Patents by Inventor Toshio Shiobara

Toshio Shiobara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat resistant resin composition and adhesive film
    Publication number: 20030158350
    Abstract: A resin composition comprising the associated product of a polyimide resin having acid anhydride groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin, and optionally, an epoxy resin-curing agent has excellent adhesion, heat resistance, shelf stability and solvent resistance. An adhesive film comprising the resin composition is useful as an adhesive or sealant for printed circuit boards and semiconductor packages.
    Type: Application
    Filed: February 14, 2003
    Publication date: August 21, 2003
    Inventors: Nobuhiro Ichiroku, Toshio Shiobara
  • Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
    Publication number: 20030152777
    Abstract: An epoxy resin composition comprising an epoxy resin, a phenolic resin curing agent, an inorganic filler, zinc molybdate on an inorganic support, and a complementary combination of two phosphazene compounds is effectively moldable, flame retardant and suitable for semiconductor encapsulation. A semiconductor device encapsulated with the cured epoxy resin composition is improved in flame retardance and moisture-proof reliability.
    Type: Application
    Filed: February 5, 2003
    Publication date: August 14, 2003
    Inventors: Shoichi Osada, Shingo Ando, Hiroyuki Takenaka, Kazutoshi Tomiyoshi, Toshio Shiobara
  • Optical waveguide forming material and method
    Publication number: 20030148226
    Abstract: An optical waveguide-forming material is provided as a photo-curable organopolysiloxane composition comprising (A) a (meth)acryloyloxy group-containing organopolysiloxane resin possessing a siloxane skeleton consisting essentially of organosilsesquioxane units and having a Mw of 1,000-100,000 and (B) a photosensitizer. The material is easy to prepare, inexpensive, and satisfactory in sensitivity and resolution, forms a thick-film coating having heat resistance, moisture resistance and adhesion to a substrate, and allows for easy adjustment of a refractive index.
    Type: Application
    Filed: February 5, 2003
    Publication date: August 7, 2003
    Inventors: Kinya Kodama, Tsutomu Kashiwagi, Toshio Shiobara
  • Flip-chip type semiconductor device
    Publication number: 20030144382
    Abstract: A flip-chip type semiconductor device sealed with a light transmissive epoxy resin composition comprising
    Type: Application
    Filed: January 24, 2003
    Publication date: July 31, 2003
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tsuyoshi Honda, Tatsuya Kanamaru, Eiichi Asano, Toshio Shiobara
  • Epoxy resin compositions and premolded semiconductor packages
    Patent number: 6569532
    Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.
    Type: Grant
    Filed: November 20, 2001
    Date of Patent: May 27, 2003
    Assignees: Sony Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazutoshi Tomiyoshi, Kazuhiro Arai, Toshio Shiobara, Koki Oitori, Hironori Sakamoto, Yuji Kishigami, Koji Tsuchiya, Masato Kanari
  • Liquid epoxy resin composition and semiconductor device
    Patent number: 6558812
    Abstract: A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler is provided, the curing agent (B) comprising 5 to 75 parts by weight of a mixture of 3,4-dimethyl-6-(2-methyl-1-propenyl)-1,2,3,6-tetrahydrophthalic acid and 1-isopropyl-4-methyl-bicyclo[2.2.2]oct-5-ene-2,3-dicarboxylic acid per 100 parts by weight of the entire curing agent. The composition is adherent to the surface of silicon chips, and especially to polyimide resins and nitride films and has high thermal shock resistance. A semiconductor device sealed with the cured epoxy resin composition remains reliable.
    Type: Grant
    Filed: September 20, 2001
    Date of Patent: May 6, 2003
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazuaki Sumita, Toshio Shiobara
  • Conductive resin compositions and electronic parts using the same
    Publication number: 20030078322
    Abstract: A conductive resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) a conductive filler is provided wherein component (A) and/or (B) is a copolymer obtained by reacting an epoxy resin or phenolic resin with an organopolysiloxane, the organopolysiloxane component in the cured composition does not form a phase separation structure, and a weight ratio of (D) to (A) plus (B) is in the range: 300/100 ≦D/(A+B)≦1500/100. It possesses adhesion, heat resistance, moisture resistance, flexibility and impact resistance.
