Patents by Inventor Trung (Tim) Trinh

Trung (Tim) Trinh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7504008
    Abstract: In a method of refurbishing a deposition target, a surface of the target is provided in a process zone. An electrical arc is generated in the process zone, and a consumable metal wire is inserted into the process zone to form liquefied metal. A pressurized gas is injected into the process zone to direct the liquefied metal toward the surface of the target to splatter the liquefied metal on the surface, thereby forming a coating having the metal on at least a portion of the surface of the target that exhibits reduced contamination from the environment.
    Type: Grant
    Filed: March 12, 2004
    Date of Patent: March 17, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Trung T. Doan, Kenny King-Tai Ngan
  • Patent number: 7500793
    Abstract: A glass-to-meal seal for use in high temperature and high pressure environments is described. The glass-to-metal seals includes an optical fiber having a metallized portion, the metallized portion having an outer dimension; an object having a high strength, corrosion-resistant alloy, the object having an outer surface and an inner surface defining a bore, the bore having a dimension larger than the outer dimension of the metallized portion of the optical fiber; and a hardened solder material disposed between the metallized portion of the optical fiber and the inner surface of the bore, such that a hermetic seal is provided between the metallized portion of the optical fiber and the inner surface of the bore; wherein the solder includes a substance having a melting temperature greater than about 250° C.
    Type: Grant
    Filed: May 30, 2006
    Date of Patent: March 10, 2009
    Assignee: Greene, Tweed of Delaware, Inc.
    Inventors: Pragna Subhash Patel, Trung D. Nguyen, Charles Pence Burke, George Frank DeNardo, Jr.
  • Publication number: 20090063206
    Abstract: A system is provided that enables customers to search for event tickets for purchase. A computer interacts with the user to allow the user to specify criteria for event tickets the user wishes to purchase. The system presents relevant event ticket results, and provides filters for the user to further refine those search results. The user selects an event, and then selects tickets for that event. Ticket availability is shown, with seat locations indicated directly on an interactive venue map. For purchase, the user is directed to the selling ticket provider.
    Type: Application
    Filed: September 19, 2008
    Publication date: March 5, 2009
    Inventors: Andrew C. Payne, Michael Janes, Mark Towfiq, Rishi Garg, Lisa Pollock Mann, Afshin Shafie, Trung Dung Chi Pham, Zach Saltzberg, Maureen Kelly
  • Publication number: 20090035356
    Abstract: The invention concerns a method for preparing a modified biodegradable polymer in aqueous medium comprising at least two steps. The first step is a reaction between an amino acid, a peptide or a polypeptide and maleic anhydride to form a compound having an unsaturated vinyl-carboxylic acid function. In the second reaction step, the unsaturated diacid obtained in the first step is reacted with a biodegradable polymer having at least one primary amine function, such as a fibrous protein or a glycosaminoglycan. The preferred polymer used is collagen or chitosan. The invention also concerns the modified biodegradable polymer obtained by the method. The invention further concerns a biomaterial or a dressing containing the modified biodegradable polymer having biocompatible, cytocompatible, hemostatic, bactericidal and wound healing properties, and its medical, biomedical, pharmaceutical or cosmetic use.
    Type: Application
    Filed: September 5, 2006
    Publication date: February 5, 2009
    Inventors: Trung Bui-Khac, Ngoc Lang Ong
  • Patent number: 7485961
    Abstract: A method is disclosed for reducing the effects of buckling, also referred to as cracking or wrinkling in multilayer heterostructures. The present method involves forming a planarization layer superjacent a semiconductor substrate. A barrier film having a structural integrity is formed superjacent the planarization layer. A second layer is formed superjacent the barrier film. The substrate is heated sufficiently to cause the planarization layer to expand according to a first thermal coefficient of expansion, the second layer to expand according to a second thermal coefficient of expansion, and the structural integrity of the barrier film to be maintained. This results in the barrier film isolating the planarization layer from the second layer, thereby preventing the planarization layer and the second layer from interacting during the heating step.
    Type: Grant
    Filed: February 9, 2004
    Date of Patent: February 3, 2009
    Assignee: Micron Technology, Inc.
    Inventors: Trung T. Doan, Randhir P. S. Thakur, Yauh-Ching Liu
  • Patent number: 7482702
    Abstract: A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.
    Type: Grant
    Filed: March 27, 2006
    Date of Patent: January 27, 2009
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, Alan G. Wood, Trung Tri Doan
  • Publication number: 20090019924
    Abstract: A microfluidic sensor is disclosed that has a first inlet channel for a first fluid, a second inlet channel for a second fluid, and a measurement channel intersecting with both first inlet channel and the second inlet channel. A signal source system is provided for receiving a signal from a signal emitter, as is a signal detection system for receiving the signal from the signal source system. The signal source system and the signal detection system are for recording physical characteristics of at least one of the droplets in the measurement channel. A corresponding method is also disclosed.
