Abstract: A sealing unit includes a mismatched metal-to-metal seal and an o-ring seal with a vent hole therebetween. The mismatched metal-to-metal seal may provide a sealing surface between two metals that may withstand high temperatures and pressure while avoiding leakage over many cycles. The sealing units of the present invention may provide a seal capable of withstanding pressures greater than about 5,000 psig, and typically greater than 6,000 psig, and more typically greater than 7,000 psig; and temperatures greater than about 300° F., and typically greater than about 400° F., and more typically greater than about 500° F. over a service life of more than 5,000 cycles. By providing a vent hole between the metal-to-metal seal and the o-ring seal, should either seal leak, damage to the other/good seal may be prevented by expelling the leak out of the system.

Abstract: A system and method for facilitating communication between a first user and a second user in which contact information is received for said second user at a presence query task, via an adjunct application server. The presence status of the second user is checked and sent to the adjunct application server. The presence status is then provided from the adjunct application server, through a telephony switch to the first user. The presence status is provided to the first user in the form of an audible indication.

Abstract: Techniques for dicing wafer assemblies containing multiple metal device dies, such as vertical light-emitting diode (VLED), power device, laser diode, and vertical cavity surface emitting laser device dies, are provided. Devices produced accordingly may benefit from greater yields and enhanced performance over conventional metal devices, such as higher brightness of the light-emitting diode and increased thermal conductivity. Moreover, such techniques are applicable to GaN-based electronic devices in cases where there is a high heat dissipation rate of the metal devices that have an original non- (or low) thermally conductive and/or non- (or low) electrically conductive carrier substrate that has been removed.

Abstract: The invention includes a method of forming a rugged semiconductor-containing surface. A first semiconductor layer is formed over a substrate, and a second semiconductor layer is formed over the first semiconductor layer. Subsequently, a third semiconductor layer is formed over the second semiconductor layer, and semiconductor-containing seeds are formed over the third semiconductor layer. The seeds are annealed to form the rugged semiconductor-containing surface. The first, second and third semiconductor layers are part of a common stack, and can be together utilized within a storage node of a capacitor construction. The invention also includes semiconductor structures comprising rugged surfaces. The rugged surfaces can be, for example, rugged silicon.

Abstract: A proton exchange membrane fuel cell comprises a membrane formed from a fluorocarbon ionic polymer material capable of being bonded to an acrylic, preferably a polymethylmethacrylate polymer, and at least one desirably electrically conductive plate bonded to an area of a face of the membrane via an acrylic plastic material. The bond may be accomplished by positioning a layer of the acrylic plastic material between a surface of the plate and an area of a face of the membrane. Alternatively, the plate may be constructed of the acrylic plastic material and a surface thereof may be bonded directly to an area of a face of the membrane.

Abstract: The present invention is directed to a collapsible easel with foldable legs adapted to support a flip chart or other display device. The invention comprises a display panel having a top edge, a bottom edge, a first side, a second side, a front side, and a rear side. The bottom edge of the display panel has a transverse shelf extending from the display panel to support writing instruments or other equipment. In an embodiment, a three-leg assembly, having a rear leg and two front legs, is adapted to be connected to the display panel. Each leg has an upper portion and a lower portion. The lower portion of each front leg has a generally curved contour. The upper and lower portions of each leg are connected by a flexible strap having a first end and a second end; each end of the flexible strap has at least one aperture to connect the strap by a fastening mechanism to an interior wall of each upper portion and lower portion of each leg.

Abstract: A first precursor gas is flowed to the substrate within the chamber effective to form a first monolayer on the substrate. A second precursor gas different in composition from the first precursor gas is flowed to the first monolayer within the chamber under surface microwave plasma conditions within the chamber effective to react with the first monolayer and form a second monolayer on the substrate which is different in composition from the first monolayer. The second monolayer includes components of the first monolayer and the second precursor. In one implementation, the first and second precursor flowings are successively repeated effective to form a mass of material on the substrate of the second monolayer composition. Additional and other implementations are contemplated.

Abstract: A bone fixation device is provided with an elongate body having a longitudinal axis and having a flexible state and a rigid state, a plurality of grippers disposed at longitudinally spaced locations of the elongated body, a curved rigid hub connected to the elongated body, and an actuator operably connected to the grippers to deploy the grippers from a first shape to an expanded second shape. Methods of repairing a fracture of a bone are also disclosed. One such method comprising inserting a bone fixation device into an intramedullary space of the bone to place at least a portion of an elongate body of the fixation device in a flexible state on one side of the fracture and at least a portion of a curved rigid hub on another side of the fracture, and operating an actuator to deploy a plurality of grippers of the fixation device to engage an inner surface of the intramedullary space to anchor the fixation device to the bone.

