Abstract: The present disclosure discloses an electronic device including an electronic apparatus and an electric connector. The electronic apparatus includes an electric connection port. The electric connection port includes a concave trench, a first and second conductive strips are disposed in the concave trench. The first conductive strip and the second conductive strip respectively extend along an extending direction of the concave trench. The electric connector includes a first and second elastic contacts which are exposed and protruded outward. When the electric connector is plugged into the electric connection port, the first elastic contact is in contact with the first conductive strip, and the second elastic contact is in contact with the second conductive strip. The electric connection port may accommodate the electric connector, so that the electric connector may be selectively plugged to any position on the electric connection port along the extending direction of the concave trench.

Abstract: A method for forming a semiconductor device structure is provided. The method includes disposing a semiconductor substrate in a physical vapor deposition (PVD) chamber. The method also includes introducing a plasma-forming gas into the PVD chamber, and the plasma-forming gas contains an oxygen-containing gas. The method further includes applying a radio frequency (RF) power to a metal target in the PVD chamber to excite the plasma-forming gas to generate plasma. In addition, the method includes directing the plasma towards the metal target positioned in the PVD chamber such that an etch stop layer is formed over the semiconductor substrate.

Abstract: A projector device includes an illumination module and an imaging module. The imaging module is connected to the illumination module and includes a housing, a relay optical system, and a projection optical system. The housing has a first annular receiving groove and a second annular receiving groove. The first annular receiving groove is closer to the illumination module than the second annular receiving groove. A center axis line of the first annular receiving groove and a center axis line of the second annular receiving groove are on the same axis line. The relay optical system includes a lens received in the first annular receiving groove. The projection optical system includes a lens and a reflecting mirror received in the second annular receiving groove. Mirror centers of the lenses and a mirror center the reflecting mirror are located on the same axis line.

Abstract: A flat signal transfer structure of a probe card device includes a transfer plate and a retaining cover. The transfer plate has a first surface and a second surface that is opposite to the first surface. The transfer plate includes a receiving slot recessed from the first surface and a plurality of signal circuits each having a signal contact arranged at a bottom of the receiving slot. A portion of the transfer plate arranged around and adjacent to the receiving slot is defined as a supporting portion. The retaining cover has a plurality of thru-holes and is disposed on the supporting portion. The retaining cover and the receiving slot of the transfer plate jointly and surroundingly define a receiving space, and the signal contacts of the transfer plate are arranged in the receiving space.

Abstract: A three-dimensional (3D) signal transfer structure of a probe card device includes a transfer plate, a supporting frame, and a guiding plate. The transfer plate has a first surface and a second surface that is opposite to the first surface. The transfer plate includes a plurality of signal circuits each having a signal contact arranged on the first surface. The supporting frame is abutted against and fixed onto the first surface of the transfer plate. A portion of the first surface abutted against the supporting frame is arranged outside the signal contacts. The guiding plate has a plurality of thru-holes and is disposed on the supporting frame. The guiding plate, the supporting frame, and the transfer plate jointly and surroundingly define a receiving space, and the signal contacts of the transfer plate are arranged in the receiving space.

Abstract: An automatic wire arranging device includes a controller, at least one driving device electrically connected with the controller, a first wire clamping jig connected with the at least one driving device, a second wire clamping jig disposed to the first wire clamping jig, at least one charge-coupled device camera connected with the controller, and at least one puncher pin connected with the at least one driving device. The first wire clamping jig opens a plurality of first clamping slots. Each of the plurality of the first clamping slots opens a through-hole. The second wire clamping jig opens a plurality of second clamping slots. The at least one puncher pin is capable of penetrating through the through-hole and pushing against a core wire to be away from one of the plurality of the first clamping slots and be blocked in one of the plurality of the second clamping slots.

Abstract: A method of using a polishing system includes securing a wafer to a support, wherein the wafer has a first diameter. The method further includes polishing the wafer using a first polishing pad rotating about a first axis, wherein the first polishing pad has a second diameter greater than the first diameter. The method further includes rotating the support about a second axis perpendicular to the first axis after polishing the wafer using the first polishing pad. The method further includes polishing the wafer using a second polishing pad after rotating the support, wherein the second polishing pad has a third diameter less than the first diameter. The method further includes releasing the wafer from the support following polishing the wafer using the second polishing pad.

Abstract: A projector device includes an illumination module and an imaging module. The imaging module is connected to the illumination module and includes a housing, a relay optical system, and a projection optical system. The housing has a first annular receiving groove and a second annular receiving groove. The first annular receiving groove is closer to the illumination module than the second annular receiving groove. A center axis line of the first annular receiving groove and a center axis line of the second annular receiving groove are on the same axis line. The relay optical system includes a lens received in the first annular receiving groove. The projection optical system includes a lens and a reflecting mirror received in the second annular receiving groove. Mirror centers of the lenses and a mirror center the reflecting mirror are located on the same axis line.

Abstract: A probe component and a probe structure thereof are provided. The probe structure includes a first contacting segment, a first connecting segment, a second connecting segment and a second contacting segment. The first contacting segment has an abutting portion and a first end portion connected to the abutting portion. The first connecting segment is connected to the first contacting segment. The second connecting segment is connected to the first connecting segment. The second contacting segment is connected to the second connecting segment and has a second end portion.

