Abstract: A multilayer ceramic capacitor includes: a multilayer chip in which dielectric layers mainly composed of ceramic and internal electrode layers are alternately stacked so that the internal electrode layers are alternately exposed to two end faces, which face each other, of the multilayer chip, the multilayer chip having a substantially rectangular parallelepiped shape; and a pair of external electrodes formed from the two end faces of the multilayer chip to at least one side face of side faces of the multilayer chip, wherein each of the pair of external electrodes includes a metal layer and an oxide layer, the metal layer being formed from the end face to the at least one side face and being mainly composed of copper, the oxide layer covering at least a part of the metal layer, being mainly composed of copper oxide, and having a maximum thickness of 0.5 ?m or greater.

Abstract: A ceramic electronic device includes: a ceramic main body of a parallelepiped shape having at least two edge faces facing each other, and having an internal electrode layer inside; and external electrodes formed on the two edge faces and having a structure in which a plated layer is formed on a ground layer having a metal, as a main component, and ceramic; the external electrodes have an extension region which extends to at least one of four side faces from the two edge faces, and a part of which corresponds to a corner portion of the ceramic main body and includes a portion with the ground layer and a first portion, without the ground layer, arranged at a position where one of the two end faces and one of the four side faces are connected; and the plated layer covers the ground layer and the first portion.

Abstract: A multi-layer ceramic electronic component includes a ceramic body including: a multi-layer unit including a capacitance forming unit including ceramic layers laminated in a first direction and internal electrodes disposed therebetween, a side surface facing in a second direction orthogonal to the first direction, an end surface facing in a third direction orthogonal to the above directions, a drawn portion extending from the capacitance forming unit in the third direction, the internal electrodes being drawn to the end surface, and a cover that covers the capacitance forming unit and the drawn portion in the first direction; and a side margin that covers the side surface. The drawn portion includes a first region and a second region disposed between the cover and the first region, an end portion of each internal electrode in the second region being positioned inward in the second direction relative to that in the first region.

Abstract: A ceramic electronic component includes external electrodes having conductive resin layers thereinside on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body. Each of the external electrodes includes an underlying metal layer, an intermediate metal layer, a conductive resin layer, an external metal layer. A tip angle ? between an outer face of a tip portion of the wraparound portion of the underlying metal layer and a surface of the ceramic component body is 20° or smaller, and a tip angle ? between an outer face of a tip portion of the wraparound portion of the intermediate metal layer and a surface of the ceramic component body is 20° or smaller.

Abstract: A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, the internal electrode layers being alternately exposed to two edge faces of the multilayer chip facing each other, and a pair of external electrodes respectively formed on the two edge faces so as to be connected to the internal electrode layers exposed on the respective edge faces, each external electrode extending to at least one side face of the multilayer chip, wherein in the multilayer chip, oxides including Zn and Ni are present around the internal electrode layer in a vicinity of a connection part connecting the internal electrode layer to the external electrode.

Abstract: A ceramic electronic component includes a multilayer chip including a multilayer structure and cover layers disposed on top and bottom faces in a stack direction of the multilayer structure, and a pair of external electrodes respectively formed on two edge faces of the multilayer structure and extending to four side faces of the multilayer chip, wherein each external electrode has a recessed portion on at least one of two side faces facing each other in the stack direction or at least one of remaining two side faces, and wherein each external electrode has no recessed portion on the two side faces when each external electrode has the recessed portion on at least one of the remaining two side faces, and has no recessed portion on the remaining two side faces when each external electrode has the recessed portion on at least one of the two side faces.

Abstract: A probe card has an edge sensor. The edge sensor has a first needle and a second needle. The first needle and the second needle are in contact with each other when the first needle and a wafer are not in contact with each other, and the first needle and the second needle are not in contact with each other when the first needle and the wafer are in contact with each other. The probe card has a resistor connected between the first needle and the second needle.

Abstract: A ceramic electronic component includes external electrodes having conductive resin layers thereinside on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body. Each of the external electrodes includes an underlying metal layer, an intermediate metal layer, a conductive resin layer, an external metal layer. A tip angle ? between an outer face of a tip portion of the wraparound portion of the underlying metal layer and a surface of the ceramic component body is 20° or smaller, and a tip angle ? between an outer face of a tip portion of the wraparound portion of the intermediate metal layer and a surface of the ceramic component body is 20° or smaller.

Abstract: A multilayer ceramic electronic device includes a ceramic main body and a pair of external electrodes respectively covering a pair of end surfaces of the ceramic main body, wherein the ceramic main body includes a laminated body including a plurality of internal electrodes laminated vertically therein, and a pair of side margin parts respectively covering a pair of side surfaces of the laminated body, and wherein a distance between a bottom surface of the ceramic main body and the bottommost internal electrode is greater than a distance between the top surface of the ceramic main body and the topmost internal electrode.

Abstract: An optical filter includes a pair of reflection films facing each other via a gap, and a gap change portion that changes a distance between the pair of reflection films, wherein the reflection film is formed by a plurality of layered structures, the plurality of layered structures are respectively formed by alternate stacking of high-refractive layers and low-refractive layers having smaller refractive indices than the high-refractive layers and, in the respective layered structures, optical film thicknesses of the high-refractive layers and optical film thicknesses of the low-refractive layers are film thicknesses based on predetermined design center wavelengths set with respect to each of the layered structures, and the design center wavelengths are different with respect to each of the layered structures.

