Abstract: A packaging substrate includes a base body having at least a conductive pad on a surface thereof, a dielectric layer formed on the surface of the base body and having at least a first opening for exposing the conductive pad and at least a second opening formed at a periphery of the first opening, and a metal layer formed on the conductive pad and the dielectric layer and extending to a sidewall of the second opening, thereby effectively eliminating side-etching of the metal layer under a solder bump.

Abstract: A thin film deposition system and method provide for multiple target assemblies that may be separately powered. Each target assembly includes a target and associated magnet or set of magnets. The disclosure provides a tunable film profile produced by multiple power sources that separately power the target arrangements. The relative amounts of power supplied to the target arrangements may be customized to provide a desired film and may be varied in time to produce a film with varied characteristics.

Abstract: A pressure sensing touch device includes a control unit, and a pressure-sensing touch panel including a substrate, a first sensing layer, a first insulating layer, a driver layer, a second insulating layer and a second sensing layer; the first sensing layer, the driver layer and the second sensing layer electrically connected to the control unit for detecting the touch location of an external object and the pressure according to changes of capacitive coupling respectively between the first sensing layer and the driver layer and between the driver layer and the second sensing electrode. The deformation amount of the second insulating layer is greater than that of the first insulating layer when receiving a pressure, making closer distance between the driver layer and the second sensing layer and significant change of the capacitive coupling, for accurately detecting the pressure applied by the external object to the pressure-sensing touch panel.

Abstract: A fabrication method of a semiconductor package includes the steps of: forming a release layer on a carrier having concave portions; disposing chips on the release layer in the concave portions of the carrier; forming an encapsulant on the chips and the release layer; forming a bonding layer on the encapsulant; removing the release layer and the carrier so as to expose the active surfaces of the chips; and forming a circuit structure on the encapsulant and the chips. Since the release layer is only slightly adhesive to the chips and the encapsulant, the present invention avoids warpage of the overall structure during a thermal cycle caused by incompatible CTEs.

Abstract: A method, mobile device and system for creating new mobile applications by fusing existing program stacks are disclosed. The system includes a number of mobile devices and a remote server. By using a modification program installed in the mobile device, the stacks can be restored to source codes, objects and user interfaces. Drag-and-drop editing and moderate modification on the source codes can be processed, further simplifying steps for creating new mobile applications. It not only benefits learners to study programming at younger ages, but also enables the creation of an on-line store which allows innovative stacks to be shared or sold thereby.

Abstract: A method for forming a semiconductor device structure is provided. The method includes disposing a semiconductor substrate in a physical vapor deposition (PVD) chamber. The method also includes introducing a plasma-forming gas into the PVD chamber, and the plasma-forming gas contains an oxygen-containing gas. The method further includes applying a radio frequency (RF) power to a metal target in the PVD chamber to excite the plasma-forming gas to generate plasma. In addition, the method includes directing the plasma towards the metal target positioned in the PVD chamber such that an etch stop layer is formed over the semiconductor substrate.

Abstract: A method for fabricating an electronic package is provided, including steps of: providing a carrier having at least an electronic element and at least a package block disposed thereon, wherein the package block has a plurality of conductive posts bonded to the carrier; forming an encapsulant on the carrier for encapsulating the electronic element and the package block; and removing the carrier so as to expose the electronic element and the conductive posts from a surface of the encapsulant. As such, the invention dispenses with formation of through holes in the encapsulant for forming the conductive posts as in the prior art, thereby saving the fabrication cost.

Abstract: An apparatus comprises: a shower head having a supply plenum for supplying the gas to the chamber and a vacuum manifold fluidly coupled to the supply plenum; and at least one vacuum system fluidly coupled to the vacuum manifold of the shower head.

Abstract: An apparatus and method are disclosed for forming thin films on a semiconductor substrate. The apparatus in one embodiment includes a process chamber configured for supporting the substrate, a gas excitation power source, and first and second gas distribution showerheads fluidly coupled to a reactive process gas supply containing film precursors. The showerheads dispense the gas into two different zones above the substrate, which is excited to generate an inner plasma field and an outer plasma field over the wafer. The apparatus deposits a material on the substrate in a manner that promotes the formation of a film having a substantially uniform thickness across the substrate. In one embodiment, the substrate is a wafer. Various embodiments include first and second independently controllable power sources connected to the first and second showerheads to vary the power level and plasma intensity in each zone.

Abstract: A pressure sensing device including a light source, at least one resonant structure, a cladding body, a first substrate and a second substrate is provided. The light source is configured to provide an original broadband light. The resonant structure includes a plurality of semiconductor rod structures arranged into a row at intervals along a single arranging direction, and each of the semiconductor rod structures has a lattice constant on the arranging direction. The original broadband light is transmitted between the semiconductor rod structures, and a resonant light is produced, wherein each of the semiconductor rod structures has a length perpendicular to the arranging direction and has a width parallel to the arranging direction, the length and the width are less than the wavelength of the resonant light. The cladding body completely covers the semiconductor rod structures of the at least one resonant structure.

