Patents by Inventor Toshio Shiobara

Toshio Shiobara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive adhesive composition
    Publication number: 20040127626
    Abstract: A conductive adhesive composition is obtained by mixing a binder resin with 30-98 wt % based on the adhesive composition of a silver powder as a conductive agent. The silver powder contains a silver powder consisting of flat primary particles and having a massive agglomerate structure and a tap density of 0.1-1.5 g/cm3 in an amount of 30-98 wt % based on the adhesive composition. The conductive adhesive composition cures into a product having improved conductivity, adhesion, heat resistance, moisture resistance, ease of working and heat transfer.
    Type: Application
    Filed: December 18, 2003
    Publication date: July 1, 2004
    Inventors: Masachiko Yoshiko, Motoo Fukushima, Toshio Shiobara
  • Wafer dicing/die bonding sheet
    Publication number: 20040105990
    Abstract: In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent, the ratio of the total weight of the epoxy resin and the epoxy resin curing agent to the weight of the polyimide resin being from 0.1:1 to 3:1. Due to heat resistance, improved adhesive properties and a low modulus of elasticity, the wafer dicing/die bonding sheet is effective for reducing the warpage of a chip after die bonding.
    Type: Application
    Filed: November 17, 2003
    Publication date: June 3, 2004
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Toshio Shiobara, Nobuhiro Ichiroku, Hideki Akiba, Masachika Yoshino
  • Liquid epoxy resin composition and semiconductor device
    Patent number: 6733902
    Abstract: A liquid epoxy resin composition includes (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) a silicone-modified resin resulting from addition reaction of an alkenyl-containing epoxy or phenolic resin with an organopolysiloxane, the liquid epoxy resin composition curing into a product having a Tg of 30-120° C. and a specific dynamic viscoelasticity behavior. The composition is adherent to silicon chips, the cured product is highly resistant to heat and thermal shocks, and the composition is useful as sealant for flip chip type semiconductor devices.
    Type: Grant
    Filed: August 15, 2002
    Date of Patent: May 11, 2004
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazuaki Sumita, Tatsuya Kanamaru, Toshio Shiobara
  • Semiconductor encapsulating epoxy resin composition and semiconductor device
    Patent number: 6723452
    Abstract: Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp2 type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a &bgr;-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.
    Type: Grant
    Filed: July 17, 2002
    Date of Patent: April 20, 2004
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yasuo Kimura, Kazutoshi Tomiyoshi, Tarou Shimoda, Eiichi Asano, Takayuki Aoki, Toshio Shiobara
  • Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
    Publication number: 20040072968
    Abstract: A flame retardant epoxy resin composition for semiconductor encapsulation includes as essential components, (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a phosphazene compound of the average compositional formula (1) having a melting point of 110-130° C.
    Type: Application
    Filed: August 12, 2003
    Publication date: April 15, 2004
    Inventors: Tarou Shimoda, Shoichi Osada, Hiroyuki Takenaka, Shingo Ando, Kazutoshi Tomiyoshi, Toshio Shiobara
  • Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith
    Patent number: 6709753
    Abstract: A resin composition is provided comprising a silicone-modified epoxy or phenolic resin obtained by reacting an epoxy or phenolic resin having specific structural units with an organopolysiloxane. The modified epoxy or phenolic resin is such that after the modified epoxy or phenolic resin is cured alone or together with another epoxy resin and/or phenolic resin to form a cured product, the organopolysiloxane component does not form a phase separation structure in the cured product. The composition cures into a product having both the adherence, heat resistance and humidity resistance characteristic of epoxy or phenolic resins and the flexibility and impact resistance characteristic of silicone resins.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: March 23, 2004
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tsuyoshi Honda, Toshio Shiobara, Tatsuya Kanamaru
  • Optical device-related adhesive and optical device
    Patent number: 6709756
    Abstract: An adhesive in the form of a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) 20 to 90% by weight based on the entire composition of an inorganic filler having an average particle size from more than 1 &mgr;m to 20 &mgr;m and containing up to 1% by weight of a fraction of particles having a particle size of at least 45 &mgr;m and optionally, (C) a silicone-modified resin is suitable for bonding optical elements in optical devices.
    Type: Grant
    Filed: May 21, 2002
    Date of Patent: March 23, 2004
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Haruyoshi Kuwabara, Miyuki Wakao, Toshio Shiobara
  • Liquid epoxy resin composition and semiconductor device
    Publication number: 20040054061
    Abstract: A liquid epoxy resin composition comprising a liquid epoxy resin, an aromatic amine curing agent having a phenolic hydroxyl group in a skeleton, an inorganic filler, and a cure accelerator is useful for semiconductor encapsulation. The composition is adherent to the surface of silicon chips, does not deteriorate under hot humid conditions, and is fully resistant to thermal shocks.
