Patents by Inventor Tomoaki Nakamura

Tomoaki Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTROMAGNETIC WAVE SHIELDING SUPPORT BASE-ATTACHED ENCAPSULANT, ENCAPSULATED SUBSTRATE HAVING SEMICONDUTOR DEVICES MOUNTED THEREON, ENCAPSULATED WAFER HAVING SEMICONDUCTOR DEVICES FORMED THEREON, AND SEMICONDUCTOR APPARATUS
    Publication number: 20160133579
    Abstract: The present invention provides an electromagnetic wave shielding support base-attached encapsulant for collectively encapsulating a semiconductor device mounting surface of a substrate having semiconductor devices mounted thereon or a semiconductor device forming surface of a wafer having semiconductor devices formed thereon, the support base-attached encapsulant including a support base having an electromagnetic wave shielding property of 20 dB or more within a range of 100 MHz to 1,000 MHz, and an encapsulant composed of a thermosetting resin layer laminated on the support base.
    Type: Application
    Filed: October 1, 2015
    Publication date: May 12, 2016
    Inventors: Hideki AKIBA, Tomoaki NAKAMURA, Toshio SHIOBARA, Shinsuke YAMAGUCHI
  • ULTRASONIC TRANSDUCER, ULTRASONIC PROBE, AND ULTRASONIC EXAMINATION DEVICE
    Publication number: 20160121368
    Abstract: An ultrasonic transducer includes a substrate, a supporting film disposed on the substrate, and a piezoelectric element disposed on the supporting film. The substrate includes an opening. The piezoelectric element is disposed on an area that overlaps the opening in a plan view in a thickness direction of the substrate. A thickness of the supporting film at an area that overlaps the piezoelectric element in a plan view of the supporting film is smaller than a thickness of the supporting film at a different area different from the area that overlaps the piezoelectric element.
    Type: Application
    Filed: January 13, 2016
    Publication date: May 5, 2016
    Inventors: Tomoaki NAKAMURA, Hironori SUZUKI, Jiro TSURUNO
  • Support base-attached encapsulant, encapsulated substrate having semiconductor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus
    Patent number: 9312197
    Abstract: Support base-attached encapsulant for collectively encapsulating a semiconductor device mounting surface of a substrate or semiconductor device forming surface of a wafer, containing a support base having one fibrous film or a plurality of the fibrous films being laminated, the fibrous film subjected to surface treatment with an organosilicon compound, and a resin layer of thermosetting resin formed on one surface of the support base. The support base-attached encapsulant inhibit the substrate or wafer from warping and semiconductor devices from peeling away from the substrate, and collectively encapsulate the semiconductor device mounting surface of the substrate or the semiconductor device forming surface of the wafer even when a large-diameter wafer or large-area substrate is encapsulated.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: April 12, 2016
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hideki Akiba, Tomoaki Nakamura, Shinsuke Yamaguchi, Toshio Shiobara
  • ULTRASONIC SENSOR AS WELL AS PROBE AND ELECTRONIC APPARATUS
    Publication number: 20160089111
    Abstract: An ultrasonic sensor includes a vibration plate, a first electrode, a piezoelectric body, and a second electrode. The first electrode is laminated on the vibration plate, that has a length along a surface of the vibration plate in a first direction, and that has a width Wbe along the surface of the vibration plate in a second direction that is orthogonal to the first direction. The width Wbe is not more than the length. The piezoelectric body is laminated on the first electrode and has a width Wpz in the second direction. The second electrode is laminated on the piezoelectric body. A ratio Wbe/Wpz between the width Wbe of the first electrode and the width Wpz of the piezoelectric body is not less than 0.1 and not more than 0.8.
    Type: Application
    Filed: September 29, 2015
    Publication date: March 31, 2016
    Inventors: Masayoshi YAMADA, Hiroshi MATSUDA, Tomoaki NAKAMURA, Hiroshi ITO, Hiromu MIYAZAWA
  • Fiber-containing resin substrate, device-mounting substrate and device-forming wafer, semiconductor apparatus, and method for producing semiconductor apparatus
    Patent number: 9287174
    Abstract: A fiber-containing resin substrate for collectively encapsulating a semiconductor-device-mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor-device-forming surface of a wafer on which a semiconductor device is formed, including a resin-impregnated fibrous base material which is obtained by impregnating a fibrous base material with a thermosetting resin and semi-curing or curing the thermosetting resin and has a linear expansion coefficient (ppm/° C.) in an X-Y direction of less than 3 ppm, and an uncured resin layer formed of an uncured thermosetting resin on one side of the resin-impregnated fibrous base material.