Abstract: A contact mechanism of an electromagnetic relay comprises a contact assembly, a movable contact assembly and a driving unit. The contact assembly comprises a bottom plate, an upper case disposed on the bottom plate, and two stationary contact heads disposed on and penetrating the upper case. The movable contact assembly comprises a central axis passing through the contact assembly, a movable contact plate disposed on the top portion of the central axis and configured to contact with or separate from the two stationary contact heads, and a cover element covering the central portion of the central axis. The driving unit is disposed around the lower portion of the central axis and configured to drive the central axis to move back and forth along the axial direction for allowing the movable contact plate to contact with or separate from the two stationary contact heads.

Abstract: A digital diagnostic system with interchangeable lenses includes a host and at least one optical lens module, wherein the host without any optical lens having curved surface includes a focus adjustment module which drives an image capture module to linearly move. Therefore, the optical system of the optical lens module can be designed independently, and no need to include focus adjustment mechanism, so that the optical design of the optical lens module can be greatly simplified, and the system allows a greater mechanism tolerance, thereby reducing manufacturing difficulty and manufacturing cost.

Abstract: A fabrication method of a semiconductor package includes the steps of: providing a carrier having a concave portion and a releasing layer formed on a surface thereof; disposing a chip on the releasing layer in the concave portion; forming an encapsulant on the chip and the releasing layer; removing the releasing layer and the carrier; and forming a circuit structure on the encapsulant and the chip. The design of the concave portion facilitates alignment of the chip to prevent it from displacement, thereby improving the product reliability. A semiconductor package fabricated by the fabrication method is also provided.

Abstract: A magnetic scanning method includes acquiring an image from a storage device of a magnetic scanning device, controlling a magnetic read-write head of the magnetic scanning device to touch a reference point on a plane, generating an electric signal which reflects relevant information of the acquired image, inputting the electric signal reflecting the relevant information of the acquired image to the magnetic read-write head, when the electric signal reflecting the relevant information of the acquired image flows through the magnetic read-write head, controlling the magnetic read-write head to generate a magnetic field corresponding to the electric signal, controlling the magnetic read-write head to move and scan the plane from the reference point, to magnetize the magnetic powder on the plane by the magnetic field, and driving the magnetic powder to move relatively to generate an image similar to the acquired image.

Abstract: A semiconductor device is provided, including: a substrate having opposing first and second surfaces and a plurality of conductive vias passing through the first and second surfaces; an insulating layer formed on the first surface of the substrate and exposing end portions of the conductive vias therefrom; and a buffer layer formed on the insulating layer at peripheries of the end portions of the conductive vias, thereby increasing product reliability and good yield.

Abstract: A method for manufacturing semiconductor structure is disclosed. The method includes: providing a semiconductor substrate; hydrogenizing a surface of the semiconductor substrate; supplying a precursor to the surface of the semiconductor substrate; and supplying a reactant to the surface of the semiconductor substrate. An associated method for performing an atomic layer deposition (ALD) upon a semiconductor substrate and an associated atomic layer deposition (ALD) method are also disclosed.

Abstract: A handler for holding an electronic device during high voltage testing includes conductive lead guides for shorting leads on one side of the isolator together and connectors connecting the lead guides to conductors.

Abstract: A method of fabricating a semiconductor package is provided, including: disposing a plurality of semiconductor elements on a carrier through an adhesive layer in a manner that a portion of the carrier is exposed from the adhesive layer; forming an encapsulant to encapsulate the semiconductor elements; removing the adhesive layer and the carrier to expose the semiconductor elements; and forming a build-up structure on the semiconductor elements. Since the adhesive layer is divided into a plurality of separated portions that will not affect each other due to expansion or contraction when temperature changes, the present invention prevents positional deviations of the semiconductor elements during a molding process, thereby increasing the alignment accuracy.

Abstract: A thin film deposition system and method provide for multiple target assemblies that may be separately powered. Each target assembly includes a target and associated magnet or set of magnets. The disclosure provides a tunable film profile produced by multiple power sources that separately power the target arrangements. The relative amounts of power supplied to the target arrangements may be customized to provide a desired film and may be varied in time to produce a film with varied characteristics.

Abstract: A polishing system includes a wafer support that holds a wafer, the wafer having a first diameter. The polishing system further includes a first polishing pad that polishes a first region of the wafer, the first polishing pad having a second diameter greater than the first diameter. The polishing system further includes an auxiliary polishing system comprising at least one second polishing pad that polishes a second region of the wafer, wherein the second polishing pad has a third diameter less than the first diameter, and the wafer support is configured to support the wafer during use of the first polishing pad and the auxiliary polishing system.