Abstract: An ultrasonic transducer element chip includes a substrate defining an opening, an ultrasonic transducer element disposed at a position corresponding to the opening in a thickness direction of the substrate, and a reinforcing member connected to the substrate to cover the opening. The reinforcing member defines a ventilation passage from the opening to an outside of the substrate.

Abstract: A piezoelectric element which includes a vibrating film, a piezoelectric body disposed on one surface of the vibrating film, and a horizontal electrode structure in which electrodes are disposed at a predetermined gap therebetween on the piezoelectric body. The vibrating film includes a recess portion in a portion corresponding to the predetermined gap in plan view.

Abstract: A base-attached encapsulant for semiconductor encapsulation, includes a base and encapsulating resin layer on one surface of the base, the base being composed of a fibrous base layer in which a thermosetting resin composition containing a thermosetting resin is impregnated into a fibrous base and cured, a cured material layer A composed of a cured material of the thermosetting resin composition formed on the fibrous base layer at the opposite side to the encapsulating resin layer, and a cured material layer B composed of a cured material of the thermosetting resin composition formed on the fibrous base layer at the encapsulating resin layer side. The thickness Ta of the cured material layer A is 0.5 ?m or more. The ratio Ta/Tb of the thickness Ta of the cured material layer A and the thickness Tb of the cured material layer B is in a range of 0.1 to 10.

Abstract: An ultrasonic transducer element chip includes a substrate, a plurality of ultrasonic transducer elements and a plate-shaped member. The substrate includes a partition wall section defining a plurality of openings arranged in an array pattern. A wall thickness of the partition wall section is smaller than a wall height of partition wall section. Each of the ultrasonic transducer elements is provided in each of the openings. The plate-shaped member is fixed on a surface of the substrate opposite to a surface of the substrate on which the ultrasonic transducer elements are provided. The plate-shaped member covers at least one of the openings in a plan view seen along a thickness direction of the substrate.

Abstract: A piezoelectric element is provided with three electrodes, namely a first electrode, a second electrode, and a third electrode, arranged linearly on one side surface of a piezoelectric body at regular intervals. A polarization processing electric field is applied between the first electrode and the second electrode, and then the polarization processing electric field is applied between the second electrode and the third electrode. The polarization processing electrode field on this occasion is a half as strong as in the case of performing the polarization process of applying the electric field at a time between the first electrode and the third electrode.

Abstract: An ultrasonic transducer includes a substrate, a supporting film disposed on the substrate, and a piezoelectric element disposed on the supporting film. The substrate includes an opening. The piezoelectric element is disposed on an area that overlaps the opening in a plan view in a thickness direction of the substrate. A thickness of the supporting film at an area that overlaps the piezoelectric element in a plan view of the supporting film is smaller than a thickness of the supporting film at a different area different from the area that overlaps the piezoelectric element.

Abstract: An ultrasonic transducer element chip includes a substrate defining an opening, an ultrasonic transducer element disposed at a position corresponding to the opening in a thickness direction of the substrate, and a reinforcing member connected to the substrate to cover the opening. The reinforcing member defines a ventilation passage from the opening to an outside of the substrate.

Abstract: A piezoelectric device includes: an elastic layer that forms an insulating surface region at least partially and has an amorphous structure or random orientation at least in the surface region; a piezoelectric body that is provided on the elastic layer, has a first surface in contact with the elastic layer and a second surface on an opposite side to the first surface, and is preferentially oriented in an orientation region corresponding to the surface region in a plan view; a first electrode provided on the second surface of the piezoelectric body; and a second electrode that is provided on the second surface of the piezoelectric body. A gap is formed between the first and second electrodes corresponding to the orientation region in the plan view.

Abstract: A piezoelectric device includes: a piezoelectric film having a first surface in contact with a vibrating film and a second surface on the opposite side to the first surface; first and second electrodes that are provided on the second surface of the piezoelectric film and that are disposed at positions away from each other and are short-circuited to each other at a position away from the piezoelectric film; and a third electrode that is provided between the first and second electrodes on the second surface of the piezoelectric film and is disposed at a position away from the first and second electrodes. At least parts of the contours of end portions of the first and second electrodes are defined in parallel to side portions of the third electrode.

Abstract: An ultrasonic transducer device includes a substrate on which a plurality of openings are arranged; a plurality of ultrasonic transducer elements, each of the ultrasonic transducer elements being provided to each of the openings of the plurality of openings, on a first surface of the substrate; and a member fixed to a second surface of the substrate, which is a surface on the opposite side of the first surface of the substrate. Provided to the member are a plurality of first groove sections, and a second groove section for bundling together the plurality of the first groove sections.

Abstract: An ultrasonic transducer device includes a substrate on which a plurality of openings are arranged; a plurality of ultrasonic transducer elements, each of the ultrasonic transducer elements being provided to each of the openings of the plurality of openings, on a first surface of the substrate; and a member fixed to a second surface of the substrate, which is a surface on the opposite side of the first surface of the substrate. Provided to the member are a plurality of first groove sections, and a second groove section for bundling together the plurality of the first groove sections.

