Abstract: A semiconductor laser module according to the present invention includes a polarization-synthesizing module having a polarization-synthesizing means configured to polarization synthesize two laser beams and a holder member for holding the polarization-synthesizing means with an approximately cylindrical circumferential surface, and a supporting member for supporting the holder member at least to rotate about an central axis and fixing the holder member at a predetermined position.

Abstract: A microcontroller includes a program memory configured to store a program group and a first encryption key; a CPU; and an identification (ID) storage section configured to store an identification data peculiar to a user of the microcontroller. The CPU executes the program group to generate a second encryption key based on the identification data and the first encryption key and to encrypt a random number with the second encryption key.

Abstract: The object of the invention is to secure straight travelability for a fastener during the driving of the latter, simplify the connecting fastener production process, simplify the cleaning of the work site, and prevent work-attending damage to the flooring. In a connecting fastener, kraft paper (5) in a combination band (2, 3) for holding a number of nails (2) is pasted to opposite surfaces of the nails (2), the kraft paper (5) having a plastic layer (6) that is formed with a plurality of grooves (7A, 7B) with a pitch smaller than the arrangement pitch of the nails (2), facilitating the separation of the nails (2).

Abstract: A semiconductor laser device having two active-layer stripe structures includes an n-InP substrate, an n-InP clad layer, a lower GRIN-SCH layer, an active layer, an upper GRIN-SCH layer, a p-InP clad layer, and a p-InGaAsP contact layer grown in this order, in a side cross section cut along one of the stripe structure. A high-reflection film is disposed on a reflection-side end surface, and a low-reflection film is disposed on an emission-side end surface. A p-side electrode is disposed on only a part of the upper surface of the p-InGaAsP contact layer so that a current non-injection area is formed on an area absent the p-side electrode.

Abstract: A semiconductor device has multiple power-supply through electrodes, grounding through electrodes, and signal-routing through electrodes made through a semiconductor chip. The power-supply through electrodes, the grounding through electrodes, and the signal-routing through electrodes differ mutually in cross-sectional area. Hence, a semiconductor device and a chip-stack semiconductor device are provided which are capable of preventing the electrodes' resistance from developing excessive voltage drop, heat, delay, and loss, and also from varying from one electrode to the other.

Abstract: A semiconductor device has multiple power-supply through electrodes, grounding through electrodes, and signal-routing through electrodes made through a semiconductor chip. The power-supply through electrodes, the grounding through electrodes, and the signal-routing through electrodes differ mutually in cross-sectional area. Hence, a semiconductor device and a chip-stack semiconductor device are provided which are capable of preventing the electrodes' resistance from developing excessive voltage drop, heat, delay, and loss, and also from varying from one electrode to the other.

Abstract: A method and apparatus for inspecting a plurality of optical modules, in which the optical modules are given channel numbers, a plurality of inspection items, which are related to optical characteristics and/or electrical characteristics of the optical modules, are measured in parallel, and measurement data on the inspection items is stored in storing device. This makes it possible to inspect the optical modules efficiently in a short time, eliminating waiting time.

Abstract: A semiconductor laser module includes a polarization direction transforming part which transforms polarization directions of first and second laser beams such that they are orthogonal to each other even if a polarization dependent optical isolator is utilized in the semiconductor laser module. The configuration allows the two laser beams to propagate through the birefringence element to the output port without each splitting into an ordinary ray and an extraordinary ray on entering the birefringence element, and therefore free from decrease of optical power reaching the output port. Thus, high power semiconductor laser modules can be provided.

Abstract: A fabrication method of a semiconductor device according to the present invention includes the steps of: bonding a reinforcing plate with a front surface of a semiconductor wafer via a reinforcing plate, the reinforcing plate having holes and the semiconductor wafer bearing semiconductor devices; grinding a back surface of the semiconductor wafer; and detaching the reinforcing plate from the semiconductor wafer by injecting a solvent for dissolving an adhesive layer into the holes and by allowing the solvent to permeate through the adhesive layer. The method enables the reinforcing plate to be quickly detached from the semiconductor wafer without causing defects, such as bending and cracking, in the semiconductor wafer after the reinforcing plate is used to grind the semiconductor wafer.

Abstract: A method, system and computer program product for assembling an optical module incorporates a far field pattern (FFP) optical measurement system and optionally a near field pattern (NFP) optical measurement system to obtain information about the axis and/or the divergent angle of light output from the optical elements to be assembled as part of the optical module. The optical elements include a light-emitting element, such as a laser diode, and at least one optical component, such as a collimating lens or a focusing lens. The system for assembling the optical module further includes a stage having the light-emitting element mounted thereon, a holding mechanism configured to hold and position the optical components to desired positions based on the measurements from the FFP and/or NFP optical measurement systems. A controller can control the stage, the holding mechanism and a fixing device configured to fix the positions of the optical elements once the optical elements are positioned in the desired positions.