    Type: Application
    Filed: September 11, 2003
    Publication date: March 18, 2004
    Inventors: Kazuaki Sumita, Shingo Ando, Toshio Shiobara
  • Semiconductor encapsulating epoxy resin composition and semiconductor device
    Publication number: 20040034161
    Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
    Type: Application
    Filed: July 14, 2003
    Publication date: February 19, 2004
    Applicant: Shin-Etsu Chemical Co. Ltd.
    Inventors: Shoichi Osada, Eiichi Asano, Shigeki Ino, Takayuki Aoki, Kazutoshi Tomiyoshi, Toshio Shiobara
  • Optical waveguide, forming material and making method
    Publication number: 20040017994
    Abstract: An optical waveguide-forming material is comprised of a photocurable organopolysiloxane composition comprising an alkali-soluble organopolysiloxane and a photoacid generator, wherein the organopolysiloxane is obtained by (co)hydrolytic condensation of a triorganoxysilane having hydrolyzable epoxide and has an average molecular weight of 500-50,000 as determined by GPC using polystyrene standards. The optical waveguide-forming material, when subjected to pattern formation by photolithography, can be resolved with an alkaline aqueous solution, has a high sensitivity and resolution, and offers a cured film having improved light transmittance, heat resistance and humidity resistance.
    Type: Application
    Filed: July 17, 2003
    Publication date: January 29, 2004
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kinya Kodama, Tsutomu Kashiwagi, Toshio Shiobara
  • Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition
    Publication number: 20040019174
    Abstract: A polyimide resin having phenolic hydroxyl radicals in its skeleton is prepared using a diamine bearing an aromatic ring having an amino radical attached thereto and another aromatic ring having a phenolic hydroxyl radical. The polyimide resin and a composition comprising the polyimide resin, an epoxy resin and a curing agent are suited for use as varnish, adhesive and adhesive film for which adhesion and heat resistance are required.
    Type: Application
    Filed: July 18, 2003
    Publication date: January 29, 2004
    Inventors: Nobuhiro Ichiroku, Masachika Yoshino, Hideki Akiba, Toshio Shiobara
  • Liquid epoxy resin composition and semiconductor device
    Publication number: 20040014843
    Abstract: A liquid epoxy resin composition comprising a liquid epoxy resin, a curing agent, and an inorganic filler is useful for semiconductor encapsulation when the curing agent contains 5-100% by weight of a specific aromatic amine compound of at least 99% pure, the epoxy resin and the curing agent are present in a molar ratio from 0.7 to 0.9, and the composition has a toughness K1c of at least 3.5. The composition is adherent to the surface of silicon chips, does not deteriorate under hot humid conditions, and is fully resistant to thermal shocks.
    Type: Application
    Filed: July 15, 2003
    Publication date: January 22, 2004
    Inventors: Kazuaki Sumita, Shingo Ando, Toshio Shiobara
  • Conductive resin compositions and electronic parts using the same
    Patent number: 6680007
    Abstract: A conductive resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) a conductive filler is provided wherein component (A) and/or (B) is a copolymer obtained by reacting an epoxy resin or phenolic resin with an organopolysiloxane, the organopolysiloxane component in the cured composition does not form a phase separation structure, and a weight ratio of (D) to (A) plus (B) is in the range: 300/100≦D/(A+B)≦1500/100. It possesses adhesion, heat resistance, moisture resistance, flexibility and impact resistance.
    Type: Grant
    Filed: September 6, 2002
    Date of Patent: January 20, 2004
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tsuyoshi Honda, Toshio Shiobara
  • Heat resistant resin composition and adhesive film
    Publication number: 20030220455
    Abstract: A resin composition comprising the associated product of a polyimide resin having phenolic hydroxyl groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin having at least two glycidyl groups, and an epoxy resin-curing agent has a high bond strength, a low modulus of elasticity and heat resistance. An adhesive film comprising the resin composition is useful as an adhesive or sealant for printed circuit boards and semiconductor packages.
