Abstract: A gas flow of a gas pipe is indicated before an electromagnetic valve is actually opened, so that the electromagnetic valve can be prevented from being opened or closed by a wrong manipulation or hazards caused by undesired mixing of gases can be avoided so as to improve safety. The substrate processing apparatus includes a state detection unit configured to detect an opening/closing request state and an opening/closing state of a valve installed at a gas pipeline; and a indication unit configured to indicate a gas flow state of the gas pipeline predicted according to the opening/closing request state and a gas flow state of the gas pipeline when the valve is opened, in a way that each state is distinguished.

Abstract: A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such as copper thin plate in this order, and further applying silver plating (105) selectively to part of an inner part that is to be enclosed with a package of the semiconductor device. The lead frame (100) may also include a base of the package. The silver plating contributes to an excellent light reflectance and wire bonding efficiency of the inner part, whereas the gold flash plating contributes to an excellent resistance to corrosion and soldering efficiency of an outer part that is outside the package.

Abstract: Two AWG circuits are integrated while preventing degradation in quality of a multiplexing/demultiplexing function. An arrayed waveguide grating circuit includes: a first slab waveguide (52) connected to a first input waveguide (51a) and second output waveguides (55b); a second slab waveguide (54) connected to first output waveguides (55a) and a second input waveguide (51b); and an array waveguide (53) connecting the first slab waveguide (52) and the second slab waveguide (54), wherein the input waveguides (51a, 51b) are connected to the slab waveguides (52, 54) at an interval of 1.5× from the outermost second output waveguide out of the second output waveguides (55a, 55b) connected at an interval x depending on a wavelength.

Abstract: A jig for Kelvin Test includes a first probe and a second probe which are arranged in parallel in a socket comprised of insulating material. Probes include a conductive tube and a conductive plunger, contained in at least one end side of the tube, and having a distal end part protruding axially outward from the tube. The tube contains a coil spring adapted to elastically urge the plunger outward. The first probe is used for supplying electric current to a terminal of an electronic component to be tested. The second probe is used for monitoring electric voltage of the terminal. A first cross section of the tube of the first probe which is perpendicular to the axial direction is greater than a second cross section of the tube of the second probe which is perpendicular to the axial direction. The plunger is brought into elastic contact with the terminal.

Abstract: In a substrate processing apparatus, a process vessel is configured to accommodate and process a substrate held at a horizontal position. A gas introduction port is installed at a periphery of a first side of the process vessel and configured to introduce gas into the process vessel from a lateral direction of the substrate. A gas exhaust port is installed at a second side of the process vessel which is opposite to the first side, and is configured to exhaust gas inside the process vessel from a lateral direction of the substrate. A slope part is installed between the gas introduction port and the gas exhaust port inside the process vessel, and is configured to guide a flow path of the gas introduced into the process vessel.

Abstract: Provided is a substrate processing apparatus which is capable of detecting malfunction of mechanisms installed inside MFC. An inert gas supply line (308) for supplying an inert gas, a first shut-off valve (300) for shutting off the supply of the inert gas, a process gas supply line (310) for supplying a process gas, and a second shut-off valve (302) for shutting off the supply of the process gas are installed at the upstream side of the MFC (241). A gas supply pipe (232) connected to a process chamber (210), a third shut-off valve (304) for shutting off the supply of gas to the gas supply pipe (232), an exhaust vent line (318) which is exhaustible, a fourth shut-off valve (306) for shutting off the supply of gas to the exhaust vent line (318) are installed at the downstream side of the MFC (241).

Abstract: A simulation method to be implemented in a computer causes the computer to execute a procedure carrying out a weighting with respect to layout parameters of a circuit, which is an analyzing target, based on priority information of cells forming the circuit, and converting the weighted layout parameters into physical characteristics and storing the physical characteristics in a memory part, a procedure converting the physical characteristic read from the memory part into circuit parameters and storing the circuit parameters into the memory part, and analyzing the circuit based on a net list including the circuit parameters read from the memory part.

Abstract: An apparatus, method, etc. that in designing of the base sequence of, for example, siRNA, realize high-speed retrieval any genes containing analogous base sequences without omission. Accordingly, retrieval is carried out in such a manner that two partial sequences of given length and any extra part are identified from inputted base sequences, and that hamming distance being the number of corresponding bases incompatible with each other is divided and assigned to the partial sequences and extra part and out of the two partial sequences, one with an assigned number not greater is selected and retrieved.

Abstract: Disclosed is a milling and classifying apparatus, adapted to produce toner fine particles, comprising a collision mill, and an air classifier, wherein the collision mill comprises a jet nozzle room, a path, a collision plate, and a collision member mounted to a support of the collision plate at downstream of the collision plate, the air classifier comprises a dispersion room and a classification room, the classification room is disposed below the dispersion room, and a flow stabilizer is arranged at a central suction of the separator core to control swirl stream generated within the classification room so as to centrifuge the powder into coarse particles and fine particles by action of the swirl stream.

Abstract: A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element region, an insulating layer provided between the moisture-resistant frame and an outer peripheral edge of the semiconductor device and on the semiconductor substrate, a first metal line extending along the outer peripheral edge and provided in the insulating layer, and a groove provided in the insulating layer.