Abstract: A polishing system includes a wafer support that holds a wafer, the wafer having a first diameter. The polishing system further includes a first polishing pad that polishes a first region of the wafer, the first polishing pad having a second diameter greater than the first diameter. The polishing system further includes an auxiliary polishing system comprising at least one second polishing pad that polishes a second region of the wafer, wherein the second polishing pad has a third diameter less than the first diameter, and the wafer support is configured to support the wafer during use of the first polishing pad and the auxiliary polishing system.

Abstract: An embodiment includes a first lead guide, a second lead guide, and a handler. The first lead guide includes a first insulating housing and a first conductive contact having a face and a recessed face. The second lead guide includes a second insulating housing and a second conductive contact. The first and second lead guides are fastened to the handler.

Abstract: A schottky diode includes a schottky junction, an ohmic junction, a first isolation structure and a plurality of doped regions. The schottky junction includes a first well in a substrate and a first electrode contacting the first well. The ohmic junction includes a junction region in the first well and a second electrode contacting the junction region. The first isolation structure is disposed in the substrate and separates the schottky junction from the ohmic junction. The doped regions are located in the first well and under the schottky junction, wherein the doped regions separating from each other constitute a top-view profile of concentric circles.

Abstract: A pressure sensing device including a light source, at least one resonant structure, a cladding body, a first substrate and a second substrate is provided. The light source is configured to provide an original broadband light. The resonant structure includes a plurality of semiconductor rod structures arranged into a row at intervals along a single arranging direction, and each of the semiconductor rod structures has a lattice constant on the arranging direction. The original broadband light is transmitted between the semiconductor rod structures, and a resonant light is produced, wherein each of the semiconductor rod structures has a length perpendicular to the arranging direction and has a width parallel to the arranging direction, the length and the width are less than the wavelength of the resonant light. The cladding body completely covers the semiconductor rod structures of the at least one resonant structure.

Abstract: A method for manufacturing semiconductor structure is disclosed. The method includes: providing a semiconductor substrate; hydrogenizing a surface of the semiconductor substrate; supplying a precursor to the surface of the semiconductor substrate; and supplying a reactant to the surface of the semiconductor substrate. An associated method for performing an atomic layer deposition (ALD) upon a semiconductor substrate and an associated atomic layer deposition (ALD) method are also disclosed.

Abstract: A device includes a pedestal. The pedestal includes a ground electrode, a central portion, and a peripheral portion. The ground electrode includes a top surface from which the peripheral portion is projected, thereby having a height difference between the central portion and the peripheral portion.

Abstract: The inventive subject matter provides compositions and methods for producing high dose, high bioavailability oral taxane compositions. Oral taxanes are prepared as an amorphous solid dispersion, and can be provided in a compressed tablet form. Surprisingly oral bioavailability of taxanes prepared and provided in this matter is high, even in the absence of surfactants.

Abstract: The present disclosure discloses an electronic device including an electronic apparatus and an electric connector. The electronic apparatus includes an electric connection port. The electric connection port includes a concave trench, a first and second conductive strips are disposed in the concave trench. The first conductive strip and the second conductive strip respectively extend along an extending direction of the concave trench. The electric connector includes a first and second elastic contacts which are exposed and protruded outward. When the electric connector is plugged into the electric connection port, the first elastic contact is in contact with the first conductive strip, and the second elastic contact is in contact with the second conductive strip. The electric connection port may accommodate the electric connector, so that the electric connector may be selectively plugged to any position on the electric connection port along the extending direction of the concave trench.

Abstract: A pressure sensing touch device includes a control unit, and a pressure-sensing touch panel including a substrate, a first sensing layer, a first insulating layer, a driver layer, a second insulating layer and a second sensing layer; the first sensing layer, the driver layer and the second sensing layer electrically connected to the control unit for detecting the touch location of an external object and the pressure according to changes of capacitive coupling respectively between the first sensing layer and the driver layer and between the driver layer and the second sensing electrode. The deformation amount of the second insulating layer is greater than that of the first insulating layer when receiving a pressure, making closer distance between the driver layer and the second sensing layer and significant change of the capacitive coupling, for accurately detecting the pressure applied by the external object to the pressure-sensing touch panel.

Abstract: A gesture control method is provided. The method includes: obtaining gesture images with depth information; creating a coordinate system; determining coordinates of a center of each camera, a start position and an end position of the gesture; calculating directions and values of a first angle defined from an axle through the end position to a line connecting between the start position and the end position and at least two second angles each defined a vertical axle through a center of a camera to a line connecting the center of the camera and the start position, each second angle corresponding to a camera of an electronic device; and determining an electronic device to be a controlled device, wherein the electronic device corresponds to a second angle in a same direction with the first angle having a minimum absolute difference with the first angle.

Abstract: A method for fabricating an electronic package is provided, including steps of: providing a carrier having at least an electronic element and at least a package block disposed thereon, wherein the package block has a plurality of conductive posts bonded to the carrier; forming an encapsulant on the carrier for encapsulating the electronic element and the package block; and removing the carrier so as to expose the electronic element and the conductive posts from a surface of the encapsulant. As such, the invention dispenses with formation of through holes in the encapsulant for forming the conductive posts as in the prior art, thereby saving the fabrication cost.