    Type: Application
    Filed: February 27, 2006
    Publication date: January 22, 2009
    Inventors: Nam Trung Nguyen, Sumantri Lassemono, Franck Alexis Chollet, Chun Yang
  • Publication number: 20090014743
    Abstract: Methods are disclosed for forming a vertical semiconductor light-emitting diode (VLED) device having an active layer between an n-doped layer and a p-doped layer; and securing a plurality of balls on a surface of the n-doped layer of the VLED device.
    Type: Application
    Filed: July 15, 2008
    Publication date: January 15, 2009
    Inventors: CHUONG Anh TRAN, Trung Tri Doan
  • Patent number: 7476360
    Abstract: A cartridge is disclosed. The cartridge includes an independent storage component and transport component. The storage component can be coupled with the transport component. The storage component includes one or more pockets that each contain a solution to be used in an assay. The transport component is configured to transport the solutions from the pockets of the storage component to a sensor positioned in the transport component.
    Type: Grant
    Filed: September 14, 2004
    Date of Patent: January 13, 2009
    Assignee: Genefluidics, Inc.
    Inventors: Jen-Jr Gau, Arvin Trung Chang
  • Publication number: 20090011540
    Abstract: A die-wafer package includes a singulated semiconductor die having a first plurality of bond pads on a first surface and a second plurality of bond pads on a second opposing surface thereof. Each of the first and second pluralities of bond pads includes an under-bump metallization (UBM) layer. The singulated semiconductor die is disposed on a semiconductor die site of a semiconductor wafer and a first plurality of conductive bumps electrically couples the first plurality of bond pads of the singulated semiconductor die with a first set of bond pads formed on the semiconductor die site. A second plurality of conductive bumps is disposed on a second set of bond pads of the semiconductor die site. A third plurality of conductive bumps is disposed on the singulated semiconductor die's second plurality of bond pads. The second and third pluralities of conductive bumps are configured for electrical interconnection with an external device.
    Type: Application
    Filed: August 19, 2008
    Publication date: January 8, 2009
    Applicant: MICRON TECHNOLOGY, INC.
    Inventor: Trung T. Doan
  • Patent number: 7473936
    Abstract: Systems and methods are disclosed for fabricating a semiconductor light emitting diode (LED) device by forming an n-gallium nitride (n-GaN) layer on the LED device and roughening the surface of the n-GaN layer to extract light from an interior of the LED device.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: January 6, 2009
    Assignee: Semileds Corporation
    Inventors: Chuong Anh Tran, Trung Tri Doan
  • Patent number: 7473582
    Abstract: A semiconductor component includes back side pin contacts fabricated using a circuit side fabrication method. The component also includes a thinned semiconductor die having a pattern of die contacts, and conductive members formed by filled openings in the die contacts and the die. In addition, the pin contacts are formed by terminal portions of the conductive members. The fabrication method includes the steps of forming the openings and the conductive members, and then thinning and etching the die to form the pin contacts. An alternate embodiment female component includes female conductive members configured to physically and electrically engage pin contacts on a mating component of a stacked assembly.
    Type: Grant
    Filed: March 9, 2006
    Date of Patent: January 6, 2009
    Assignee: Micron Technology, Inc.
    Inventors: Alan G. Wood, Trung Tri Doan
  • Publication number: 20090002978
    Abstract: A linear lighting system has a spinal structure or spine 11 and one or more elongated optical shade assemblies 13 attachable to the spinal wherein the spinal structure can be installed at a job site separately from the shade assemblies. The optical shade assemblies contain all of the more delicate optical components of the lighting system, such as a reflector 19 and diffuser cover 21, and can be shipped and handled separately from the more durable spinal structure of the lighting system, which includes system components such as lamp sockets 15, ballasts 18, and socket and ballast wiring. The spine includes multi-function bracket structures 35, 36, 80 which support the lamp sockets and which allow for the suspension, hanging or mounting of the spine and the joining of spine sections together in a continuous run.
    Type: Application
    Filed: May 7, 2008
    Publication date: January 1, 2009
    Inventors: Michael Trung Tran, Xiaoping Wu
  • Patent number: 7470344
    Abstract: A method for dispensing a chemical, such as an edge bead removal solvent, onto a semiconductor wafer comprising the steps of dispensing the chemical selectively onto the wafer and applying a suction to the area immediately surrounding the location at which the chemical is dispensed onto the wafer. Preferably, the suction is applied substantially simultaneously with the dispensing of the chemical. One specific version of the invention provides an edge bead removal system wherein suction is applied to the area immediately surrounding the solvent dispensing nozzle to remove dissolved coating material and excess solvent from the wafer. In one aspect of this system, an apparatus for removing the edge bead includes a mechanism for dispensing a solvent selectively onto the edge of the wafer, and a mechanism surrounding the dispensing mechanism for vacuuming excess solvent and dissolved coating material from the edge of the wafer.
