Abstract: A partial block polyimide-polysiloxane copolymer is provided comprising repeat unit structures having structural formulae (1) and (2) wherein X is an aromatic or aliphatic ring-containing tetravalent organic radical, Y1 is a diamine residue, Y2 is a diaminosiloxane residue, Y1 and Y2 are contained in the copolymer in amounts of 99-20 mol % and 1-80 mol %, respectively, L and m each are an integer of 2-50. The copolymer has good adhesion to substrates, moisture-proof reliability and a low modulus of elasticity.

Abstract: An epoxy-silicone mixed resin composition to give a transparent cured product which comprises [I] 100 parts by weight of a curable resin composition containing an organosilicon compound and an epoxy resin as essential components, and [II] 0.1 to 50 parts by weight of a silicone elastomer having a refractive index within 10% of that of a cured product of the curable resin composition. It is suitable for use as an encapsulator for light-emitting semiconductors.

Abstract: A radiation curing silicone rubber composition is provided. This composition includes as a base polymer either a liquid polysiloxane with a (meth)acryloyl group and a hydrosilyl group, or a combination of a liquid polysiloxane with at least two (meth)acryloyl groups and a liquid polysiloxane with a hydrosilyl group. This composition is formed into a film, and then subjected to radiation curing, thereby producing an adhesive silicone rubber elastomer film with low elasticity, adequate heat resistance, powerful adhesion and good workability. This film is useful for bonding electronic components using methods such as die bonding.

Abstract: A polyimide resin having phenolic hydroxyl radicals in its skeleton is prepared using a diamine bearing an aromatic ring having an amino radical attached thereto and another aromatic ring having a phenolic hydroxyl radical. The polyimide resin and a composition comprising the polyimide resin, an epoxy resin and a curing agent are suited for use as varnish, adhesive and adhesive film for which adhesion and heat resistance are required.

Abstract: An epoxy/silicone mixed resin composition comprising (A?) an organosilicon compound containing at least one aliphatic unsaturated monovalent hydrocarbon group and at least one silicon atom-bonded hydroxyl group, (B) an epoxy resin containing at least one epoxy group, (C) an organohydrogenpolysiloxane, (D) a platinum group metal-based catalyst, and (E) an aluminum-based curing catalyst is used to encapsulate a light-emitting semiconductor member. The light-emitting semiconductor device undergoes little discoloration in a heat test, and has a high emission efficiency, a long life and reduced energy consumption.

Abstract: A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler contains nitrogen atoms in an amount of 1.5-20% by weight based on the weight of components (A) and (B) combined. Cured parts of the composition exhibit high-temperature capabilities and flame retardance despite the absence of halogenated epoxy resins and antimony trioxide.

Abstract: An adhesive composition is provided comprising (A) a polyimide resin containing a diorganopolysiloxane linkage having vinyl groups as organic substituent groups on the backbone, (B) an epoxy resin, and (C) an epoxy resin-curing catalyst. An adhesive film prepared from the adhesive composition has a high bond strength to various substrates and to encapsulating resins when thermocompression bonded and heat cured thereto, and possesses a low modulus of elasticity and high heat resistance, ensuring manufacture of resin packaged semiconductor devices with high reliability.

Abstract: An optical waveguide comprising a substrate, a lower clad layer on the substrate, a core layer and an upper clad layer, at least one of the lower clad layer, the core layer and the upper clad layer is formed of a cured product of a photo-curable organopolysiloxane composition comprising (A) a (meth)acryloyloxy group-containing organopolysiloxane of the following average compositional formula (1): (CH2?CR1COO(CH2)n)a(Ph)bR2c(R3O)dSiO(4-a-b-c-d)/2??(1) wherein R1 is hydrogen or methyl, R2 is an C1-C8 alkyl or C2-C8 alkenyl group, Ph is phenyl, R3 is hydrogen or an unsubstituted or alkoxy-substituted C1-C4 alkyl group, subscripts a, b, c and d are numbers satisfying: 0.05?a?0.9, 0.1?b?0.9, 0?c?0.2, 0<d?0.5, and 0.8?a+b+c+d?1.5, and n is an integer of 2 to 5, and having a weight average molecular weight of 1,000 to 100,000 as measured by GPC using a polystyrene standard, and (B) a photosensitizer.

Abstract: In connection with a semiconductor component having a circuit region and electrodes formed on a substrate surface, the circuit region is sealed by (1) applying a resist material onto the substrate surface to form a resist layer, (2) selectively exposing the resist layer to radiation and developing the resist with a liquid developer for thereby removing only the portion of the resist layer which overlies the circuit region, (3) applying a resin sealant onto the circuit region and curing the resin sealant into a cured resin layer that covers the circuit region, and (4) removing the residual resist layer using a solvent.

Abstract: A silicone rubber composition comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds, (B) an organopolysiloxane of resin structure comprising SiO2 units, R3nR4pSiO0.5 units and R3qR4rSiO0.5 units wherein R3 is vinyl or allyl, R4 is a monovalent hydrocarbon group free of aliphatic unsaturation, n is 2 or 3, p is 0 or 1, n+p=3, q is 0 or 1, r is 2 or 3, q+r=3, (C) an organohydrogenpolysiloxane having at least two SiH groups, and (D) a platinum catalyst cures into a silicone rubber having excellent rubbery and strength properties and little surface tack.

