Abstract: An electronic device and an electronic device operation method are disposed. The electronic device includes a flexible element and a controller. The flexible element includes a plurality of sensing electrodes. In a stacked state, a first portion of the flexible element overlaps a second portion of the flexible element. The controller is electrically connected to the plurality of the sensing electrodes of the flexible element. The controller receives a first signal from the plurality of sensing electrodes in the first portion and receives a second signal from the plurality of the sensing electrodes in the second portion.

Abstract: A backside metallized compound semiconductor device includes a compound semiconductor wafer and a metal layered structure. The compound semiconductor wafer includes a substrate having opposite front and back surfaces, and a ground pad structure formed on the front surface. The substrate is formed with a via extending from the back surface to the front surface to expose a side wall of the substrate and a portion of the ground pad structure. The metal layered structure is disposed on the back surface, and covers the side wall and the portion of the ground pad structure. The metal layered structure includes an adhesion layer, a seed layer, a gold layer, and an electroplated copper layer that are formed on the back surface in such order. The method for manufacturing the backside metallized compound semiconductor device is also disclosed.

Abstract: The disclosure provides a display device. The display device includes a display panel and a vibration generating module. The vibration generating module is attached to the display panel and includes a substrate, a circuit layer, and a plurality of vibrators. The circuit layer and the plurality of vibrators are disposed on the substrate, and the plurality of vibrators are electrically connected to the circuit layer.

Abstract: A display including a screen, a bracket, a hanging element and a fixing element is provided. The support is connected to the screen and has a top end and a bottom end. The hanging element is disposed on the top end. The fixing element is disposed at the bottom end. When the hanging element is hung on an upper edge of a plate, the fixing element is fixed on a surface of the plate.

Abstract: A display device includes a patterned substrate, a plurality of light emitting unit, a first insulating layer and a sensing layer. The patterned substrate has a plurality of island structures and a plurality of bridge structures, and at least one bridge structure connects two adjacent island structures. At least one light emitting unit is disposed on one of the two adjacent island structures. The first insulating layer is disposed on the light emitting units. The sensing layer is disposed on the first insulating layer and has a mesh unit, the mesh unit has a mesh frame and an opening, and the at least one light emitting unit is disposed in the opening.

Abstract: The present disclosure provides a multi-state one-time programmable (MSOTP) memory circuit including a memory cell and a programming voltage driving circuit. The memory cell includes a MOS storage transistor, a first MOS access transistor and a second MOS access transistor electrically connected to store two bits of data. When the memory cell is in a writing state, the programming voltage driving circuit outputs a writing control potential to the gate of the MOS storage transistor, and when the memory cell is in a reading state, the programming voltage driving circuit outputs a reading control potential to the gate of the MOS storage transistor.

Abstract: A multi-function device includes a machine base, a plurality of horizontal bars, at least one gantry, a plurality of processing units and at least one first conveying uni. The horizontal bars are disposed at the top of the machine base. The gantry is disposed on the machine base and disposed over the horizontal bars. The processing unit is disposed on the horizontal bars and the gantry. The first conveying unit is disposed on the machine base. Each processing unit is a processing device capable of being replaced according to actual requirements, such as a soldering flux device, a soldering device, a sucking device, a glue dipping device, a glue dispensing device, a detecting device, a cleaning device or other processing devices. The present invention can integrate different types of manufacturing devices into one device, and the quantities of the horizontal bars and the modules thereof are not limited.

Abstract: Structures and methods for trench isolation are disclosed. In one example, a silicon-on-insulator (SOI) structure is disclosed. The SOI structure includes: a substrate, a dielectric layer and a polysilicon region. The substrate includes: a handle layer, an insulation layer arranged over the handle layer, a buried layer arranged over the insulation layer, and a trench extending downward from an upper surface of the buried layer and terminating in the handle layer. The dielectric layer is located on a bottom surface of the trench and contacting the handle layer. The polysilicon region is located in the trench and contacting the dielectric layer.