    Type: Grant
    Filed: November 14, 2013
    Date of Patent: March 15, 2016
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Susumu Sekiguchi, Toshio Shiobara, Hideki Akiba, Tomoaki Nakamura
  • ULTRASONIC TRANSDUCER DEVICE AND ULTRASONIC MEASUREMENT DEVICE
    Publication number: 20160058415
    Abstract: An ultrasonic transducer device 100 includes a substrate 130, an ultrasonic transducer element array 110 that is provided on the substrate 130 and in which a plurality of ultrasonic transducer elements 111 are arranged, and an identification ultrasonic transducer element array 120 that is provided on the substrate 130 and in which a plurality of identification ultrasonic transducer elements 121 are arranged. Identification information of the ultrasonic transducer device 100 is set by some of the plurality of identification ultrasonic transducer elements 121 being set to a receivable state and the rest being set to a non-receivable state.
    Type: Application
    Filed: August 20, 2015
    Publication date: March 3, 2016
    Inventors: Tomoaki NAKAMURA, Jiro TSURUNO
  • Ultrasonic transducer, ultrasonic probe, and ultrasonic examination device
    Patent number: 9269884
    Abstract: An ultrasonic transducer includes a substrate, a supporting film, and a piezoelectric element. The substrate includes an opening. The supporting film is configured on the substrate to cover the opening. The piezoelectric element is configured at a part of the supporting film. The part overlaps with the opening in a planar view in a thickness direction of the substrate. A thickness of the part of at a center of gravity in the planar view is smaller than a thickness of an outer edge portion of the part. The outer edge portion is closer to the substrate than the center to the substrate.
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: February 23, 2016
    Assignee: Seiko Epson Corporation
    Inventors: Tomoaki Nakamura, Hironori Suzuki, Jiro Tsuruno
  • FIBER-CONTAINING RESIN SUBSTRATE, DEVICE-MOUNTING SUBSTRATE AND DEVICE-FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS
    Publication number: 20160043012
    Abstract: A fiber-containing resin substrate for collectively encapsulating a semiconductor-device-mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor-device-forming surface of a wafer on which a semiconductor device is formed, including a resin-impregnated fibrous base material which is obtained by impregnating a fibrous base material with a thermosetting resin and semi-curing or curing the thermosetting resin and has a linear expansion coefficient (ppm/° C.) in an X-Y direction of less than 3 ppm, and an uncured resin layer formed of an uncured thermosetting resin on one side of the resin-impregnated fibrous base material.
    Type: Application
    Filed: October 21, 2015
    Publication date: February 11, 2016
    Inventors: Susumu SEKIGUCHI, Toshio SHIOBARA, Hideki AKIBA, Tomoaki NAKAMURA
  • CERAMIC ELECTRONIC COMPONENT
    Publication number: 20160042868
    Abstract: In an embodiment of a ceramic electronic component, an external electrode 12 of a capacitor 10 has one first planar part SEa of roughly rectangular profile positioned on a surface that specifies the length dimension of the ceramic chip 11, as well as four second planar parts SEb of roughly rectangular profile positioned on both surfaces that specify the height dimension, and both surfaces that specify the width dimension, of the ceramic chip 11 and also continuing to the first planar part SEa. The second planar part SEb is constituted by a baked metal film 12a formed on the exterior surface of the ceramic chip 11 and a plated metal film 12b formed on the exterior surface of the baked metal film 12a via an adhesive force mitigation film 12c.
    Type: Application
    Filed: March 17, 2014
    Publication date: February 11, 2016
    Inventors: Koji OTSUKA, Tomoaki NAKAMURA
  • SUPPORT BASE-ATTACHED ENCAPSULANT, ENCAPSULATED SUBSTRATE HAVING SEMICONDUCTOR DEVICES MOUNTED THEREON, ENCAPSULATED WAFER HAVING SEMICONDUCTOR DEVICES FORMED THEREON, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS
    Publication number: 20160035638
    Abstract: Support base-attached encapsulant for collectively encapsulating a semiconductor device mounting surface of a substrate or semiconductor device forming surface of a wafer, containing a support base having one fibrous film or a plurality of the fibrous films being laminated, the fibrous film subjected to surface treatment with an organosilicon compound, and a resin layer of thermosetting resin formed on one surface of the support base. The support base-attached encapsulant inhibit the substrate or wafer from warping and semiconductor devices from peeling away from the substrate, and collectively encapsulate the semiconductor device mounting surface of the substrate or the semiconductor device forming surface of the wafer even when a large-diameter wafer or large-area substrate is encapsulated.
