efficiently.