Abstract: Asymmetric intraocular lenses (IOLs) are disclosed in which the centration of the optic and the pupil can be adjusted in order to reduce dsyphotopsia and/or the perception of dark shadows. For example, IOLs with uneven haptics are disclosed such that the center of the optic (i.e., the optical axis) is offset from a centerline of the overall device.

Abstract: A hermetic pressure connector which provides a pressure-tight, electrically conductive connection through a hole in a bulkhead. The connector includes a transverse support member having a high pressure side and an opposite low pressure side. A passage extends through the transverse support member between the opposite sides. A conductor pin having an axial portion extends through the passage. An insulating sleeve surrounds at least the axial portion of the conductor pin, thereby electrically insulating the transverse support member from the conductor pin. A molded connected body surrounds at least a central portion of the conductor pin at least at one of the high and low pressure sides to thereby mechanically support the conductor pin in the passage. The molded connector body is directly sealingly engaged with the conductor pin, the insulating sleeve and the transverse support member.

Abstract: An apparatus for interfacing a test head to a peripheral system is provided. The apparatus includes a first unit having a first connection member for providing electrical communication with the peripheral system, a second unit having a second connection member for providing electrical communication with the test system, and pivot members coupling the first unit and the second unit. The pivot members enable motion in the following sequence as one of the first and second unit moves towards the other: a) pivotal motion between the first connection member and the second connection member; and b) linear motion which decreases linear distance between the first connection member and the second connection member while maintaining respective contact surfaces of the first and second connection members in parallel.

Abstract: An apparatus for interfacing a test head to a peripheral system is provided. The apparatus includes a first unit having a first connection member for providing electrical communication with the peripheral system, a second unit having a second connection member for providing electrical communication with the test system, and pivot members coupling the first unit and the second unit. The pivot members enable motion in the following sequence as one of the first and second unit moves towards the other: a) pivotal motion between the first connection member and the second connection member; and b) linear motion which decreases linear distance between the first connection member and the second connection member while maintaining respective contact surfaces of the first and second connection members in parallel.

Abstract: An apparatus for microfluidic mixing having a first fluid inlet for a first fluid operatively connected to a first fluid channel. A second fluid inlet is provided for a second fluid operatively connected to a second fluid channel. The second fluid channel operatively intersects the first fluid channel for introduction of the second fluid into the first fluid channel. The first fluid channel has an outlet end remote from that of the first fluid inlet, and at least one contraction intermediate the intersection of the first fluid channel with the second fluid channel and the at least one outlet end, or intermediate the first fluid inlet and the intersection of the first fluid channel with the second fluid channel. A corresponding method is also disclosed.

Abstract: A system includes a semiconductor component having a base die and a secondary die flip chip mounted to the base die. The base die includes a set of stacking contacts for flip chip mounting the secondary die to the base die, and a set of interconnect contacts configured as an internal signal transmission system, and a physical structure for supporting a terminal contact system of the package component. The component also includes an encapsulant on the base die encapsulating the interconnect contacts, an underfill layer between the dice, and terminal contacts configured for flip chip mounting the package component to a supporting substrate.

Abstract: An atomic layer deposition method includes positioning a semiconductor substrate within an atomic layer deposition chamber. A first deposition precursor is fed to the chamber under first vacuum conditions effective to form a first monolayer on the substrate. The first vacuum conditions are maintained at least in part by a first non-roughing vacuum pump connected to the chamber and through which at least some of the first deposition precursor flows. After forming the first monolayer, a purge gas is fed to the chamber under second vacuum conditions maintained at least in part by a second non-roughing vacuum pump connected to the chamber which is different from the first non-roughing vacuum pump and through which at least some of the purge gas flows. An atomic layer deposition apparatus is disclosed.

Abstract: Systems and methods for fabricating a light emitting diode include forming a multilayer epitaxial structure above a carrier substrate; depositing at least one metal layer above the multilayer epitaxial structure; removing the carrier substrate.

Abstract: A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to simulate the components from the substrate. Prior to the simulating step the components can be tested and burned-in while they remain on the substrate.

