Abstract: According to one embodiment, a semiconductor memory device comprises: first to fourth memory cells, each of which is configured to have a first resistance state or a second resistance state; and a first circuit configured to output first data based on a first signal representing a resistance state of the first memory cell and a second signal representing a resistance state of the second memory cell, output second data based on the second signal and a third signal representing a resistance state of the third memory cell, and output third data based on the third signal and a fourth signal representing a resistance state of the fourth memory cell.

Abstract: According to one embodiment, a memory device includes: a magnetoresistive element including first and second magnetic layers and a non-magnetic layer provided between the first and second magnetic layers; and a write circuit which controls a first writing setting magnetization of the first and second magnetic layers in a parallel state and a second writing setting the magnetization of the first and second magnetic layers in an antiparallel state, and applies a current pulse to the magnetoresistive element. A first pulse pattern used in the first writing is different from a second pulse pattern used in the second writing.

Abstract: An electronic device includes a semiconductor memory device. The semiconductor memory device includes: a word line driving unit for driving a plurality of word lines; a first circuit area including a first cell array arranged at one side of the word line driving unit; a second circuit area including a second cell array arranged at the other side of the word line driving unit; a bias voltage generation unit arranged between the first cell array and the second cell array; a first read control unit; and a second read control unit. The first and second cell arrays include storage cells having variable resistance elements, and the bias voltage generation unit generates a bias voltage based on currents flowing through a first reference resistance element included in the first cell array and a second reference resistance element included in the second cell array.

Abstract: According to one embodiment, a memory includes a memory cell array including blocks arranged in a column direction, first and second main global conductive lines each extending from a first end to a second end of the memory cell array in the column direction, a first resistance change element connected between the first and second main global conductive lines inside the memory cell array, a first reference global conductive line extending from the first end to the second end of the memory cell array in the column direction, and a second resistance change element connected to the reference global conductive line outside the memory cell array.

Abstract: According to one embodiment, a semiconductor memory device includes a first memory cell array including a first memory cell having a variable resistive element, a second memory cell array including a second memory cell having the variable resistive element, a reference signal generation circuit which generates a reference signal, a sense amplifier having a first input terminal and a second input terminal, and a read enable control circuit which generates a read enable signal in accordance with a command from outside and control switching between a single cell read mode and a twin cell read mode.

Abstract: An electronic device includes a semiconductor device, wherein the semiconductor device includes: a word line driving unit for driving a plurality of word lines; a first cell array arranged at one side of the word line driving unit; a second cell array arranged at the other side of the word line driving unit; a bias voltage generation unit, arranged between the first cell array and the second cell array, for generating a bias voltage based on currents flowing through the first reference resistance element included in the first cell array and the second reference resistance element included in the second cell array; a first read control unit; and a second read control unit.

Abstract: According to one embodiment, a memory includes first to fourth memory cells aligned in a first direction. Each of the first to fourth memory cells comprises a cell transistor having a gate connected to a word line extending in a second direction crossing the first direction and a resistive memory element having one end connected to a first source/drain region of the cell transistor. A second source/drain region of the cell transistor is connected to one of a first bit line extending in the first direction and a second bit line extending in the second direction. The other end of the resistive memory element is connected to one of the first and second bit lines which is apart from the second source/drain region. The second source/drain regions in the first and second memory cells are shared, and the second source/drain regions in the third and fourth memory cells are shared.

Abstract: According to one embodiment, a memory device includes a memory cell, a sense amplifier, and a resistor. The sense amplifier includes a first input and a second input, outputs a signal in accordance with a difference between the first and second inputs, and is selectively coupled at a second input to the memory cell. The resistor is in a first path between the first input of the sense amplifier and a ground node.

Abstract: An electronic device includes a semiconductor device, wherein the semiconductor device includes: a word line driving unit for driving a plurality of word lines; a first cell array arranged at one side of the word line driving unit; a second cell array arranged at the other side of the word line driving unit; a bias voltage generation unit, arranged between the first cell array and the second cell array, for generating a bias voltage based on currents flowing through the first reference resistance element included in the first cell array and the second reference resistance element included in the second cell array; a first read control unit; and a second read control unit.

Abstract: According to one embodiment, a semiconductor memory device includes a first memory cell array including a first memory cell having a variable resistive element, a second memory cell array including a second memory cell having the variable resistive element, a reference signal generation circuit which generates a reference signal, a sense amplifier having a first input terminal and a second input terminal, and a read enable control circuit which generates a read enable signal in accordance with a command from outside and control switching between a single cell read mode and a twin cell read mode.