    Type: Application
    Filed: June 12, 2015
    Publication date: February 4, 2016
    Inventors: Hideki AKIBA, Tomoaki NAKAMURA, Shinsuke YAMAGUCHI, Toshio SHIOBARA
  • ULTRASONIC PROBE AND ULTRASONIC INSPECTION APPARATUS
    Publication number: 20160007963
    Abstract: An ultrasonic probe includes a substrate, a diaphragm, a thin-film piezoelectric element, a communication passage, and an air hole. The substrate has first and second cavities thereon. The diaphragm is configured at the first cavity. The thin-film piezoelectric element is configured to the diaphragms. The communicating passage is configured in the substrate and extending from the first cavity to the second cavity. The air hole extends between the communicating passage to an outside of the substrate.
    Type: Application
    Filed: September 21, 2015
    Publication date: January 14, 2016
    Inventors: Tomoaki NAKAMURA, Hiroaki HOSOMI
  • Method for manufacturing an ultrasonic transducer, biological sensor
    Patent number: 9231190
    Abstract: A method for manufacturing an ultrasonic transducer includes: forming a piezoelectric element by laminating a lower electrode, a piezoelectric body, and an upper electrode on a first face of a support film; affixing a reinforcing substrate that covers the piezoelectric element to the first face of the support film; forming a photosensitive resin substrate to a second face of the support film that is on an opposite side from the first face; forming an opening in the resin substrate by irradiating the resin substrate with light; and removing the reinforcing substrate.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: January 5, 2016
    Assignee: Seiko Epson Corporation
    Inventors: Tomoaki Nakamura, Hironori Suzuki
  • Ultrasonic probe and ultrasonic inspection apparatus
    Patent number: 9168025
    Abstract: An ultrasonic probe includes a substrate, a diaphragm, a thin-film piezoelectric element, a communication passage, and an air hole. The substrate has first and second cavities thereon. The diaphragm is configured at the first cavity. The thin-film piezoelectric element is configured to the diaphragms. The communicating passage is configured in the substrate and extending from the first cavity to the second cavity. The air hole extends between the communicating passage to an outside of the substrate.
    Type: Grant
    Filed: June 13, 2013
    Date of Patent: October 27, 2015
    Assignee: Seiko Epson Corporation
    Inventors: Tomoaki Nakamura, Hiroaki Hosomi
  • ULTRASONIC TRANSDUCER ELEMENT CHIP, PROBE, ELECTRONIC INSTRUMENT, AND ULTRASONIC DIAGNOSTIC DEVICE
    Publication number: 20150298172
    Abstract: An ultrasonic transducer element chip includes a substrate, a plurality of ultrasonic transducer elements and a plate-shaped member. The substrate includes a partition wall section defining a plurality of openings arranged in an array pattern. A wall thickness of the partition wall section is smaller than a wall height of partition wall section. Each of the ultrasonic transducer elements is provided in each of the openings. The plate-shaped member is fixed on a surface of the substrate opposite to a surface of the substrate on which the ultrasonic transducer elements are provided. The plate-shaped member covers at least one of the openings in a plan view seen along a thickness direction of the substrate.
    Type: Application
    Filed: June 29, 2015
    Publication date: October 22, 2015
    Inventors: Tomoaki NAKAMURA, Jiro TSURUNO, Kanechika KIYOSE
  • PIEZOELECTRIC ELEMENT, PIEZOELECTRIC DEVICE, PROBE, ELECTRONIC MACHINE, AND ULTRASONIC IMAGE APPARATUS
    Publication number: 20150273526
    Abstract: A piezoelectric element includes a vibrating film, a piezoelectric body, a first electrode, a second electrode, and a groove. The piezoelectric body is arranged upon the vibrating film. The first electrode is arranged upon the piezoelectric body. The second electrode is arranged upon the piezoelectric body and at a position that is separated from the first electrode. The groove is located between the first electrode and the second electrode and splits a surface of the piezoelectric body in two, as seen in plan view from a thickness direction of the vibrating film.