Abstract: A biological testing device includes a main unit including an ultrasonic wave transmitting/receiving part, and an attaching member for attaching the main unit on a tested object. The ultrasonic wave transmitting/receiving part includes a sensor array substrate including ultrasonic transducers, first and second resin material parts, and an ultrasonic wave transmitting medium. The first resin material part forms a first space closed off from an outside space between the first resin material part and the sensor array substrate with the first resin material part facing the ultrasonic transducers. The second resin material part forms a second space communicating with the first space. The second space is closed off from the outside space, at least a portion of the second resin material part including a flexible portion configured and arranged to bulge toward the outside space. The ultrasonic wave transmitting medium fills the first space and the second space.

Abstract: An ultrasonic probe includes an ultrasonic transducer, a liquid filled section filled with a liquid, a contact section, and a flexible section. The contact section includes a deformable resin material, is positioned outside the ultrasonic transducer, and forms a portion of the liquid filled section. The flexible section includes the deformable resin material and forms a portion of the liquid filled section. The ultrasonic transducer is configured to transmit ultrasonic waves through the contact section.

Abstract: An ultrasonic probe includes a substrate, a diaphragm, a thin-film piezoelectric element, a communication passage, and an air hole. The substrate has first and second cavities thereon. The diaphragm is configured at the first cavity. The thin-film piezoelectric element is configured to the diaphragms. The communicating passage is configured in the substrate and extending from the first cavity to the second cavity. The air hole extends between the communicating passage to an outside of the substrate.

Abstract: The present invention provides an encapsulant with a base for use in semiconductor encapsulation, for collectively encapsulating a device mounting surface of a substrate on which semiconductor devices are mounted, or a device forming surface of a wafer on which semiconductor devices are formed, the encapsulant comprising the base, an encapsulating resin layer composed of an uncured or semi-cured thermosetting resin formed on one surface of the base, and a surface resin layer formed on the other surface of the base. The encapsulant enables a semiconductor apparatus having a good appearance and laser marking property to be manufactured.

Abstract: In an embodiment, a capacitor body 11 of the multilayer ceramic capacitor 10 has protective parts 11a made of ceramics, capacitance-forming parts 11b comprising multiple internal electrode layers 11b1 stacked together with ceramic layers 11b2 placed in between, and a non-capacitance-forming part 11c made of ceramics, in the order of “protective part 11a—capacitance-forming part 11b—non-capacitance-forming part 11c—capacitance-forming part 11b—protective part 11a” from one side to the other side along the laminating direction, and T2 representing the thickness of each protective part 11a in the laminating direction, T3 representing the thickness of each capacitance-forming part 11b in the laminating direction, and T4 representing the thickness of the non-capacitance-forming part 11c in the laminating direction, satisfy the relationship of “T2<T3?T4.

Abstract: An electronic device is provided with a housing, a piezoelectric element, and a panel, which is attached to the housing and has a contact area contacting a part of human body, configured to vibrate by the piezoelectric element to generate a vibration sound to be transmitted by vibrating the part of human body, such that pressure from inside of the housing at the contact area of the panel is smaller than pressure from inside of the housing at different area from the contact area. Thereby the sound pressure property is improved, and thus the electronic device preferably transmits air conduction sound and vibration sound.

Abstract: An ultrasonic transducer includes a first flexible substrate, a plurality of ultrasonic elements and a substrate deforming part. The ultrasonic elements are disposed on the first flexible substrate, and configured and arranged to transmit and receive ultrasonic waves. The substrate deforming part is configured and arranged to flex the first flexible substrate in a first direction and in a second direction that intersects with the first direction.

Abstract: A ceramic electronic component includes external electrodes having a multi-layer structure including an intermediate conductive resin layer, wherein the intermediate conductive resin layer in the external electrode is made of epoxy resin containing conductive filler, and the intermediate conductive resin layer meets both the condition B/A?0.47 and condition C/A?0.39 (A, B and C represent the maximum spectral intensities obtained based on the relationship line of the wave number and spectral intensity of the intermediate conductive resin layer as obtained by the ATR method). The ceramic electronic component minimizes separation that could occur at the interface between such intermediate conductive resin layer and a metal layer.

Abstract: A method for manufacturing a semiconductor-apparatus, including an encapsulating step of a device mounting surface of a substrate having semiconductor-devices mounted thereon with a base-attached encapsulant having a base and a thermosetting resin layer formed on one surface of the base, the semiconductor-devices being mounted by flip-chip bonding, the encapsulating step including a unifying stage of the substrate having the semiconductor-devices mounted thereon and the base-attached encapsulant under a reduced pressure condition with a vacuum of 10 kPa or less and a pressing stage of the unified substrate with a pressure of 0.2 MPa or more.