    Type: Application
    Filed: September 6, 2002
    Publication date: April 24, 2003
    Inventors: Tsuyoshi Honda, Toshio Shiobara
  • Liquid epoxy resin composition and semiconductor device
    Publication number: 20030069349
    Abstract: A liquid epoxy resin composition includes (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) a silicone-modified resin resulting from addition reaction of an alkenyl-containing epoxy or phenolic resin with an organopolysiloxane, the liquid epoxy resin composition curing into a product having a Tg of 30-120° C. and a specific dynamic viscoelasticity behavior. The composition is adherent to silicon chips, the cured product is highly resistant to heat and thermal shocks, and the composition is useful as sealant for flip chip type semiconductor devices.
    Type: Application
    Filed: August 15, 2002
    Publication date: April 10, 2003
    Inventors: Kazuaki Sumita, Tatsuya Kanamaru, Toshio Shiobara
  • Liquid epoxy resin composition and semiconductor device
    Patent number: 6534193
    Abstract: A liquid epoxy resin composition includes (A) a liquid epoxy resin, (B) an optional curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) an indene-styrene or indene-chroman-styrene copolymer having a Mn of 200-2,000 in an amount of 0.1-20 parts by weight per 100 parts by weight of components (A) and (B) combined. The indene polymer (E) is previously melt mixed with a part or all of the liquid epoxy resin (A) prior to compounding with the remaining components. A semiconductor device sealed with the cured product of the liquid epoxy resin composition remains reliable.
    Type: Grant
    Filed: July 26, 2001
    Date of Patent: March 18, 2003
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazuaki Sumita, Toshio Shiobara
  • Semiconductor encapsulating epoxy resin composition and semiconductor device
    Publication number: 20030050399
    Abstract: Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp2 type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a &bgr;-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.
    Type: Application
    Filed: July 17, 2002
    Publication date: March 13, 2003
    Inventors: Yasuo Kimura, Kazutoshi Tomiyoshi, Tarou Shimoda, Eiichi Asano, Takayuki Aoki, Toshio Shiobara
  • Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith
    Patent number: 6518332
    Abstract: Semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a phenolic resin curing agent, a fire retardant comprising zinc molybdate carried on spherical silica having a mean particle diameter of 0.2-20 &mgr;m and a specific surface of 1-20 m2/g, and an inorganic filler are able to provide cured products having excellent fire retardance. The compositions have good flow and curing properties and excellent reliability and do not pose a hazard to human health or the environment.
    Type: Grant
    Filed: April 25, 2001
    Date of Patent: February 11, 2003
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Eiichi Asano, Kazutoshi Tomiyoshi, Masachika Yoshino, Toshio Shiobara, Shoichi Osada
  • Epoxy resin composition, laminate film using the same, and semiconductor device
    Patent number: 6512031
    Abstract: An epoxy resin composition comprising an epoxy resin, a first curing agent for polymerizing the epoxy resin into a linear polymer, and a second curing agent for crosslinking the linear polymer into a three-dimensional polymer. The use of two curing agents corresponding to straight chain growth reaction and crosslinking reaction of the epoxy resin optimizes the reaction conditions to B-stage, giving a semi-cured film having a minimized variation. A laminate includes a layer of the epoxy resin composition and a protective layer. By sealing a semiconductor chip with the film, there is obtained a semiconductor package having improved heat resistance, improved moisture resistance, low stress property.
    Type: Grant
    Filed: April 14, 2000
    Date of Patent: January 28, 2003
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tsuyoshi Honda, Miyuki Wakao, Toshio Shiobara
  • Optical device-related adhesive and optical device
    Publication number: 20030010962
    Abstract: An adhesive in the form of a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) 20 to 90% by weight based on the entire composition of an inorganic filler having an average particle size from more than 1 &mgr;m to 20 &mgr;m and containing up to 1% by weight of a fraction of particles having a particle size of at least 45 &mgr;m and optionally, (C) a silicone-modified resin is suitable for bonding optical elements in optical devices.
    Type: Application
    Filed: May 21, 2002
    Publication date: January 16, 2003
    Inventors: Haruyoshi Kuwabara, Miyuki Wakao, Toshio Shiobara
  • Epoxy resin composition
    Patent number: 6506822
    Abstract: An epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) a silicone stress-reducing agent further includes (D) a foam-suppressing composition comprising (D-i) an oil compound consisting of a hydrophobic organopolysiloxane and finely divided silica, (D-ii) a hydrophilic polyoxyalkylene-modified silicone oil, and optionally, (D-iii) a polyoxyalkylene polymer. The epoxy resin composition has the advantages of improved infiltration to semiconductor device-substrate gaps and minimized formation of internal and surface voids.
