Abstract: A method, mobile device and system for creating new mobile applications by fusing existing program stacks are disclosed. The system includes a number of mobile devices and a remote server. By using a modification program installed in the mobile device, the stacks can be restored to source codes, objects and user interfaces. Drag-and-drop editing and moderate modification on the source codes can be processed, further simplifying steps for creating new mobile applications. It not only benefits learners to study programming at younger ages, but also enables the creation of an on-line store which allows innovative stacks to be shared or sold thereby.

Abstract: A situational programming teaching method and a computer program product are disclosed. The method includes steps of: A. providing an interactive message frame and a virtual object on a screen of an electronic device, wherein the virtual object has a virtual object characteristic which can be modified; B. showing a description of a modification of the virtual object characteristic in the interactive message frame, wherein the modification will be taught later; C. showing codes for modifying the virtual object characteristic in the interactive message frame; D. showing the modification of the virtual object characteristic by the virtual object; and E. showing the codes for modifying the virtual object characteristic in the interactive message frame for learners' further modification. The present invention solves entry barriers for smaller or novice learners in learn programming.

Abstract: A fabrication method of a semiconductor package includes the steps of: forming a release layer on a carrier having concave portions; disposing chips on the release layer in the concave portions of the carrier; forming an encapsulant on the chips and the release layer; forming a bonding layer on the encapsulant; removing the release layer and the carrier so as to expose the active surfaces of the chips; and forming a circuit structure on the encapsulant and the chips. Since the release layer is only slightly adhesive to the chips and the encapsulant, the present invention avoids warpage of the overall structure during a thermal cycle caused by incompatible CTEs.

Abstract: A polishing system for polishing a semiconductor wafer includes a wafer support for holding the semiconductor wafer, and a first polishing pad for polishing a region of the semiconductor wafer. The semiconductor wafer has a first diameter, and the first polishing pad has a second diameter shorter than the first diameter.

Abstract: A thin film deposition system and method provide for multiple target assemblies that may be separately powered. Each target assembly includes a target and associated magnet or set of magnets. The disclosure provides a tunable film profile produced by multiple power sources that separately power the target arrangements. The relative amounts of power supplied to the target arrangements may be customized to provide a desired film and may be varied in time to produce a film with varied characteristics.

Abstract: A packaging substrate includes a base body having at least a conductive pad on a surface thereof, a dielectric layer formed on the surface of the base body and having at least a first opening for exposing the conductive pad and at least a second opening formed at a periphery of the first opening, and a metal layer formed on the conductive pad and the dielectric layer and extending to a sidewall of the second opening, thereby effectively eliminating side-etching of the metal layer under a solder bump.

Abstract: A gesture control method is provided. The method includes: obtaining gesture images with depth information; creating a coordinate system; determining coordinates of a center of each camera, a start position and an end position of the gesture; calculating directions and values of a first angle defined from an axle through the end position to a line connecting between the start position and the end position and at least two second angles each defined a vertical axle through a center of a camera to a line connecting the center of the camera and the start position, each second angle corresponding to a camera of an electronic device; and determining an electronic device to be a controlled device, wherein the electronic device corresponds to a second angle in a same direction with the first angle having a minimum absolute difference with the first angle.

Abstract: A pharmaceutical composition comprises a taxane (e.g., paclitaxel, docetaxel, cabazitaxel, larotaxel, ortataxel, and/or tesetaxel) in a mixture of first and second surfactants. The absorption of the taxane is increased from the pharmaceutical composition is greater than the sum of the absorption of docetaxel from either the first or the second surfactant. The increase in absorption is especially enhanced when the ratio of the first surfactant to the second surfactant in the pharmaceutical composition is between 60:40 and 85:15 by weight, and the total surfactant weight does not exceed 98% of the total weight. Polysorbate 80, polysorbate 20, and caprylocaproyl polyoxylglycerides serve as suitable first surfactants, and polysorbate 80 or polyethyoxylated castor oil serve as suitable second surfactants. The stability of the pharmaceutical composition may be enhanced by further including a stabilizer (e.g., citric acid and/or ascorbic acid).

Abstract: A magnetic scanning method includes acquiring an image from a storage device of a magnetic scanning device, controlling a magnetic read-write head of the magnetic scanning device to touch a reference point on a plane, generating an electric signal which reflects relevant information of the acquired image, inputting the electric signal reflecting the relevant information of the acquired image to the magnetic read-write head, when the electric signal reflecting the relevant information of the acquired image flows through the magnetic read-write head, controlling the magnetic read-write head to generate a magnetic field corresponding to the electric signal, controlling the magnetic read-write head to move and scan the plane from the reference point, to magnetize the magnetic powder on the plane by the magnetic field, and driving the magnetic powder to move relatively to generate an image similar to the acquired image.

Abstract: An electronic device package and manufacturing method are provided, including steps of: providing a carrier having at least an electronic element and at least a package block disposed thereon, wherein the package block has a plurality of conductive posts bonded to the carrier; forming an encapsulant on the carrier for encapsulating the electronic element and the package block; and removing the carrier so as to expose the electronic element and the conductive posts from a surface of the encapsulant. As such, the invention dispenses with formation of through holes in the encapsulant for forming the conductive posts as in the prior art, thereby saving the fabrication cost.

