Abstract: A system for refresh operations including multiple refresh activations, and a method and an apparatus therefore, are described. The system includes, for example, a memory array; a command address input circuit configured to provide a command for a per bank refresh operation or an all-bank refresh operation, a command control circuit configured to receive the command, and provide first and second internal control signals; a refresh control circuit configured to provide a first refresh control signal; and a row control circuit configured to provide a second refresh control signal. The provided first internal control signal is based on the provided command. For the per bank refresh operation, the provided second internal control signal is based on the second refresh control signal, and, for the all-bank refresh operation, the provided second internal control signal is based on the first internal control signal delayed by the command control circuit.

Abstract: Apparatuses and methods of for refresh control of a semiconductor device are described. An example apparatus includes a command control circuit that provides a plurality of pulses on a first control signal in series responsive to a plurality of refresh commands issued in series; a signal generation circuit that produces a plurality of pulses on a second control signal in sequence; and a refresh control circuit that receives two or more of the plurality of pulses on the first control signal during a period of time between one pulse and a succeeding pulse of the plurality of pulses on the second control signal, disables refresh operations responsive to at least one of the two or more of the plurality of first control signal and executes a refresh operation responsive to remaining one or more pulses of the two or more of the plurality of pulses on the first control signal.

Abstract: A device includes a plurality of memory cells, an error detection circuit configured to detect at least one memory cell storing error data and a refresh control circuit including a register configured to store an error address corresponding to the at least one memory cell storing error data. The refresh control circuit is configured to control a refresh cycle of the error address.

Abstract: Apparatuses and methods of for refresh control of a semiconductor device are described. An example apparatus includes a command control circuit that provides a plurality of pulses on a first control signal in series responsive to a plurality of refresh commands issued in series; a signal generation circuit that produces a plurality of pulses on a second control signal in sequence; and a refresh control circuit that receives two or more of the plurality of pulses on the first control signal during a period of time between one pulse and a succeeding pulse of the plurality of pulses on the second control signal, disables refresh operations responsive to at least one of the two or more of the plurality of first control signal and executes a refresh operation responsive to remaining one or more pulses of the two or more of the plurality of pulses on the first control signal.

Abstract: Apparatuses for error detection and correction for a semiconductor device are described. An example apparatus includes: at least one memory cell array including a plurality of memory cells; and a control circuit that receives read data from the plurality of memory cells, compares the read data with reference data, and further provides an error signal. The control circuit further provides the error signal when a number of bit errors detected is greater than or equal to a predetermined number, and suppresses providing the error signal when the number of bit errors detected is less than the predetermined number.

Abstract: A device includes a plurality of memory cells, an error detection circuit configured to detect at least one memory cell storing error data and a refresh control circuit including a register configured to store an error address corresponding to the at least one memory cell storing error data. The refresh control circuit is configured to control a refresh cycle of the error address.

Abstract: Apparatuses and methods of for refresh control of a semiconductor device are described. An example apparatus includes a command control circuit that provides a plurality of pulses on a first control signal in series responsive to a plurality of refresh commands issued in series; a signal generation circuit that produces a plurality of pulses on a second control signal in sequence; and a refresh control circuit that receives two or more of the plurality of pulses on the first control signal during a period of time between one pulse and a succeeding pulse of the plurality of pulses on the second control signal, disables refresh operations responsive to at least one of the two or more of the plurality of first control signal and executes a refresh operation responsive to remaining one or more pulses of the two or more of the plurality of pulses on the first control signal.

Abstract: A winding-start receiving groove in which a winding-start lead wire of a field coil is received is formed in an inner surface of a flange of an insulation bobbin. A holder is disposed on the flange and located on a radially outer side of the winding-start receiving groove. The holder is formed with a holder groove located on an extension line of the winding-start receiving groove and extending at an angle relative to a radial direction of the insulation bobbin. The winding-start lead wire of the field coil is received in the winding-start receiving groove and the holder groove and held by the holder. This makes it possible to obtain a rotor of a rotary electrical machine with a simplified configuration at low cost not only to improve winding workability but also to enhance electrical reliability and durability.

Abstract: Apparatuses and methods of for refresh control of a semiconductor device are described. An example apparatus includes a command control circuit that provides a plurality of pulses on a first control signal in series responsive to a plurality of refresh commands issued in series; a signal generation circuit that produces a plurality of pulses on a second control signal in sequence; and a refresh control circuit that receives two or more of the plurality of pulses on the first control signal during a period of time between one pulse and a succeeding pulse of the plurality of pulses on the second control signal, disables refresh operations responsive to at least one of the two or more of the plurality of first control signal and executes a refresh operation responsive to remaining one or more pulses of the two or more of the plurality of pulses on the first control signal.

Abstract: Apparatuses and methods of for refresh control of a semiconductor device are described. An example apparatus includes a command control circuit that provides a plurality of pulses on a first control signal in series responsive to a plurality of refresh commands issued in series; a signal generation circuit that produces a plurality of pulses on a second control signal in sequence; and a refresh control circuit that receives two or more of the plurality of pulses on the first control signal during a period of time between one pulse and a succeeding pulse of the plurality of pulses on the second control signal, disables refresh operations responsive to at least one of the two or more of the plurality of first control signal and executes a refresh operation responsive to remaining one or more pulses of the two or more of the plurality of pulses on the first control signal.