    Type: Grant
    Filed: July 5, 2001
    Date of Patent: January 14, 2003
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Nobuhiro Ichiroku, Miyuki Wakao, Toshio Shiobara
  • Semiconductor encapsulating epoxy resin composition and semiconductor device
    Patent number: 6500564
    Abstract: An epoxy resin composition comprising (A) a polyfunctional epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) curing catalyst-containing microcapsules having a mean particle size of 0.5-50 &mgr;m is suited for semiconductor package encapsulation since it minimizes the warpage of packages and has satisfactory catalyst latency, storage stability and cure.
    Type: Grant
    Filed: August 18, 2000
    Date of Patent: December 31, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Toshio Shiobara, Kazuhiro Arai, Hidenori Mizushima, Shigeki Ino, Yasuo Kimura, Takayuki Aoki
  • Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith
    Publication number: 20020192477
    Abstract: A resin composition is provided comprising a silicone-modified epoxy or phenolic resin obtained by reacting an epoxy or phenolic resin having specific structural units with an organopolysiloxane. The modified epoxy or phenolic resin is such that after the modified epoxy or phenolic resin is cured alone or together with another epoxy resin and/or phenolic resin to form a cured product, the organopolysiloxane component does not form a phase separation structure in the cured product. The composition cures into a product having both the adherence, heat resistance and humidity resistance characteristic of epoxy or phenolic resins and the flexibility and impact resistance characteristic of silicone resins.
    Type: Application
    Filed: February 22, 2002
    Publication date: December 19, 2002
    Inventors: Tsuyoshi Honda, Toshio Shiobara, Tatsuya Kanamaru
  • Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith
    Patent number: 6479167
    Abstract: A sealing material for flip chip-type semiconductor devices comprises a liquid epoxy resin composition which includes (A) a liquid epoxy resin, (B) an optional curing agent, (C) an inorganic filler, and (D) 1 to 15 parts by weight of a microencapsulated catalyst per 100 parts by weight of components A and B combined. The excellent thin-film penetration and shelf stability of the sealing material confer a very high reliability to flip chip-type semiconductor devices made using the sealing material.
    Type: Grant
    Filed: February 1, 2001
    Date of Patent: November 12, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazuaki Sumita, Toshio Shiobara
  • Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
    Patent number: 6429238
    Abstract: Blended in a liquid epoxy resin composition comprising a liquid epoxy resin and an inorganic filler are a specific imidazole compound as a curing accelerator and an amino group-containing, polyether-modified polysiloxane. The resulting composition is suited as a sealing material for flip-chip type semiconductor devices since it has improved thin-film infiltration and storage stability.
    Type: Grant
    Filed: June 9, 2000
    Date of Patent: August 6, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazuaki Sumita, Kimitaka Kumagae, Miyuki Wakao, Toshio Shiobara
  • Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith
    Publication number: 20020102429
    Abstract: Semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a phenolic resin curing agent, a fire retardant comprising zinc molybdate carried on spherical silica having a mean particle diameter of 0.2-20 &mgr;m and a specific surface of 1-20 m2/g, and an inorganic filler are able to provide cured products having excellent fire retardance. The compositions have good flow and curing properties and excellent reliability and do not pose a hazard to human health or the environment.
    Type: Application
    Filed: April 25, 2001
    Publication date: August 1, 2002
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Eiichi Asano, Kazutoshi Tomiyoshi, Masachika Yoshino, Toshio Shiobara, Shoichi Osada
  • Liquid epoxy resin composition and semiconductor device
    Publication number: 20020089071
    Abstract: A liquid epoxy resin composition is provided comprising (A) a liquid epoxy resin, (B) an optional curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) acrylic submicron particles of core-shell structure formed of polymers or copolymers comprising an alkyl acrylate and/or alkyl methacrylate as a monomeric component, the core having a Tg of up to −10° C., the shell having a Tg of 80-150° C. The composition is adherent to surfaces of silicon chips, especially polyimide resins and nitride film and useful as sealant for flip chip type semiconductor devices.
    Type: Application
    Filed: November 13, 2001
    Publication date: July 11, 2002
    Inventors: Kazuaki Sumita, Toshio Shiobara