Patents by Inventor Tomoyuki Yamada

Tomoyuki Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9824981
    Abstract: A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element region, an insulating layer provided between the moisture-resistant frame and an outer peripheral edge of the semiconductor device and on the semiconductor substrate, a first metal line extending along the outer peripheral edge and provided in the insulating layer, and a groove provided in the insulating layer.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: November 21, 2017
    Assignee: SOCIONEXT INC.
    Inventors: Tomoyuki Yamada, Fumio Ushida, Shigetoshi Takeda, Tomoharu Awaya, Koji Banno, Takayoshi Minami
  • Patent number: 9698037
    Abstract: A substrate processing apparatus includes a holder configured to hold a substrate and carry the substrate into a process chamber, a waiting station located outside the process chamber in which the holder waits prior to carrying the substrate into the process chamber, a circulation path configured to circulate a gas throughout the waiting station, and an exhaust path formed in the circulation path and configured to exhaust the gas from the waiting station.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: July 4, 2017
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Seiyo Nakashima, Yuichi Matsuda, Takashi Nogami, Shinobu Sugiura, Tomoyuki Yamada
  • Patent number: 9548090
    Abstract: Characteristics of each transistor in a semiconductor device including a transistor of a memory cell are measured by an ASV monitoring circuit, a power supply voltage supplied to the semiconductor device is determined based on the measured characteristics of the transistor, a data read-out speed of the memory cell under the determined power supply voltage supplied is measured while changing a signal level of a word line by an SRAM word line monitoring circuit, the signal level of the word line is determined by comparing the measured data read-out speed of the memory cell and a specification range of the memory cell, and the signal level of the word line is appropriately set at the power supply voltage applied by the ASV.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: January 17, 2017
    Assignee: SOCIONEXT, INC.
    Inventors: Morimi Arita, Tomoya Tsuruta, Tomoyuki Yamada
  • Publication number: 20170012004
    Abstract: A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element region, an insulating layer provided between the moisture-resistant frame and an outer peripheral edge of the semiconductor device and on the semiconductor substrate, a first metal line extending along the outer peripheral edge and provided in the insulating layer, and a groove provided in the insulating layer.
    Type: Application
    Filed: September 23, 2016
    Publication date: January 12, 2017
    Inventors: Tomoyuki Yamada, Fumio Ushida, Shigetoshi Takeda, Tomoharu Awaya, Koji Banno, Takayoshi Minami
  • Publication number: 20160225421
    Abstract: Characteristics of each transistor in a semiconductor device including a transistor of a memory cell are measured by an ASV monitoring circuit, a power supply voltage supplied to the semiconductor device is determined based on the measured characteristics of the transistor, a data read-out speed of the memory cell under the determined power supply voltage supplied is measured while changing a signal level of a word line by an SRAM word line monitoring circuit, the signal level of the word line is determined by comparing the measured data read-out speed of the memory cell and a specification range of the memory cell, and the signal level of the word line is appropriately set at the power supply voltage applied by the ASV.
    Type: Application
    Filed: December 30, 2015
    Publication date: August 4, 2016
    Inventors: Morimi Arita, Tomoya Tsuruta, Tomoyuki Yamada
  • Publication number: 20160211229
    Abstract: A multi-layer substrate with metal layers as a moisture diffusion barrier for reduced electrical performance degradation over time after moisture exposure and methods of design and manufacture. The method includes determining a diffusion rate of an insulator material provided between an upper metal layer and an underlying signal line. The method further includes calculating a diffusion distance between a plane opening of the upper metal layer and the underlying signal line using the diffusion rate of the insulator material.
    Type: Application
    Filed: March 14, 2016
    Publication date: July 21, 2016
    Applicant: Kyocera Circuit Solutions Inc.
    Inventors: Jean AUDET, Edmund D. BLACKSHEAR, Masahiro FUKUI, Charles L. REYNOLDS, Kenji TERADA, Tomoyuki YAMADA
  • Publication number: 20160210398
    Abstract: A multi-layer substrate with metal layers as a moisture diffusion barrier for reduced electrical performance degradation over time after moisture exposure and methods of design and manufacture. The method includes determining a diffusion rate of an insulator material provided between an upper metal layer and an underlying signal line. The method further includes calculating a diffusion distance between a plane opening of the upper metal layer and the underlying signal line using the diffusion rate of the insulator material.
    Type: Application
    Filed: March 14, 2016
    Publication date: July 21, 2016
    Applicant: Kyocera Circuit Solutions Inc.