    Type: Application
    Filed: March 26, 2015
    Publication date: October 1, 2015
    Inventors: Jiro TSURUNO, Tsukasa FUNASAKA, Tomoaki NAKAMURA, Hiromu MIYAZAWA, Hiroshi ITO, Masayoshi YAMADA
  • ULTRASONIC TRANSDUCER ELEMENT CHIP, PROBE, ELECTRONIC INSTRUMENT, AND ULTRASONIC DIAGNOSTIC DEVICE
    Publication number: 20150265246
    Abstract: An ultrasonic transducer element chip includes a substrate defining an opening, an ultrasonic transducer element disposed at a position corresponding to the opening in a thickness direction of the substrate, and a reinforcing member connected to the substrate to cover the opening. The reinforcing member defines a ventilation passage from the opening to an outside of the substrate.
    Type: Application
    Filed: June 8, 2015
    Publication date: September 24, 2015
    Inventors: Tomoaki NAKAMURA, Jiro TSURUNO, Kanechika KIYOSE
  • Aqueous coloring composition for textile printing, textile printing method, and fabric
    Patent number: 9139954
    Abstract: An aqueous coloring composition for textile printing, the aqueous coloring composition being capable of forming an image which exhibits a high color optical density and excellent water resistance; a textile printing method and a kit, using the same; and a fabric, in which an image exhibiting both a high color optical density and excellent water resistance is formed, are provided. The aqueous coloring composition for textile printing includes a colorant and water, in which the molecule of the colorant contains both a chromophoric group and a dissociable group which is in a dissociated state, the chromophoric group and a negative electric charge generated by the dissociation of the dissociable group form a conjugated system, and the number of dissociable groups in the molecule of the colorant is the same as the number of chromophoric groups therein.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: September 22, 2015
    Assignee: FUJIFILM Corporation
    Inventors: Yoshiharu Yabuki, Yoshiaki Kondo, Hiromi Kobayashi, Tomoaki Nakamura
  • Ultrasonic probe and ultrasonic image diagnostic device
    Patent number: 9131920
    Abstract: An ultrasonic probe includes a substrate having an opening section, a support film disposed on the substrate, a piezoelectric body disposed on the support film at the opening section, first and second resin sections, and a communicating section. The first resin section is disposed at a position overlapping the opening section in the plan view and spaced apart from the support film with the liquid being arranged therebetween. The communicating section is connected to the first resin section. The second resin section is connected to the communicating section to house the liquid flowing in through a communication hole of the communicating section. At least portions of the first and second resin sections are configured to deform such that a first liquid filled volume formed between the first resin section and the support film and a second liquid filled volume formed by the second resin section are changed.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: September 15, 2015
    Assignee: Seiko Epson Corporation
    Inventors: Tomoaki Nakamura, Hiroaki Hosomi
  • Ultrasonic sensor, tactile sensor, grasping apparatus, and electronic device
    Patent number: 9127999
    Abstract: An ultrasonic sensor includes: a substrate; an ultrasonic transducer disposed on the substrate, and configured and arranged to transmit ultrasonic waves that propagate as plane waves in a direction orthogonal to a surface of the substrate; an acoustic refracting part contacting the ultrasonic transducer, and configured and arranged to refract the ultrasonic waves transmitted from the ultrasonic transducer; an elastically deformable elastic portion contacting the acoustic refracting part; and an ultrasonic reflecting member disposed within the elastic portion, and configured and arranged to reflect the ultrasonic waves. The acoustic refracting part is configured and arranged to refract, toward the ultrasonic reflecting member, the ultrasonic waves transmitted from the ultrasonic transducer.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: September 8, 2015
    Assignee: Seiko Epson Corporation
    Inventors: Jiro Tsuruno, Tsutomu Nishiwaki, Tomoaki Nakamura
  • Encapsulant, encapsulated substrate having semiconductor devices mounting thereon, encapsulated wafer having semiconductor devices forming thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus
    Patent number: 9129912
    Abstract: The invention provides an encapsulant for collectively encapsulating a semiconductor devices mounting surface of a substrate having semiconductor devices mounting thereon or a semiconductor devices forming surface of a wafer having semiconductor devices forming thereon, and the encapsulant comprises a supporting substrate having a difference of a linear expansion coefficient from that of the substrate or the wafer of 5 ppm or less and a thermosetting resin layer being laminated, wherein the thermosetting resin layer has a shape having a height difference to a thickness direction.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: September 8, 2015
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hideki Akiba, Toshio Shiobara, Susumu Sekiguchi, Tomoaki Nakamura