Abstract: According to one embodiment, a memory includes first to fourth memory cells aligned in a first direction. Each of the first to fourth memory cells comprises a cell transistor having a gate connected to a word line extending in a second direction crossing the first direction and a resistive memory element having one end connected to a first source/drain region of the cell transistor. A second source/drain region of the cell transistor is connected to one of a first bit line extending in the first direction and a second bit line extending in the second direction. The other end of the resistive memory element is connected to one of the first and second bit lines which is apart from the second source/drain region. The second source/drain regions in the first and second memory cells are shared, and the second source/drain regions in the third and fourth memory cells are shared.

Abstract: A semiconductor memory unit includes first to Nth variable resistance elements each having different resistance values according to values stored therein, wherein N is a natural number equal to or greater than 2; a reference resistance element having a first reference resistance value; and first to Nth comparison units which correspond to the first to Nth variable resistance elements, respectively, and each of which determines whether a resistance value of the corresponding variable resistance element is greater or less than a second reference resistance value, wherein the first to Nth comparison units are commonly coupled to the reference resistance element.

Abstract: According to one embodiment, a memory includes first to fourth memory cells aligned in a first direction. Each of the first to fourth memory cells comprises a cell transistor having a gate connected to a word line extending in a second direction crossing the first direction and a resistive memory element having one end connected to a first source/drain region of the cell transistor. A second source/drain region of the cell transistor is connected to one of a first bit line extending in the first direction and a second bit line extending in the second direction. The other end of the resistive memory element is connected to one of the first and second bit lines which is apart from the second source/drain region. The second source/drain regions in the first and second memory cells are shared, and the second source/drain regions in the third and fourth memory cells are shared.

Abstract: According to one embodiment, a memory device includes a memory cell, a sense amplifier, and a resistor. The sense amplifier includes a first input and a second input, outputs a signal in accordance with a difference between the first and second inputs, and is selectively coupled at a second input to the memory cell. The resistor is in a first path between the first input of the sense amplifier and a ground node.

Abstract: Disclosed is an electronic device including a semiconductor device, wherein the semiconductor device includes: a word line driving unit; a first cell array arranged at one side of the word line driving unit; a second cell array arranged at the other side of the word line driving unit; a bias voltage generation unit; and a read control unit.

Abstract: According to one embodiment, a resistance change memory includes a memory cell array, an address counter, a word line driver, a power supply circuit, and a write driver. Memory cells include resistive storage elements and cell transistors. The power supply circuit generates a stress voltage different from a power supply voltage used to write data into the memory cells in a normal operation. The write driver applies the stress voltage across first bit and source lines to pass a stress current through the memory cell selected by a first word line. The write driver applies the stress voltage across second bit and source lines to pass the stress current through the memory cell selected by a second word line.

Abstract: According to one embodiment, a memory device includes a memory cell, a sense amplifier, and a resistor. The sense amplifier includes a first input and a second input, outputs a signal in accordance with a difference between the first and second inputs, and is selectively coupled at a second input to the memory cell. The resistor is in a first path between the first input of the sense amplifier and a ground node.

Abstract: A semiconductor memory unit includes first to Nth variable resistance elements each having different resistance values according to values stored therein, wherein N is a natural number equal to or greater than 2; a reference resistance element having a first reference resistance value; and first to Nth comparison units which correspond to the first to Nth variable resistance elements, respectively, and each of which determines whether a resistance value of the corresponding variable resistance element is greater or less than a second reference resistance value, wherein the first to Nth comparison units are commonly coupled to the reference resistance element.

Abstract: A semiconductor storage device according to the present embodiment includes a plurality of bit lines, a plurality of word lines, and a plurality of memory cells each including a storage element and a switching element which are connected in series between adjacently paired ones of the bit lines. Gates of the switching elements of the memory cells connected between one of the adjacently paired ones of the bit lines are respectively connected to different ones of the word lines. A plurality of the storage elements and a plurality of the switching elements of the adjacent memory cells are alternately connected in series.

Abstract: According to one embodiment, a resistance change memory includes a memory cell array, an address counter, a word line driver, a power supply circuit, and a write driver. Memory cells include resistive storage elements and cell transistors. The power supply circuit generates a stress voltage different from a power supply voltage used to write data into the memory cells in a normal operation. The write driver applies the stress voltage across first bit and source lines to pass a stress current through the memory cell selected by a first word line. The write driver applies the stress voltage across second bit and source lines to pass the stress current through the memory cell selected by a second word line.