Abstract: Controlling a bitline bias voltage by sensing the bitline bias voltage, modifying a bitline bias control signal in accordance with the sensed bitline bias voltage, and controlling the bitline bias voltage in accordance with the modified bitline bias control signal. The modifying the bitline bias control signal is carried out by enabling a pull up circuit and disabling a pull down circuit in response to a first control signal and disabling the pull up circuit and enabling the pull down circuit in response to a second control signal.

Abstract: Controlling a bitline bias voltage by sensing the bitline bias voltage, modifying a bitline bias control signal in accordance with the sensed bitline bias voltage, and controlling the bitline bias voltage in accordance with the modified bitline bias control signal. The modifying the bitline bias control signal is carried out by enabling a pull up circuit and disabling a pull down circuit in response to a first control signal and disabling the pull up circuit and enabling the pull down circuit in response to a second control signal.

Abstract: In accordance with one embodiment, a method comprises querying, with a querying component, a print engine to ascertain one or more printmodes that are supported by the print engine, and, receiving, responsive to the querying, a list that describes printmodes supported by the print engine.

Abstract: A semiconductor package component includes a base die and a secondary die flip chip mounted to the base die. The base die includes a set of stacking contacts for flip chip mounting the secondary die to the base die, and a set of interconnect contacts configured as an internal signal transmission system, and a physical structure for supporting a terminal contact system of the package component. The package component also includes an encapsulant on the base die encapsulating the interconnect contacts, an underfill layer between the dice, and terminal contacts configured for flip chip mounting the package component to a supporting substrate. A method for fabricating the package component includes the steps of providing a base wafer containing a plurality of base dice, and flip chip mounting the secondary dice to the base dice on the base wafer.

Abstract: The invention is directed to a device that functions as an adaptor for a micro-memory card. The device includes a port to receive the micro-memory card and an internal interface within the port allows for electrical connection between the device and the micro-memory card. The device also includes a card interface that conforms to a standard sized memory card. The device can be inserted into another device that accepts such standard sized memory card so that the other device can store data onto the micro-memory card connected to the port. In addition, the device also includes a host interface, such as an external shieldless USB tab protruding from an edge of the device, or a wireless USB interface to allow for wireless USB communication.

Abstract: A method of forming an opening in a bone comprising: inserting a tip of a curved rigid tool into an entry point in the bone and advancing the tool along a curved path into the bone. Another aspect of the invention provides an orthopedic tool comprising a rigid curved body having a diameter suitable for insertion into a bone and a sharp tip at a distal end of the curved body.

Abstract: A cart for securing an transporting audiovisual equipment comprises two pairs of leg assemblies wherein each leg assembly is parallel and faces the other leg assembly. Each pair of legs further comprises individual legs secured to one another. Each leg has a bottom end, a top end, and an outer wall. In one embodiment, at least one of the legs has a hollow channel extending through at least on hollow leg. The hollow leg also comprises at least one aperture extending through the outer wall of the leg and communicating with the hollow channel. A top shelf is removably mounted at the top end of the legs and may also comprise at least one aperture near a corner of the shelf which communicates with the channel in the hollow leg.

Abstract: A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.

Abstract: A white light source using solid state technology, as well as general backlight units and liquid crystal displays (LCDs) that may incorporate such a white light source, are provided. The white light source described herein utilizes a monochrome light-emitting diode (LED) and a wavelength-converting layer having fluorescent materials to produce a substantially uniform broadband optical spectrum visible as white light. Being constructed on a metal substrate, the white light source may also provide for an improved heat transfer path over conventional solid state white light sources.

Abstract: Systems and methods are disclosed for producing vertical LED array on a metal substrate; evaluating said array of LEDs for defects; destroying one or more defective LEDs; forming good LEDs only LED array suitable for wafer level package.

Abstract: A collapsible easel for holding items to be displayed, the easel having a top assembly and a base assembly. The base assembly includes two front legs and a rear leg, each leg pivotally mounted to the top assembly with cushion members forcing part of the top assembly to provide a slight restriction against pivoted movement of the two front legs. A V-shaped spring assembly is pivotally mounted on the rear leg, and is removably attached to each front leg. Insertion of portions of the spring assembly into apertures in the front legs, allows the easel to stand in a tripod configuration. Removal of portions of the V-shaped spring assembly from the apertures in the front legs allows the legs to be folded together. In another embodiment, a collapsible brace assembly connects the rear leg to the front legs. The collapsible brace assembly comprises a pair of lateral struts extending between and engaging each of the front legs and a bracket connecting the lateral struts.