Abstract: Apparatuses for error detection and correction for a semiconductor device are described. An example apparatus includes: at least one memory cell array including a plurality of memory cells; and a control circuit that receives read data from the plurality of memory cells, compares the read data with reference data, and further provides an error signal. The control circuit further provides the error signal when a number of bit errors detected is greater than or equal to a predetermined number, and suppresses providing the error signal when the number of bit errors detected is less than the predetermined number.

Abstract: Apparatuses for error detection and correction for a semiconductor device are described. An example apparatus includes: at least one memory cell array including a plurality of memory cells; and a control circuit that receives read data from the plurality of memory cells, compares the read data with reference data, and further provides an error signal. The control circuit further provides the error signal when a number of bit errors detected is greater than or equal to a predetermined number, and suppresses providing the error signal when the number of bit errors detected is less than the predetermined number.

Abstract: Apparatuses and methods of for refresh control of a semiconductor device are described. An example apparatus includes a command control circuit that provides a plurality of pulses on a first control signal in series responsive to a plurality of refresh commands issued in series; a signal generation circuit that produces a plurality of pulses on a second control signal in sequence; and a refresh control circuit that receives two or more of the plurality of pulses on the first control signal during a period of time between one pulse and a succeeding pulse of the plurality of pulses on the second control signal, disables refresh operations responsive to at least one of the two or more of the plurality of first control signal and executes a refresh operation responsive to remaining one or more pulses of the two or more of the plurality of pulses on the first control signal.

Abstract: Apparatuses for error detection and correction for a semiconductor device are described. An example apparatus includes: at least one memory cell array including a plurality of memory cells; and a control circuit that receives read data from the plurality of memory cells, compares the read data with reference data, and further provides an error signal. The control circuit further provides the error signal when a number of bit errors detected is greater than or equal to a predetermined number, and suppresses providing the error signal when the number of bit errors detected is less than the predetermined number.

Abstract: There is provided a rotor of a rotating electrical machine including a pair of field core bodies that are provided so as to enclose the field coil via the insulation bobbin around which the field coil is wound, in which a claw-shaped magnetic pole extending from an outer circumferential section of the field core body in an axial direction is provided on the field core body. The insulation bobbin has a plurality of flange sections extending from the base section of the claw-shaped magnetic pole along an inner surface of the claw-shaped magnetic pole of the field core body, and a plurality of thin portions are formed in the root section of the flange section at intervals in a circumferential direction.

Abstract: Disclosed is a sodium-ion secondary battery having excellent charge and discharge efficiencies as well as excellent charge and discharge characteristics, wherein charging and discharging can be repeated without causing problems such as deterioration in battery performance. Specifically disclosed is a sodium ion secondary battery which is provided with a positive electrode, a negative electrode having a negative electrode active material, and a nonaqueous electrolyte solution containing a nonaqueous solvent. The nonaqueous solvent is substantially composed of a saturated cyclic carbonate (excluding the use of ethylene carbonate by itself), or a mixed solvent of a saturated cyclic carbonate and a chain carbonate, and a hard carbon is used as the negative electrode active material.

Abstract: Disclosed herein is a device that includes an internal circuit, a first terminal supplied with a first voltage, a first power-supply line coupled between the first terminal and the internal circuit, a potential monitoring terminal, and a first switch coupled between the internal power-supply line and the potential monitoring terminal.

Abstract: Disclosed herein is a method for manufacturing a tested apparatus that includes forming a stacked structure that includes a plurality of first semiconductor chips stacked over a semiconductor wafer. The semiconductor wafer comprises a plurality of second semiconductor chips that are arranged in matrix of a plurality of rows and columns. Each of the first semiconductor chips is stacked over and electrically connected to a different one of the second semiconductor chips. The method further includes contacting a probe card to at least one of the first semiconductor chips to perform a first test operation on a corresponding one of the second semiconductor chips with an intervention of the at least one of the first semiconductor chips so that a plurality of tested apparatus each comprising a pair of first and second semiconductor chips stacked with each other is derived.

Abstract: A semiconductor device, includes an input buffer, first and second PMOS transistors serially interconnected between a first power supply node and an output node of the input buffer. First and second NMOS transistors are serially interconnected between a second power supply node and the output node of the input buffer. A replica circuit includes a third and fourth PMOS transistors serially interconnected between the first power supply node and an output node of the replica circuit. Third and fourth NMOS transistors are serially interconnected between the second power supply node and the output node of the replica circuit. The input node of the replica circuit is connected to the output node of the replica circuit and a comparison circuit compares a voltage at the output node of the replica circuit to a reference voltage.

Abstract: Disclosed herein is a semiconductor chip that includes: a plurality of penetration electrodes each penetrating between main and back surfaces of the semiconductor chip, the penetration electrodes including a plurality of first penetration electrodes, a second penetration electrode and a third penetration electrode; and a wiring configured to intersect with a plurality of regions, each of the regions being defined as a region between corresponding two of the first penetration electrodes, one end of the wiring being coupled to the second penetration electrode, the other end of the wiring being coupled to the third penetration electrode.