Abstract: A composite layer material including at least two laminated layers. One of outermost layers is a support film that is removable from another layer and has a self-supporting property.

Abstract: A membrane filter including a thin film having a nanometer order thickness as a base, which is easy to increase in size, and which has sufficient strength. The membrane filter is formed by laminating a thin film having a thickness of 1 to 1,000 nm with a support film which is a porous film having a thickness of 1 to 1,000 ?m, which is made of a photosensitive composition or a cured product of the photosensitive composition, and has a plurality of hole portions penetrating in the thickness direction.

Abstract: A substrate having rod-like molecules on a surface thereof including: a substrate in which a pattern including a convex portion with a flat upper surface is formed on at least a portion thereof; and a plurality of rod-like molecules, which are formed into rod-like shape, are aligned in line in a direction crossing a molecular length direction of each of the rod-like molecules an the upper surface of the convex portion, and have liquid crystalline states, wherein the molecular length LR of the rod-like molecule is 2.0 or less times LN, which is a length of the rod-like molecule in the molecular length direction within the convex portion; and a method for producing a substrate having rod-like molecules on a surface thereof.

Abstract: An adhesive composition including a block copolymer. An adhesive layer formed by using the adhesive composition has a Young's modulus of 0.1 GPa or greater at 23° C., a storage modulus (G?) of 1.5×105 Pa or less at 220° C., and a loss factor (tan ?) of 1.3 or less at 220° C.

Abstract: A fluorocarbon including fluorine and carbon in which d50 in a cumulative particle size distribution is 1.0 nm or greater and 4.0 nm or less. A method for producing the fluorocarbon includes a plasma treatment process of generating radicals by producing inductively coupled plasma (ICP) using a fluorocarbon gas.

Abstract: The invention provides a steel pipe excellent in deformation characteristics, most notably a steel pipe for expandable-pipe oil well and a low-yield-ratio line pipe, and a method of producing the same without conducting water cooling requiring large-scale heat treatment equipment, namely a method of producing a steel pipe excellent in deformation characteristics whose microstructure is a two-phase structure including a martensite-austenite constituent at an area fraction of 2 to 10% and a soft phase, which method comprises: heating at Ac1+10° C. to Ac1+60° C. and thereafter cooling a precursor steel pipe which contains, in mass %, C: 0.04 to 0.10% and Mn: 1.00 to 2.50%, is limited to Si: 0.80% or less, P: 0.03% or less, S: 0.01% or less, Al: 0.10% or less and N: 0.01% or less, further contains one or more of Ni: 1.00% or less, Mo: 0.60% or less, Cr: 1.00% or less and Cu: 1.00% or less, where content of Mn and content of one or more of Cr, Ni, Mo and Cu satisfy Mn+Cr+Ni+2Mo+Cu?2.

Abstract: An adhesive composition is disclosed which includes a polymer prepared by copolymerizing a monomer containing a polymerizable group, the polymer including a low-molecular-weight component having a molecular weight equivalent to 1% or less of the weight-average molecular weight of the polymer, the low-molecular-weight component is contained in a range of not less than 0 weight % to less than 0.3 weight % of the total weight of the polymer. This allows provision of an adhesive composition having great adhesive strength in a high-temperature environment, especially at temperatures from 140° C. to 200° C., as well as high heat resistance and favorable crack resistance.

Abstract: An adhesive composition for bonding a wafer and a support for the wafer. The adhesive composition contains an elastomer in which a styrene unit is contained as a constituent unit of a main chain, a content of the styrene unit is 14% by weight to 50% by weight, and a weight average molecular weight of the styrene unit is 10,000 to 200,000.

Abstract: A polymer compound that, within a chemically amplified positive resist system, exhibits a significant change in alkali solubility from a state prior to exposure to that following exposure, as well as a photoresist composition that includes such a polymer compound and a method for forming a resist pattern, which are capable of forming fine patterns with a high level of resolution. The polymer compound includes, as an alkali-soluble group (i), a substituent group in which a group selected from amongst alcoholic hydroxyl groups, carboxyl groups, and phenolic hydroxyl groups is protected with an acid dissociable, dissolution inhibiting group (ii) represented by a general formula (1) shown below: [Formula 1] —CH2—O-AO—CH2—]n??(1) (wherein, A represents an organic group of 1 to 20 carbon atoms with a valency of at least n+1, and n represents an integer from 1 to 4).

Abstract: An adhesive composition including an elastomer as a main component, an adhesive layer prepared from the adhesive composition having (i) a storage modulus (G?) of not less than 20,000 Pa at 220° C. and/or (ii) a loss modulus (G?) of not less than 20,000 Pa at 220° C.