    Inventors: Jean AUDET, Edmund D. BLACKSHEAR, Masahiro FUKUI, Charles L. REYNOLDS, Kenji TERADA, Tomoyuki YAMADA
  • Publication number: 20160211481
    Abstract: A multi-layer substrate with metal layers as a moisture diffusion barrier for reduced electrical performance degradation over time after moisture exposure and methods of design and manufacture. The method includes determining a diffusion rate of an insulator material provided between an upper metal layer and an underlying signal line. The method further includes calculating a diffusion distance between a plane opening of the upper metal layer and the underlying signal line using the diffusion rate of the insulator material.
    Type: Application
    Filed: January 15, 2015
    Publication date: July 21, 2016
    Applicant: KYOCERA CIRCUIT SOLUTIONS INC.
    Inventors: Jean AUDET, Edmund D. BLACKSHEAR, Masahiro FUKUI, Charles L. REYNOLDS, Kenji TERADA, Tomoyuki YAMADA
  • Patent number: 9390810
    Abstract: In an OTP memory storing a one-bit of the data by two gate insulating film destruction type nonvolatile memory cells where a same bit line is connected and different word lines are connected, writings and readings of the data for selected two nonvolatile memory cells constituting one-bit are performed by simultaneously selecting the selected two nonvolatile memory cells, and verifications for the selected two nonvolatile memory cells are performed by individually selecting one and the other of the selected two nonvolatile memory cells one by one.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: July 12, 2016
    Assignee: SOCIONEXT INC.
    Inventor: Tomoyuki Yamada
  • Publication number: 20160086677
    Abstract: In an OTP memory storing a one-bit of the data by two gate insulating film destruction type nonvolatile memory cells where a same bit line is connected and different word lines are connected, writings and readings of the data for selected two nonvolatile memory cells constituting one-bit are performed by simultaneously selecting the selected two nonvolatile memory cells, and verifications for the selected two nonvolatile memory cells are performed by individually selecting one and the other of the selected two nonvolatile memory cells one by one.
    Type: Application
    Filed: September 11, 2015
    Publication date: March 24, 2016
    Inventor: Tomoyuki YAMADA
  • Patent number: 9276652
    Abstract: A wireless communication system includes a first wireless station including antenna elements, transmission units corresponding to the antenna elements, and a transmission directivity control unit that controls transmission directivity of the antenna elements, and second wireless stations each including a reception power measurement unit that measures a reception power. The transmission directivity control unit determines the transmission directivity of each of the antenna elements so that a signal does not reach a particular second wireless station among the second wireless stations. The transmission units generate wireless signals using the transmission directivity. The antenna elements transmit the generated wireless signals.
    Type: Grant
    Filed: November 15, 2011
    Date of Patent: March 1, 2016
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Riichi Kudo, Munehiro Matsui, Tomoki Murakami, Takeo Ichikawa, Yusuke Asai, Koichi Ishihara, Tomoyuki Yamada, Masato Mizoguchi
  • Publication number: 20150311164
    Abstract: A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element region, an insulating layer provided between the moisture-resistant frame and an outer peripheral edge of the semiconductor device and on the semiconductor substrate, a first metal line extending along the outer peripheral edge and provided in the insulating layer, and a groove provided in the insulating layer.
    Type: Application
    Filed: July 7, 2015
    Publication date: October 29, 2015
    Applicant: FUJITSU SEMICONDUCTOR LIMITED
    Inventors: Tomoyuki Yamada, Fumio Ushida, Shigetoshi Takeda, Tomoharu Awaya, Koji Banno, Takayoshi Minami
  • Patent number: 8981401
    Abstract: The present invention is a package for optical semiconductor devices, and an optical semiconductor device using the package, which can prevent discoloration of a plating layer formed on a lead frame even when a silicone resin is used as a sealing resin for an optical semiconductor device, and which enables high luminous efficiency for a long time. Specifically, in the package for semiconductor devices, a plating laminate 15, wherein a pure Ag plating layer 4, a thin reflective plating layer 6 serving as the uppermost layer for improving the light reflection ratio, and a resistant plating layer 5 serving as an intermediate layer therebetween and having chemical resistance against at least either metal chlorides or metal sulfides are laminated, is formed on at least the surface of a lead electrode. The reflective plating layer 4 is composed of a pure Ag thin film, and the resistant plating layer 5 is composed of a complete solid solution Au—Ag alloy plating layer.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: March 17, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Tomoyuki Yamada, Tomohiro Futagami
  • Patent number: 8891555
    Abstract: A spatial multiplexing wireless transmission system is formed by a base station, and by a plurality of terminal stations that are provided with a plurality of antennas. The base station is provided with an information signal generating portion, a control signal generating portion, a transmission frame generating portion, a multiple beamforming portion, a transmission/reception switching portion, a reception signal processing portion, a propagation environment estimating portion, and an antenna information generating portion. At least one of the terminal stations is provided with a transmission/reception switching portion, a reception signal processing portion, a decoding portion, an antenna information extracting portion, an antenna information generating portion, an transmitting portion, a battery, a remaining battery detecting portion, a transmission request extracting portion, and a propagation environment estimating portion.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: November 18, 2014
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Koichi Ishihara, Yasushi Takatori, Yusuke Asai, Riichi Kudo, Wenjie Jiang, Tomoyuki Yamada, Masato Mizoguchi
  • Patent number: 8541871
    Abstract: A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such as copper thin plate in this order, and further applying silver plating (105) selectively to part of an inner part that is to be enclosed with a package of the semiconductor device. The lead frame (100) may also include a base of the package. The silver plating contributes to an excellent light reflectance and wire bonding efficiency of the inner part, whereas the gold flash plating contributes to an excellent resistance to corrosion and soldering efficiency of an outer part that is outside the package.