Abstract: One embodiment of the present invention discloses an intelligent dispensing adjustment system and the method thereof. The system can dynamically detect the fluid dispensing amount of a fluid dispensing unit via a calculating unit having an intelligent dispensing mechanism and keeps monitoring the dispensing situation of the fluid material so as to automatically adjust the fluid dispensing amount of the fluid dispensing unit. The system can adjust the fluid dispensing amount of the fluid dispensing unit by obtaining the information of the state of previously dispensing the fluid material via a closed loop, which can solve the problems, of prior art, that the defects of products may be incurred because the state of the fluid material is hard to control (e.g., the fluid material is insufficient or overflows).

Abstract: The present disclosure provides one embodiment of a method making semiconductor structure. The method includes forming a composite stress layer on a semiconductor substrate, wherein the forming of the composite stress layer includes forming a first stress layer of a dielectric material with a first compressive stress and forming a second stress layer of the dielectric material with a second compressive stress on the first stress layer, the second compressive stress being greater than the first compressive stress; and patterning the semiconductor substrate to form fin active regions using the composite stress layer as an etch mask.

Abstract: A field effect transistor includes a substrate comprising a fin structure. The field effect transistor further includes an isolation structure in the substrate. The field effect transistor further includes a source/drain (S/D) recess cavity below a top surface of the substrate. The S/D recess cavity is between the fin structure and the isolation structure. The field effect transistor further includes a strained structure in the S/D recess cavity. The strain structure includes a lower portion. The lower portion includes a first strained layer, wherein the first strained layer is in direct contact with the isolation structure, and a dielectric layer, wherein the dielectric layer is in direct contact with the substrate, and the first strained layer is in direct contact with the dielectric layer. The strained structure further includes an upper portion comprising a second strained layer overlying the first strained layer.

Abstract: The present invention provides a dispensing adjustment system, which includes an optical measuring unit, a calculating unit and a glue dispensing control unit. The optical measuring unit measures a glue to obtain a Nth 3D glue signal or a Nth 2D glue signal. The calculating unit receives the Nth 3D glue signal or the Nth 2D glue signal to obtain the volume or the weight of the glue, and compares the volume or the weight of the glue with a default glue value. If the volume or the weight of the glue fails to conform to the default glue value, the calculating unit transmits a Nth glue dispensing adjustment signal to a glue dispensing control unit for the glue dispensing control unit to adjust the glue supplied thereby according to the Nth glue dispensing adjustment signal. The invention can solve the problem that the glue is insufficient or overflows in order to improve the bonding quality.

Abstract: Different isolation liners for different type FinFETs and associated isolation feature fabrication are disclosed herein. An exemplary method includes performing a fin etching process on a substrate to form first trenches defining first fins in a first region and second trenches defining second fins in a second region. An oxide liner is formed over the first fins in the first region and the second fins in the second region. A nitride liner is formed over the oxide liner in the first region and the second region. After removing the nitride liner from the first region, an isolation material is formed over the oxide liner and the nitride liner to fill the first trenches and the second trenches. The isolation material, the oxide liner, and the nitride liner are recessed to form first isolation features (isolation material and oxide liner) and second isolation features (isolation material, nitride liner, and oxide liner).

Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) package comprising a wire-bond damper. A housing structure overlies a support substrate, and a MEMS structure is between the support substrate and the housing structure. The MEMS structure comprises an anchor, a spring, and a movable mass. The spring extends from the anchor to the movable mass to suspend and allow movement of the movable mass in a cavity between the support substrate and the housing structure. The wire-bond damper is on the movable mass or structure surrounding the movable mass. For example, the wire-bond damper may be on a top surface of the movable mass. As another example, the wire-bond damper may be on the support substrate, laterally between the anchor and the movable mass. Further, the wire-bond damper comprises a wire formed by wire bonding and configured to dampen shock to the movable mass.