Abstract: A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an aromatic amine curing agent comprising at least 5% by weight of a specific aromatic amine compound, and (C) an inorganic filler has a low viscosity for ease of working, cures into a cured product which has improved adhesion to the surface of silicon chips, and offers an encapsulated semiconductor device that does not suffer a failure even at a reflow temperature of 260-270° C., does not deteriorate under hot humid conditions, and does not peel or crack on thermal cycling.

Abstract: A dicing/die bonding adhesion tape includes a substrate, a silicone adhesive layer, and a bonding layer. A tack strength of 0.2-2.0 N/25 mm is developed between the silicone adhesive layer and the bonding layer. The bonding layer is formed of a bonding composition comprising (A) a polyimide resin, (B) an epoxy resin, and (C) an epoxy resin curing catalyst.

Abstract: A resin composition comprising the associated product of a polyimide resin having acid anhydride groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin, and optionally, an epoxy resin-curing agent has excellent adhesion, heat resistance, shelf stability and solvent resistance. An adhesive film comprising the resin composition is useful as an adhesive or sealant for printed circuit boards and semiconductor packages.

Abstract: A potting composition comprising (A) an organopolysiloxane having a vinyl group at an end of its molecular chain, (B) an organohydrogenpolysiloxane, (C) a platinum group metal catalyst, and optionally, (D) an organosilicon compound having a silicon atom-bonded alkoxy group. The cured product of the composition has a refractive index of 1.41-1.56 at 25° C. and 589 nm (sodium D line). The composition is suited for the embedment and protection of light-emitting semiconductor members. A package in which a light-emitting semiconductor member is embedded and protected with the potting composition undergoes little discoloration and maintains a high emission efficiency in heating tests, thus offering a light-emitting semiconductor device featuring a long life and energy saving.

Abstract: A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an aromatic amine curing agent comprising 5-100% by weight of a specific aromatic amine compound having a purity of at least 99%, (C) an inorganic filler, and (D) an ester organic solvent having a boiling point of 130-250° C. is useful for semiconductor encapsulation. The composition has an infiltration ability, adhesion to silicon chips, resistance to deterioration under hot humid conditions, and resistance to thermal shocks.

Abstract: A flip-chip type semiconductor device sealed with a light transmissive epoxy resin composition comprising (A) an epoxy resin having the following general formula (i):  wherein n is 0 or a positive number, (B) a curing accelerator, and (C) an amorphous silica-titania co-melt as at least one of inorganic fillers, said composition satisfying the relationship of the following formula (1): [ { 2 ⁢ ( n A 2 + n C 2

Abstract: A potting composition comprising (A) an organopolysiloxane having a vinyl group at an end of its molecular chain, (B) an organohydrogenpolysiloxane, (C) a platinum group metal catalyst, and optionally, (D) an organosilicon compound having a silicon atom-bonded alkoxy group. The cured product of the composition has a refractive index of 1.41-1.56 at 25° C. and 589 nm (sodium D line). The composition is suited for the embedment and protection of light-emitting semiconductor members. A package in which a light-emitting semiconductor member is embedded and protected with the potting composition undergoes little discoloration and maintains a high emission efficiency in heating tests, thus offering a light-emitting semiconductor device featuring a long life and energy saving.

Abstract: An epoxy resin composition comprising an epoxy resin, a phenolic resin curing agent, an inorganic filler, zinc molybdate on an inorganic support, and a complementary combination of two phosphazene compounds is effectively moldable, flame retardant and suitable for semiconductor encapsulation. A semiconductor device encapsulated with the cured epoxy resin composition is improved in flame retardance and moisture-proof reliability.

Abstract: In a liquid epoxy resin composition comprising a liquid epoxy resin, a curing agent, a curing accelerator, and an inorganic filler, the liquid epoxy resin is a mixture of (a) a liquid epoxy resin containing two or less epoxy functional groups and (b) a solid epoxy resin containing two or more epoxy functional groups in a weight ratio (a)/(b) of from 9/1 to 1/4, having a viscosity of up to 10,000 poises at 25° C. as measured by an E type viscometer. The composition is adherent to silicon chips, the cured product is highly resistant to humidity and thermal shocks, and the composition is useful as sealant for semiconductor devices.

Abstract: There are provided a radiation curing silicone rubber composition that is useful for the bonding of substrates, an adhesive silicone elastomer film formed from such a composition, a structural body in which two substrates are bonded via a cured layer formed from the composition, and a method of producing such a structural body. The composition includes: (a) an organohydrogenpolysiloxane containing at least one group selected from the group consisting of acryloyl groups and methacryloyl groups, and at least one hydrosilyl group; (b) a fluid organopolysiloxane with at least two groups which are each selected from the group consisting of acryloyl groups and methacryloyl groups, and with no hydrosilyl groups; (c) a compound selected from the group consisting of alkoxysilanes, partial hydrolysis-condensation products of alkoxysilanes, organosilane-modified isocyanurates and organosiloxane-modified isocyanurates; (d) a radiation sensitizer; and (e) a platinum group metal-based catalyst.