Abstract: A wavelength-tunable interference filter includes: a first substrate where a first mirror and a first electrode are provided; a second substrate where a second mirror corresponding to the first mirror and a second electrode facing the first electrode are provided; and a bonding part bonding the first substrate and the second substrate together. The first substrate includes a moving part where the first mirror is arranged, a diaphragm part holding the moving part in such a way that the moving part is movable in the Z-direction, and an outer circumferential part provided outside of the diaphragm part. The diaphragm part includes a planar part having a uniform thickness, and a first slope part having a thickness in the Z-direction incrementing as it goes from the planar part toward the outer circumferential part. The first electrode is provided over a range from the planar part to the first slope part.

Abstract: A ceramic electronic component includes: a ceramic body that includes internal electrodes; and an external electrode that includes a plurality of crystal particles containing Ba, Zn, Si, and O, the external electrode being formed on a surface of the ceramic body and connected to the internal electrodes.

Abstract: An ultrasonic device includes: a substrate that is provided with a first surface and a second surface as a back surface of the first surface and has an opening opened from the first surface to the second surface; a support that blocks the opening on the first surface side; a vibrator provided on the support; and a metal membrane provided in an unopened region, which is not opened by the opening, on the second surface of the substrate.

Abstract: An ultrasonic device includes an ultrasonic transducer that has a vibration film and transmits an ultrasonic wave from a first surface side of the vibration film, an acoustic matching layer that is provided on the first surface side of the vibration film, and an acoustic lens that is provided on the acoustic matching layer on an opposite side to the vibration film, in which the acoustic matching layer is formed of even-numbered layers including a first layer and a second layer having acoustic impedance lower than acoustic impedance of each of the first layer and the acoustic lens, and the first layer and the second layer are disposed in this order toward the acoustic lens from the vibration film, and in which each of the first layer and the second layer has a thickness corresponding to an odd-numbered multiple of ?/4 with a wavelength of the ultrasonic wave as ?.

Abstract: In an exemplary embodiment, a multilayer ceramic capacitor has, at two opposing respective end parts of a capacitor body 11 of roughly rectangular solid shape, external electrodes 12 that each have a conductive resin layer F3 inside. Each of the external electrodes 12 continuously has an end face part 12a corresponding to one face, and a wraparound part 12b corresponding to four faces surrounding the one face, of the capacitor body 11. Also, the end face part 12a of each of the external electrodes 12 has a bulging part 12a1 on the outer face of the end face part 12a. An electronic component using the multilayer ceramic capacitor can maximally prevent the Manhattan phenomenon that may otherwise occur when the electronic component is mounted on a circuit board, even though its external electrodes have the conductive resin layer inside.

Abstract: A piezoelectric device includes a piezoelectric film having a first surface in contact with a vibrating film and a second surface on the opposite side to the first surface, first and second electrodes that are provided on the second surface of the piezoelectric film and that are disposed at positions away from each other and are short-circuited to each other at a position away from the piezoelectric film, and a third electrode that is provided between the first and second electrodes on the second surface of the piezoelectric film and is disposed at a position away from the first and second electrodes. At least parts of the contours of end portions of the first and second electrodes are defined in parallel to side portions of the third electrode.

Abstract: A ceramic electronic component includes external electrodes having conductive resin layers thereinside on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body. Each of the external electrodes includes an underlying metal layer, an intermediate metal layer, a conductive resin layer, an external metal layer. A tip angle ? between an outer face of a tip portion of the wraparound portion of the underlying metal layer and a surface of the ceramic component body is 20° or smaller, and a tip angle ? between an outer face of a tip portion of the wraparound portion of the intermediate metal layer and a surface of the ceramic component body is 20° or smaller.

Abstract: A multilayer ceramic capacitor includes: a multilayer chip in which dielectric layers mainly composed of ceramic and internal electrode layers are alternately stacked so that the internal electrode layers are alternately exposed to two end faces, which face each other, of the multilayer chip, the multilayer chip having a substantially rectangular parallelepiped shape; and a pair of external electrodes formed from the two end faces of the multilayer chip to at least one side face of side faces of the multilayer chip, wherein each of the pair of external electrodes includes a metal layer and an oxide layer, the metal layer being formed from the end face to the at least one side face and being mainly composed of copper, the oxide layer covering at least a part of the metal layer, being mainly composed of copper oxide, and having a maximum thickness of 0.5 ?m or greater.

Abstract: An ultrasonic device includes: a substrate provided with a first opening and a second opening; a support film that is provided on the substrate and blocks the first opening and the second opening; a transmitting piezoelectric film that is provided on the support film at a position which overlaps the first opening when viewed in a thickness direction of the substrate and is interposed between a pair of electrodes in the thickness direction of the substrate; and a receiving piezoelectric film that is provided on the support film at a position which overlaps the second opening when viewed in the thickness direction of the substrate and is interposed between a pair of electrodes in the thickness direction of the substrate. In the thickness direction of the substrate, a thickness dimension of the transmitting piezoelectric film is smaller than a thickness dimension of the receiving piezoelectric film.

Abstract: An ultrasonic device includes: a substrate provided with a first opening and a second opening; a support film that is provided on the substrate and closes the first opening and the second opening; a transmitting piezoelectric film that is provided on the support film at a position which overlaps the first opening when viewed in a thickness direction of the substrate and that is sandwiched between a pair of electrodes in the thickness direction of the substrate; and a receiving piezoelectric film that is provided on the support film at a position which overlaps the second opening when viewed in the thickness direction of the substrate and that is sandwiched between a pair of electrodes in an intersecting direction intersecting with the thickness direction of the substrate.