    Type: Grant
    Filed: August 31, 2000
    Date of Patent: December 30, 2008
    Assignee: Micron Technology, Inc.
    Inventor: Trung T. Doan
  • Patent number: 7471701
    Abstract: The present invention provides a method that will enable a wireless telephone user to more easily download information and data by from locations accessed via a communication network. This invention accomplishes this task by expanding the bandwidth of the receiving telephone device such that the bandwidth is sufficient to receive the transmitted data. The present invention expands this bandwidth at the receiver location by combining the bandwidth of the additional wireless telephones with the bandwidth of one requester telephone and receiving a portion of the information at each of the wireless telephones.
    Type: Grant
    Filed: August 19, 2004
    Date of Patent: December 30, 2008
    Assignee: International Business Machines Corporation
    Inventors: Dharmesh N. Bhatkata, Trung Ly, Juan Francisco Obas, Lakshmi Potluri
  • Patent number: 7465406
    Abstract: In certain implementations, methods and apparatus include an antenna assembly having at least two overlapping and movable surface microwave plasma antennas. The antennas have respective pluralities of microwave transmissive openings formed therethrough. At least some of the openings of the respective antennas overlap with at least some of the openings of another antenna, and form an effective plurality of microwave transmissive openings through the antenna assembly. Microwave energy is passed through the effective plurality of openings of the antenna assembly and to a flowing gas effective to form a surface microwave plasma onto a substrate received within the processing chamber. At least one of the antennas is moved relative to another of the antennas to change at least one of size and shape of the effective plurality of openings through the antenna assembly effective to modify microwave energy passed through the antenna assembly to the substrate.
    Type: Grant
    Filed: June 7, 2006
    Date of Patent: December 16, 2008
    Assignee: Micron Technology, Inc.
    Inventors: Guy T. Blalock, Trung Tri Doan
  • Publication number: 20080293171
    Abstract: Systems and methods are disclosed for fabricating a semiconductor light emitting diode (LED) device by forming an n-gallium nitride (n-GaN) layer on the LED device and roughening the surface of the n-GaN layer to extract light from an interior of the LED device.
    Type: Application
    Filed: January 23, 2008
    Publication date: November 27, 2008
    Inventors: Chuong Anh Tran, Trung Tri Doan
  • Patent number: 7452739
    Abstract: A method for the separation of multiple dies during semiconductor fabrication is described. On an upper surface of a semiconductor wafer containing multiple dies, metal layers are deposited everywhere except where a block of stop electroplating material exists. The stop electroplating material is obliterated, and a barrier layer is formed above the entire remaining structure. A sacrificial metal element is added above the barrier layer, and then the substrate is removed. After the semiconductor material between the individual dies is eradicated, any desired bonding pads and patterned circuitry are added to the semiconductor surface opposite the sacrificial metal element, a passivation layer is added to this surface, and then the sacrificial metal element is removed. Tape is added to the now exposed barrier layer, the passivation layer is removed, the resulting structure is flipped over, and the tape is expanded to separate the individual dies.
    Type: Grant
    Filed: March 6, 2007
    Date of Patent: November 18, 2008
    Assignee: Semi-Photonics Co., Ltd.
    Inventors: Chen-Fu Chu, Trung Tri Doan, Hao-Chun Cheng, Feng-Hsu Fan, Fu-Hsien Wang
  • Patent number: 7446393
    Abstract: The present invention is related to methods and apparatus that allow a chalcogenide glass such as germanium selenide (GexSe1-x) to be doped with a metal such as silver, copper, or zinc without utilizing an ultraviolet (UV) photodoping step to dope the chalcogenide glass with the metal. The chalcogenide glass doped with the metal can be used to store data in a memory device. Advantageously, the systems and methods co-sputter the metal and the chalcogenide glass and allow for relatively precise and efficient control of a constituent ratio between the doping metal and the chalcogenide glass. Further advantageously, the systems and methods enable the doping of the chalcogenide glass with a relatively high degree of uniformity over the depth of the formed layer of chalcogenide glass and the metal. Also, the systems and methods allow a metal concentration to be varied in a controlled manner along the thin film depth.
    Type: Grant
    Filed: February 26, 2007
    Date of Patent: November 4, 2008
    Assignee: Micron Technology, Inc.
    Inventors: Jiutao Li, Allen McTeer, Gregory Herdt, Trung T. Doan
  • Patent number: D583167
    Type: Grant
    Filed: November 22, 2006
    Date of Patent: December 23, 2008
    Inventors: Michael John Stengel, Trung Q. Do