Abstract: A method and a system for creating APPs are disclosed. The method includes steps: installing a first APP to a mobile device; executing the first APP to show an editing interface on the mobile device; editing a code and content data corresponding to the code in the editing interface, respectively; storing the code and the content data to a storage block in a sandbox frame by an operating system of the mobile device; compiling the code and the content data as an object file by a compiler installed in the mobile device; and converting the object file into a second APP which is executable in the operating system by a linker installed in the mobile device. An advantage of the present invention is that APPs can be created in a mobile device.

Abstract: A semiconductor device is provided, including: a substrate having opposing first and second surfaces and a plurality of conductive vias passing through the first and second surfaces; an insulating layer formed on the first surface of the substrate and exposing end portions of the conductive vias therefrom; and a buffer layer formed on the insulating layer at peripheries of the end portions of the conductive vias, thereby increasing product reliability and good yield.

Abstract: Disclosed is a multilayer interposer with high bonding strength, which is used in wafer testing. The multilayer interposer with high bonding strength comprises a plurality of thin-film layer structures overlapping sequentially. One of the thin-film layer structures comprises at least one first conductive blind via. An interconnection layer electrically connected to the first conductive blind via is configured on the surface of the one of the thin-film layer structures, and the interconnection layer comprises at least one head portion. Another one of the thin-film layer structures comprises at least one second conductive blind via. The bottom of the second conductive blind via contacts both of the corresponding head portion and part of the surface of the one of the thin-film layer structures. Thereby, the bonding strength between layers can be dramatically increased, and the resistance to the thermal shock can be also increased.

Abstract: A semiconductor device is provided, including: a substrate having opposing first and second surfaces and a plurality of conductive vias passing through the first and second surfaces; an insulating layer formed on the first surface of the substrate and exposing end portions of the conductive vias therefrom; and a buffer layer formed on the insulating layer at peripheries of the end portions of the conductive vias, thereby increasing product reliability and good yield.

Abstract: Methods of making an integrated circuit are disclosed. An embodiment method includes etching a trench in a silicon substrate, depositing a first layer of isolation material in the trench, the first layer of isolation material projecting above surface of the silicon substrate, capping the first layer of isolation material by depositing a second layer of isolation material, the second layer of isolation material extending along at least a portion of sidewalls of the first layer of isolation material, epitaxially-growing a silicon layer upon the silicon substrate, the silicon layer horizontally adjacent to the second layer of isolation material, and forming a gate structure on the silicon layer, the gate structure defining a channel.

Abstract: A semiconductor device includes a substrate; a deep well region disposed in the substrate; an element region disposed in the substrate and in the deep well region; a drain region disposed in the substrate, in the deep well region, and surrounding the element region; a gate structure disposed on the surface of the substrate, adjacent to the deep well region, and surrounding the drain region; a well region disposed in the substrate, in the deep well region, and surrounding the gate structure; a source region disposed in the substrate, in the well region, and surrounding the gate structure; a body contact region disposed separately from the source region in the well region and surrounding the source region; and an annular doped region disposed separately from the deep well region in the substrate and surrounding the deep well region.

Abstract: A method of fabricating a semiconductor package is provided, including: disposing a plurality of semiconductor elements on a carrier through an adhesive layer in a manner that a portion of the carrier is exposed from the adhesive layer; forming an encapsulant to encapsulate the semiconductor elements; removing the adhesive layer and the carrier to expose the semiconductor elements; and forming a build-up structure on the semiconductor elements. Since the adhesive layer is divided into a plurality of separated portions that will not affect each other due to expansion or contraction when temperature changes, the present invention prevents positional deviations of the semiconductor elements during a molding process, thereby increasing the alignment accuracy.

Abstract: A capacitive touch panel and a method of making it are provided. The method first sputters a layer of TCO coatings on a transparent substrate to form a conductive portion and a base portion, and then coats a layer of transparent and insulating coatings on the conductive portion to form a blocking member. Another layer of TCO coatings is also sputtered on the conductive portion, the base portion, and the blocking member to form a first detection electrode assembly and a second detection electrode assembly. The first detection electrode assembly is arranged in a first axial direction with part thereof below the blocking member, while the second detection electrode assembly is arranged in a second axial direction, and part of the second detection electrode assembly covers the blocking member without contacting the first detection electrode assembly to make the first and the second detection electrode assemblies disconnect with each other.

Abstract: A method of fabricating a semiconductor package is provided, including: disposing a plurality of semiconductor elements on a carrier through an adhesive layer in a manner that a portion of the carrier is exposed from the adhesive layer; forming an encapsulant to encapsulate the semiconductor elements; removing the adhesive layer and the carrier to expose the semiconductor elements; and forming a build-up structure on the semiconductor elements. Since the adhesive layer is divided into a plurality of separated portions that will not affect each other due to expansion or contraction when temperature changes, the present invention prevents positional deviations of the semiconductor elements during a molding process, thereby increasing the alignment accuracy.

Abstract: The present invention provides a flow detection device and numerical modeling method, the device for controlling the gas flow in the pipeline. The flow detection device includes a measurement pipe, valve control module, flow detection module and a processing module. The processing module can be detected by flow detection data a numerical model of the flow characteristics curve fitting. The processing module for feedback signal, it's for control the valve structure of open degree, with precise control of the flow.