Abstract: A low-profile and small-size valve to a shut off a flow of fluid in a pipeline includes a frame, a tube, a moving part, a lever, an elastic part, a latch, and a trigger. The tube is movable with the moving part. The lever is rotatable around an axis. The elastic part can push the lever to rotate after the trigger pushes the buckle away from the lever to unlatch the lever and allow rotation. During the rotation of the lever, the lever pulls on the moving part, and the moving part pulls on the tube together to disconnect the tube from the pipe. The valve improves the convenience and efficiency of shutting off a flow of fluid. A pipeline and an immersion cooling system is also disclosed.

Abstract: A timing control circuit is provided to control a data voltage outputted to a pixel array of a display panel during a frame period to perform a polarity reversal every N scan lines, where N is a positive integer. The timing control circuit includes a receiver and an adjustment circuit. The receiver is configured to sequentially receive first display data and second display data for one data line of the display panel. The adjustment circuit is coupled to the receiver to adjust at least one of gray information of the second display data and charging time of the second display data according to a voltage polarity of the first display data and a voltage polarity of the second display data. A corresponding operation method of the timing control circuit is also provided.

Abstract: A dual-valve automatic calibration system comprises a primary positioner, a first secondary positioner and a second secondary positioner: the first secondary positioner and the second secondary positioner are connected with a first fluid coating unit and a second fluid coating unit, respectively; the primary positioner comprises a primary X-axis positioner and a primary Y-axis positioner; both the first secondary positioner and the second secondary positioner are connected with the primary X-axis positioner. In contrast to the prior art that a secondary positioner is installed on a primary Z-axis positioner, a dual-valve automatic calibration system contributes to promotion of positioning precision on the Z-axis and reduction of a burden imposed on the Z-axis.

Abstract: A glue dispensing device comprises a base, a pressure control unit, a quantitative glue supply unit and a glue dispensing needle. The base comprises a pressure control chamber and a glue tube body, the pressure control chamber is located inside the base, the glue tube body extends from one end of the base to the other end, and the glue tube body penetrates the pressure control chamber. The pressure control unit is coupled to the pressure control chamber. The quantitative glue supply unit is disposed at one end of the base body and is coupled to the glue tube body. The glue dispensing needle is disposed at the other end of the base and is coupled to the glue tube body. The glue dispensing device uses the pressure change of the pressure control chamber to deform the glue tube body, thereby achieving quantitative glue dispensing effect with accuracy and stability. In addition, a glue dispensing method is also disclosed.

Abstract: A jetting valve with two stage calibrating structures is disclosed, the jetting valve includes: a casing having an accommodating space; a piezoelectric actuating unit disposed on one side of the accommodating space; a spraying unit disposed on the other side of the accommodating space; a displacement amplifying element is arranged at the bottom of the accommodating space and leans against on the spraying unit, the bottom end of the piezoelectric driving unit is in contact with the displacement amplifying element; a sensing unit is arranged on the periphery of the displacement amplifying element to sense the movement of the spraying unit; a control unit, connected to the sensing unit and the piezoelectric actuating unit, adjusting the voltage supplied to the piezoelectric driving unit according to data obtained by the sensing unit; and a liquid supply unit connected to the spraying unit.

Abstract: A reciprocating glue dispenser dispensing switch includes a switching device main body, a needle holding base, a sliding wear-resistant plate, and a driving device. The switching device main body is equipped with a double liquid inlet, the needle holding base is equipped with a mixed glue outlet, the sliding wear-resistant plate is installed between the switching device main body and the needle holding base, and the sliding wear-resistant plate is equipped with a sliding wear-resistant plate opening. The driving device is utilized to move the sliding wear-resistant plate. A mixed double-liquid glue passes through the double liquid inlet, the sliding wear-resistant plate opening and the glue outlet to dispense a mixed double-liquid glue while the double liquid inlet, the sliding wear-resistant plate opening and the glue outlet are overlapped.