Abstract: A memory device includes a housing, a memory within the housing, and a first electrical interface accessible on a top surface of the housing and a second electrical interface accessible on a bottom surface of the housing. As such, at least one of the first electrical interface and the second electrical interface is configured to establish electrical connection of the memory device with an electrical interface of another memory device when the memory device and the another memory device are in a stacked configuration.

Abstract: A printing apparatus including: an imaging mechanism; a drum for advancing media sheets past the imaging mechanism for printing; an encoder coupled to the drum; a controller coupled to the encoder; and, a memory coupled to the controller and containing controller executable code and at least one table including a plurality of data entries each indicative of one of a plurality of sequential drum positions and at least one associated action; wherein, the controller executable code, when executed by the controller, causes the controller, for each data entry in the table, to: communicate data indicative of the indicated drum position to the encoder; receive an indication that the drum has rotated to the communicated drum position; responsively to the received indication, initiate the indicated associated action; and communicate data indicative of another of the data entries' associated drum position to the encoder responsively to the received indication.

Abstract: The invention relates to tear-back thermoformed high impact polystyrene lids having from at least 10% to about 15% of filler and the specified configuration of the tear-back portion. In particular, the tear back lid comprises a tear back portion defined by two sets of tear back indentations and a left and a right notch cut into a skirt defined by the outer diameter of the lid. The combination of the filler amount and tear-back configuration allows an improved tearability for the filled polystyrene lids.

Abstract: The present disclosure suggests several systems and methods for batch processing of microfeature workpieces, e.g., semiconductor wafers or the like. One exemplary implementation provides a method of depositing a reaction product on each of a batch of workpieces positioned in a process chamber in a spaced-apart relationship. A first gas may be delivered to an elongate first delivery conduit that includes a plurality of outlets spaced along a length of the conduit. A first gas flow may be directed by the outlets to flow into at least one of the process spaces between adjacent workpieces along a first vector that is transverse to the direction in which the workpieces are spaced. A second gas may be delivered to an elongate second delivery conduit that also has outlets spaced along its length. A second gas flow of the second gas may be directed by the outlets to flow into the process spaces along a second vector that is transverse to the first direction.

Abstract: A method for retaining lubrication in a splined joint comprises the steps of forming a seal between an inward surface of a grease seal cup and a first component, forming another seal between an outward surface of the grease seal cup and a sealing member extending from a second component, and engaging an end portion of the grease seal cup with an end portion of the first component, so that the end portion of the grease seal cup resists axial displacement of the grease seal cup during engagement of the first component with the second component. The grease seal cup of the method has a cylindrical portion integral with the end portion. The cylindrical portion has a tapered annular wall with the inward and outward surfaces. The end portion of the grease seal cup extends radially and inwardly from the cylindrical portion, so that the tapered annular wall is squeezed between the first component and the sealing member.

Abstract: A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.

Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

Abstract: Methods are disclosed for forming a vertical semiconductor light emitting diode (VLED) device having an active layer between an n-doped layer and a p-doped layer; and securing a plurality of balls on a surface of the n-doped layer of the VLED device.

Abstract: In one embodiment, a super class that contains a plurality of matching rules is generated. The matching rules of the super class are converted into a hierarchical arrangement of lookup tables and equivalence sets, the hierarchical arrangement having a plurality of levels including a first level and a final level. A final equivalence set is associated with the final level. The lookup tables and final equivalence set are then used to generate a results table that indicates a network packet is associated with a particular class.

Abstract: A die-wafer package includes a singulated semiconductor die having a first plurality of bond pads on a first surface and a second plurality of bond pads on a second opposing surface thereof. Each of the first and second pluralities of bond pads includes an under-bump metallization (UBM) layer. The singulated semiconductor die is disposed on a semiconductor die site of a semiconductor wafer and a first plurality of conductive bumps electrically couples the first plurality of bond pads of the singulated semiconductor die with a first set of bond pads formed on the semiconductor die site. A second plurality of conductive bumps is disposed on a second set of bond pads of the semiconductor die site. A third plurality of conductive bumps is disposed on the singulated semiconductor die's second plurality of bond pads. The second and third pluralities of conductive bumps are configured for electrical interconnection with an external device.