    Type: Grant
    Filed: March 3, 2010
    Date of Patent: September 24, 2013
    Assignee: Panasonic Corporation
    Inventors: Hidekazu Tomohiro, Masayuki Fujii, Norio Satou, Tomoyuki Yamada, Tomio Kusano
  • Publication number: 20130208619
    Abstract: Communication quality is prevented from being deteriorated due to interference caused by low accuracy of channel information or interference from another base station or another wireless communication system. A wireless communication system includes a first wireless station including a plurality of antenna elements, transmission units corresponding to the plurality of antenna elements, and a transmission directivity control unit that controls transmission directivity of the plurality of antenna elements, and a plurality of second wireless stations each including a reception power measurement unit that measures a reception power. The transmission directivity control unit determines the transmission directivity of each of the plurality of antenna elements so that a signal does not reach a particular second wireless station among the plurality of second wireless stations. The transmission units generate wireless signals using the transmission directivity.
    Type: Application
    Filed: November 15, 2011
    Publication date: August 15, 2013
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Riichi Kudo, Munehiro Matsui, Tomoki Murakami, Takeo Ichikawa, Yusuke Asai, Koichi Ishihara, Tomoyuki Yamada, Masato Mizoguchi
  • Patent number: 8475310
    Abstract: In a friction transmission belt in which a compression rubber layer provided to an inner circumferential side of the belt body is wrapped over pulleys such that the compression rubber layer contacts the pulleys, such a configuration that both of a noise reduction and durability while the belt is running can be achieved is obtained. The compression rubber layer is configured so as not to include short fibers and so as to have a surface roughness, i.e., an Ra of at least a pulley contact surface of the compression rubber layer equal to or more than 3 ?m.
    Type: Grant
    Filed: January 23, 2009
    Date of Patent: July 2, 2013
    Assignee: Bando Chemical Industries, Ltd.
    Inventors: Hiroyuki Shiriike, Tomoyuki Yamada, Hiroyuki Tachibana, Fumihiro Mukai
  • Patent number: 8459202
    Abstract: A gas flow of a gas pipe is indicated before an electromagnetic valve is actually opened, so that the electromagnetic valve can be prevented from being opened or closed by a wrong manipulation or hazards caused by undesired mixing of gases can be avoided so as to improve safety. The substrate processing apparatus includes a state detection unit configured to detect an opening/closing request state and an opening/closing state of a valve installed at a gas pipeline; and a indication unit configured to indicate a gas flow state of the gas pipeline predicted according to the opening/closing request state and a gas flow state of the gas pipeline when the valve is opened, in a way that each state is distinguished.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: June 11, 2013
    Assignee: Hitachi Kokusai Electronics Inc.
    Inventors: Tomoyuki Yamada, Mamoru Oishi, Kanako Kitayama
  • Patent number: 8423937
    Abstract: A design support program stored in a recording medium readable by a computer includes acquiring a first analysis result including information about an area included in circuit information of a design target circuit and a second analysis result relating to a path of the circuit information, the temperature of the area being equal to or higher than a certain temperature; determining an arbitrary cell on a non-critical path from among cells arranged in the area as a target cell for decreasing the area temperature; and outputting a result of the determination.
    Type: Grant
    Filed: August 3, 2010
    Date of Patent: April 16, 2013
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Toshio Hino, Tsuyoshi Sakata, Tomoyuki Yamada
  • Publication number: 20130085028
    Abstract: An object of the present invention is to provide an environmentally-friendly transmission belt. Provided is a transmission belt formed of a crosslinked rubber, wherein 80% by mass or more of the transmission belt comprises non-petroleum resources, and a base rubber of the crosslinked rubber is a natural rubber.
    Type: Application
    Filed: May 17, 2011
    Publication date: April 4, 2013
    Applicant: BANDO CHEMICAL INDUSTRIES, LTD.
    Inventors: Tomoyuki Yamada, Hiroyuki Tachibana, Tomonari Nakamura, Tadahiko Noguchi