Abstract: By reducing the number of PD arrays, and by simplifying the configuration of an optical power monitor in a WDM system, a miniaturized, cost reduced optical signal monitoring apparatus, optical system or optical signal monitoring method is provided. An optical power monitor 1 has an optical switch 30 having four input ports 31, a DMUX 2 having 48 output ports, and six CSP type PD array modules 50 each including an 8-channel PD array. The output port 32 of the optical switch 30 having four switchable input ports 31 is optically connected to the input port 21 of the AWG 20. The 48 output ports 22 of the AWG 20 are each optically connected to photosensitive surfaces 53 of the individual PDs included in the CSP type PD array modules 50. The CSP type PD array modules 50 are mounted on the end face of the AWG 20.

Abstract: An object of the present invention is to improve substrate processing efficiency. A substrate processing apparatus has a reaction tube that processes a substrate inside, and a heating apparatus disposed so as to surround an external periphery of the reaction tube, so that at least a gas inlet tube is disposed on a side surface in an area in which the substrate is processed inside the reaction tube, and the heating apparatus has a heat insulator that surrounds the reaction tube, an inlet opening formed in the shape of a groove in the heat insulator from the lower end of the heating apparatus so as to avoid the gas inlet tube, and a heating element disposed between the heat insulator and the reaction tube.

Abstract: There is provided a lead frame for an optical semiconductor device, an optical semiconductor device using such lead frame, and a manufacturing method for these, where the optical semiconductor device exhibits favorable brightness over a long period of time by preventing discoloration and degeneration of a plating layer provide on the lead frame and a resulting reduction in a reflection coefficient for light emitted from a light emitting element, even when using silicone resin as a sealing resin. An Ag—Au alloy plating layer 22 is formed on the surface of a pure Ag plating layer 21 on a lead frame 10 sealed chloroplatinic acid-containing silicon resin, so as to prevent direct contact between the layer 21 and the silicone resin. This suppresses the formation of AgCl due to a reaction with a hardening catalyst of the silicon resin, thereby preventing the Ag plating layer from turning a blackish-brown color.

Abstract: There is provided a layout verification method including a space acquisition step of, with a wiring connected to a gate through a via as a target wiring, acquiring a space between the target wiring and a wiring adjacent thereto, a calculation step of calculating an antenna ratio according to the space between the target wiring and the adjacent wiring, the area of the gate, and the area of the target wiring, and an output step of outputting an antenna damage error when the antenna ratio exceeds a predetermined value.

Abstract: A jig for Kelvin Test, includes: a pair of probes, including a first probe and a second probe which are arranged in parallel in a socket comprised of insulating material, each probe including: an conductive tube; an conductive plunger, contained in at least one end side of the tube, and having a distal end part protruding outward from the tube in an axial direction of the tube, the plunger adapted to be brought into elastic contact with a terminal of an electronic component to be tested, and a coil spring, contained in the tube, and adapted to elastically urge the plunger outward. The first probe is used for supplying electric current to the terminal. The second probe is used for monitoring electric voltage of the terminal. A first cross section of the tube of the first probe which is perpendicular to the axial direction is greater than a second cross section of the tube of the second probe which is perpendicular to the axial direction.

Abstract: It is intended to efficiently determine a base sequence specifically appearing in an expression gene. For this, providing that the expression gene consists of exons (301) . . . (306) and especially that exon (301) is united with exon (302) and exon (302) with exon (303), an aggregate of base sequences (401) (403) being a union of exon base sequences (301) . . . (305) and a boundary base sequence obtained by uniting together base sequences (404) and (405) and base sequences (406) and (407) respectively existing over boundaries between exon (301) and exon (302) and between exon (302) and exon (303) is formed, and the aggregate is searched. If a base sequence is one specifically appearing in the expression gene, the number of search results is 1 and otherwise, the number is plural.

Abstract: A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such as copper thin plate in this order, and further applying silver plating (105) selectively to part of an inner part that is to be enclosed with a package of the semiconductor device. The lead frame (100) may also include a base of the package. The silver plating contributes to an excellent light reflectance and wire bonding efficiency of the inner part, whereas the gold flash plating contributes to an excellent resistance to corrosion and soldering efficiency of an outer part that is outside the package.

Abstract: There is provided a layout verification method including a space acquisition step of, with a wiring connected to a gate through a via as a target wiring, acquiring a space between the target wiring and a wiring adjacent thereto, a calculation step of calculating an antenna ratio according to the space between the target wiring and the adjacent wiring, the area of the gate, and the area of the target wiring, and an output step of outputting an antenna damage error when the antenna ratio exceeds a predetermined value.

Abstract: Disclosed is a milling and classifying apparatus, adapted to produce toner fine particles, comprising a collision mill, and an air classifier, wherein the collision mill comprises a jet nozzle room, a path, a collision plate, and a collision member mounted to a support of the collision plate at downstream of the collision plate, the air classifier comprises a dispersion room and a classification room, the classification room is disposed below the dispersion room, and a flow stabilizer is arranged at a central suction of the separator core to control swirl stream generated within the classification room so as to centrifuge the powder into coarse particles and fine particles by action of the swirl stream.

Abstract: It is intended to support a unique design of a primer. To calculate an indication showing the occurrence frequency of a sequence in a genome sequence, the occurrence frequencies of partial sequences having a definite length in the genome sequences are calculated. Then the occurrence of frequency of each partial sequence of the definite length is stored in an incidence/isolation degree table (16). Concerning each partial sequence of the definite length, a degree of isolation i, which means that j mutation indicating the conversion of j bases (j=<i?1) does not occur in the genome sequence but i mutation indicating the conversion of i bases occurs in the genome sequence, is calculated. Then the degrees of isolation of the partial sequences of the definite length are stored in the incidence/isolation degree table (16).