    Type: Application
    Filed: May 7, 2003
    Publication date: November 27, 2003
    Inventors: Nobuhiro Ichiroku, Toshio Shiobara
  • Conductive resin composition
    Publication number: 20030216505
    Abstract: A conductive resin composition primarily comprising (A) 100 parts by weight of a thermosetting or thermoplastic resin, (B) 5-2,000 parts by weight of a conductive filler, and (C) 0.1-300 parts by weight of organic resin or rubber particulates has a low volume resistivity and stability thereof, and is effectively adherent. When applied to semiconductor packages, the composition can prevent the semiconductor chips from warpage or cracking due to thermal stresses in the semiconductor packages, ensuring the fabrication of semiconductor devices with high reliability.
    Type: Application
    Filed: April 24, 2003
    Publication date: November 20, 2003
    Inventors: Hideki Akiba, Masachika Yoshino, Nobuhiro Ichiroku, Toshio Shiobara
  • Film-type adhesive for electronic components, and electronic components bonded therewith
    Patent number: 6645632
    Abstract: A film-type adhesive for electronic components comprises a polyimide resin made up of specific repeating units and having a weight-average molecular weight of 5,000-150,000 in combination with an epoxy resin bearing at least two glycidyl groups per molecule. The adhesive has a weight ratio of the polyimide resin to the epoxy resin within a range of 50/50 to 5/95, and a film thickness of 20-150 &mgr;m. Such a film-type adhesive makes it possible to simplify and shorten the duration of assembly operations for electronic components having various types of adherend surfaces.
    Type: Grant
    Filed: March 15, 2001
    Date of Patent: November 11, 2003
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tsuyoshi Honda, Nobuhiro Ichiroku, Toshio Shiobara
  • Radiation curing silicone rubber composition and adhesive silicone elastomer film
    Publication number: 20030190484
    Abstract: A radiation curing silicone rubber composition is provided. This composition includes as a base polymer either a liquid polysiloxane with a (meth)acryloyl group and a hydrosilyl group, or a combination of a liquid polysiloxane with at least two (meth)acryloyl groups and a liquid polysiloxane with a hydrosilyl group. This composition is formed into a film, and then subjected to radiation curing, thereby producing an adhesive silicone rubber elastomer film with low elasticity, adequate heat resistance, powerful adhesion and good workability. This film is useful for bonding electronic components using methods such as die bonding.
    Type: Application
    Filed: February 14, 2003
    Publication date: October 9, 2003
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tsutomu Kashiwagi, Toshio Shiobara
  • Semiconductor encapsulating epoxy resin composition and semiconductor device
    Patent number: 6630745
    Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
    Type: Grant
    Filed: April 26, 2000
    Date of Patent: October 7, 2003
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shoichi Osada, Eiichi Asano, Shigeki Ino, Takayuki Aoki, Kazutoshi Tomiyoshi, Toshio Shiobara
  • Light-transmissive epoxy resin composition and semiconductor device
    Patent number: 6627328
    Abstract: An epoxy resin composition comprising (A) an epoxy resin, (B) a curing accelerator, and (C) an inorganic filler is light transmissive when it satisfies formulae (1) and (2): [{2(nA2+nC2)−(nA+nC)2}/2]½<3.0×10−3  (1) [{2(fA2+fC2)−(fA+fC)2}/2]½<1.0×10−5  (2) wherein nA is the refractive index at T1° C. of the cured unfilled composition, nC is the refractive index at T1° C. of the inorganic filler, fA is a temperature coefficient of the refractive index of the cured unfilled composition, and fC is a temperature coefficient of the refractive index of the inorganic filler. The cured composition has improved heat resistance, humidity resistance and low stress as well as high transparency over a wide temperature range. The composition is suited for the sealing of optical semiconductor devices.
    Type: Grant
    Filed: September 13, 2001
    Date of Patent: September 30, 2003
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tatsuya Kanamaru, Tsuyoshi Honda, Eiichi Asano, Toshio Shiobara
  • Liquid epoxy resin composition and semiconductor device
    Publication number: 20030155664
    Abstract: In a liquid epoxy resin composition comprising a liquid epoxy resin, a curing agent, a curing accelerator, and an inorganic filler, the liquid epoxy resin is a mixture of (a) a liquid epoxy resin containing two or less epoxy functional groups and (b) a solid epoxy resin containing two or more epoxy functional groups in a weight ratio (a)/(b) of from 9/1 to 1/4, having a viscosity of up to 10,000 poises at 25° C. as measured by an E type viscometer. The composition is adherent to silicon chips, the cured product is highly resistant to humidity and thermal shocks, and the composition is useful as sealant for semiconductor devices.
    Type: Application
    Filed: December 24, 2002
    Publication date: August 21, 2003
    Inventors: Kazuaki Sumita, Haruyoshi Kuwabara, Toshio Shiobara