Abstract: A substrate having rod-like molecules on a surface thereof including: a substrate in which a pattern including a convex portion with a flat upper surface is formed on at least a portion thereof; and a plurality of rod-like molecules, which are formed into rod-like shape, are aligned in line in a direction crossing a molecular length direction of each of the rod-like molecules an the upper surface of the convex portion, and have liquid crystalline states, wherein the molecular length LR of the rod-like molecule is 2.0 or less times LN, which is a length of the rod-like molecule in the molecular length direction within the convex portion; and a method for producing a substrate having rod-like molecules on a surface thereof.

Abstract: Disclosed is a positive-type photosensitive composition which can form a metal compound film pattern at high resolution and with less affection by organic residues. The positive-type photosensitive composition comprises: a metal complex component (A) which can form a metal compound film when applied and subsequently fired; and a photosensitizing agent (B). In the composition, a ligand in the component (A) is preferably a multidentate ligand having an aromatic compound as its skeleton. According to this construction, even a composition containing substantially no photosensitive resin can impart photosensitivity and a metal compound film pattern can be formed readily.

Abstract: A pattern-forming method, including: forming a first resist film by applying a first chemically amplified resist composition onto a support, forming a plurality of resist patterns by selectively exposing and then developing the first resist film, forming a plurality of coated patterns by forming a coating film composed of a metal oxide film on the surface of each resist pattern, forming a second resist film by applying a second chemically amplified resist composition onto the support having the coated patterns formed thereon, and selectively exposing and then developing the second resist film, thereby forming a pattern composed of the plurality of coated patterns and a resist pattern formed in the second resist film onto the support.

Abstract: A positive type resist composition for forming a high resolution resist pattern and a method of forming a resist pattern are provided which use a low-molecular-weight material as a base component, and a compound and a dissolution inhibitor that are each suitable for the positive type resist composition. Here, the compound is a non-polymer having a molecular weight of 500 to 3000, and is decomposed under the action of an acid to produce two or more molecules of a decomposition product having a molecular weight of 200 or more; the dissolution inhibitor comprises the compound; the positive type resist composition comprises the compound and the acid generator component; and the method of forming a resist pattern uses the positive type resist composition.

Abstract: A method of forming a nano-structure can form a fine pattern easily, and the nano-structure obtained by the method is provided. A method of forming a nano-structure comprising forming a thin film by a liquid phase adsorption on surface of a template formed on a substrate, and removing a portion of the thin film, and removing the template is used.

Abstract: A positive type resist composition for forming a high resolution resist pattern and a method of forming a resist pattern are provided which use a low-molecular-weight material as a base component, and a compound and a dissolution inhibitor that are each suitable for the positive type resist composition. Here, the compound is a non-polymer having a molecular weight of 500 to 3000, and is decomposed under the action of an acid to produce two or more molecules of a decomposition product having a molecular weight of 200 or more; the dissolution inhibitor comprises the compound; the positive type resist composition comprises the compound and the acid generator component; and the method of forming a resist pattern uses the positive type resist composition.

Abstract: There are provided a coating material which improves an etching resistance of a pattern in an etching process using a pattern formed on a substrate as a mask. The material is a pattern coating material for an etching process using a pattern formed on a substrate as a mask, including a metal compound (W) which can produce a hydroxyl group on hydrolysis.

Abstract: A positive type resist composition for forming a high resolution resist pattern and a method of forming a resist pattern are provided which use a low-molecular-weight material as a base component, and a compound and a dissolution inhibitor that are each suitable for the positive type resist composition. Here, the compound is a non-polymer having a molecular weight of 500 to 3000, and is decomposed under the action of an acid to produce two or more molecules of a decomposition product having a molecular weight of 200 or more; the dissolution inhibitor comprises the compound; the positive type resist composition comprises the compound and the acid generator component; and the method of forming a resist pattern uses the positive type resist composition.

Abstract: A positive resist composition including a resin component (A) which exhibits increased alkali solubility under action of acid and an acid-generator component (B) which generates acid upon exposure, the resin component (A) including a structural unit (a1) represented by general formula (I) shown below: wherein R represents a hydrogen atom, a halogen atom, a lower alkyl group or a halogenated lower alkyl group; R1? represents a hydrogen atom or a lower alkyl group; n represents an integer of 0 to 3; R1 represents a lower alkyl group, a fluorine atom, or a fluorinated lower alkyl group; and p represents an integer of 0 to 2.

Abstract: Disclosed is a positive-type photosensitive composition which can form a metal compound film pattern at high resolution and with less affection by organic residues. The positive-type photosensitive composition comprises: a metal complex component (A) which can form a metal compound film when applied and subsequently fired; and a photosensitizing agent (B). In the composition, a ligand in the component (A) is preferably a multidentate ligand having an aromatic compound as its skeleton. According to this construction, even a composition containing substantially no photosensitive resin can impart photosensitivity and a metal compound film pattern can be formed readily.