Abstract: A semiconductor laser module including a semiconductor laser device having an integrated diffraction grating configured to output a multiple mode laser beam in the presence of a driving current, an optical fiber configured to guide the multiple mode laser beam to an output of the laser module, and an optical attenuation device configured to attenuate the multiple mode laser beam by an amount sufficient to provide a predetermined output power from the output of the laser module. The optical attenuation device may be an optical coupling lens offset from an optimum coupling position by an amount sufficient to provide the predetermined output power, or an optical attenuator interrupting the optical fiber and configured to attenuate the multiple mode laser beam by an amount sufficient to provide the predetermined output power.

Abstract: A semiconductor laser module has a Fabry-Perot type semiconductor laser device, an optical fiber, and first and second lenses. The tip of the optical fiber, on which the laser beam falls, is askew polished. The optical fiber is fixed in such a manner that the axis of the optical fiber makes an angle with respect to an optical axis of the laser beam. Coatings that avoid reflection are formed on the tip of the optical fiber, and on the first and second lenses.

Abstract: When a vacuum-suction tool stand (1) is to be stuck to a table (2), a valve (16) is rotated to a position so that a knob (163) comes to the right side thereof viewed from the front to establish communication between an air suction hole (132) and a cavity (131). Then, by sucking the air within the cavity (131) through the air suction hole (132) using a suction pump (not shown) to make the inside of the cavity (131) close to a vacuum state, thereby the vacuum-suction tool stand (1) is stuck to the table (2). To release suction, the knob (163) of the valve (16) is rotated clockwise by 90 degrees. Then, the communication between an air release hole (15) and the cavity (131) is established and the air is supplied to the cavity (131) in a substantially vacuum state, and thus the vacuum-suction state is released.

Abstract: A DSP, which has a through electrode and is stacked to a wiring substrate through an adhesive part, a solid-state image pickup element, which is stacked to the DSP through an adhesive part and has a through electrode and an effective pixel area, and a translucent lid part, which is placed to face the effective pixel area and bonded to the solid-state image pickup element through an adhesive part, are stored in an optical path defining unit with a lens for defining an optical path to the effective pixel area, and the translucent lid part is coupled to the optical path defining unit by a coupling part.

Abstract: A method of aligning an optical fiber according to the present invention has a first step of aligning an optical fiber by moving the optical fiber and finding a position that maximizes the power of beam outputted from the optical fiber with the use of a power meter, and a second step of moving and aligning the optical fiber in the optical axis direction (direction Z) from the position in which the optical fiber has been as a result of the alignment in the first step in a manner that makes the degree of polarization of two laser beams K1 and K2 equal to or lower than a given level with the use of a polarimeter.

Abstract: A semiconductor laser module has a semiconductor laser device; a package for housing the semiconductor laser device; a PBC fixed in the package for polarization-synthesizing two laser beams output from the semiconductor laser device; a depolarizing element fixed in the package for depolarizing a synthesizing light output from the PBC; and an optical fiber for receiving a light output from the depolarizing element.

Abstract: The object of the invention is to secure straight travelability for a fastener during the driving of the latter, simplify the connecting fastener production process, simplify the cleaning of the work site, and prevent work-attending damage to the flooring. In a connecting fastener, kraft paper (5) in a combination band (2, 3) for holding a number of nails (2) is pasted to opposite surfaces of the nails (2), the kraft paper(5) having a plastic layer (6) that is formed with a plurality of grooves (7A, 7B) with a pitch smaller than the arrangement pitch of the nails (2), facilitating the separation of the nails (2).

Abstract: An n-side electrode, an n-substrate, an n-buffer layer, a GRIN-SCH-MQW active layer, a p-spacer, a p-cladding layer, a p-contact layer, and a p-side electrode are laminated one on top another in that order. Above the n-buffer layer, the GRIN-SCH-MQW layer and the p-spacer layer occupy a narrower area than the n-substrate in a direction that is at right angles to the laser emission direction, wherein the remaining area is occupied by a p-blocking layer and an n-blocking layer. Within the p-spacer layer are embedded a first diffraction grating and a second diffraction grating. Between the first and the second diffraction grating and the p-side electrode is provided a current non-injection area.

Abstract: A semiconductor laser device having two active-layer stripe structures includes an n-InP substrate, an n-InP clad layer, a lower GRIN-SCH layer, an active layer, an upper GRIN-SCH layer, a p-InP clad layer, and a p-InGaAsP contact layer grown in this order, in a side cross section cut along one of the stripe structure. A high-reflection film is disposed on a reflection-side end surface, and a low-reflection film is disposed on an emission-side end surface. A p-side electrode is disposed on only a part of the upper surface of the p-InGaAsP contact layer so that a current non-injection area is formed on an area absent the p-side electrode.

Abstract: A semiconductor laser module includes a polarization direction transforming part which transforms polarization directions of first and second laser beams such that they are orthogonal to each other even if a polarization dependent optical isolator is utilized in the semiconductor laser module. The configuration allows the two laser beams to propagate through the birefringence element to the output port without each splitting into an ordinary ray and an extraordinary ray on entering the birefringence element, and therefore free from decrease of optical power reaching the output port. Thus, high power semiconductor laser modules can be provided.