Abstract: A semiconductor device includes a semiconductor substrate, a gate structure, a first drift region, a first source/drain region, and a gate oxide layer. The gate structure and the gate oxide layer are disposed on the semiconductor substrate. The first drift region is disposed in the semiconductor substrate. The first source/drain region is disposed in the first drift region. At least a part of a first portion of the gate oxide layer is disposed between the gate structure and the semiconductor substrate in a vertical direction. A second portion of the gate oxide layer is disposed between the first portion and the first source/drain region in a horizontal direction. The second portion includes a bottom extending downwards and a first depressed top surface located above the bottom. A part of the first drift region is located under the first portion and the second portion of the gate oxide layer.

Abstract: This application is directed to coding video data that includes a plurality of image samples of a video frame. Each image sample corresponds to one of a luma sample and a chroma sample. Each image sample is filtered using an adaptive in-loop filter having a filter length and a set of filter coefficients. A set of related image samples are identified in the filter length of each image sample. For each related image sample, a respective clip value index and a corresponding filter coefficient are identified. A difference of each related image sample and the respective image sample is clipped based on the respective clip value index that corresponds to a respective clipping boundary value equal to 2 to a power of a respective clipping number. The respective image sample is modified with the clipped difference of each of the related image samples based on the respective filter coefficient.

Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: The present invention provides a control method of an electronic device, wherein the control method includes the steps of: using a first beacon setting to transmit beacons; if a wireless communication state of the electronic device satisfies a condition, using a second beacon setting to transmit beacons; wherein the first beacon setting and the second beacon setting have different beacon periods or different payload sizes.

Abstract: A semiconductor device includes a substrate, a first device, a second device, a ring structure, a lid structure, and a first adhesive layer. The first device is disposed on the substrate. The second device is adjacent to the first device and is disposed on the substrate. The ring structure is disposed over the substrate and the second device. The ring structure includes a cover and a leg extending out from the cover. The cover has a through opening. The lid structure is disposed over the ring structure and the first device. The lid structure includes a body and a protrusion protruding from the body. The protrusion of the lid structure is inserted into the through opening of the cover of the ring structure. The first adhesive layer is disposed between the body of the lid structure and the cover of the ring structure and includes phase change thermal interface material.

Abstract: A method for video decoding is provided. The method may be applied in a decoder and includes: receiving a video bitstream comprising a quantization parameter and a quantized level; deriving a scale value by scaling the quantization parameter by a scale factor; determining a plurality of parameters associated with a coding unit (CU); obtaining a plurality of bit-shifts by bit-shifting the plurality of parameters; and obtaining a plurality of coefficients associated with the CU based on the quantized level, the scale value, and the plurality of bit-shifts.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.

Abstract: A semiconductor device includes a gate structure disposed in a first dielectric layer, a conductive segment disposed in the first dielectric layer and separated from the gate structure, a second dielectric layer disposed over the first dielectric layer, a first contact penetrating the second dielectric layer and electrically connected to the gate structure, a second contact penetrating the second dielectric layer and electrically connected to the conductive segment, and a silicon nitride-based layer surrounding at least one of the first and second contacts and connected between the second dielectric layer and the at least one of the first and second contacts. A method for making the semiconductor device is also provided.

Abstract: An illumination system, a projection device, and a projection control method are provided. The illumination system includes a first light-emitting unit, a second light-emitting unit, a third light-emitting unit, a first dichroic element, a second dichroic element, and a control unit. The first light-emitting unit includes a first light-emitting element and a second light-emitting element. The control unit is electrically connected to the first light-emitting unit and configured to switch the illumination system between a high-performance mode and a high-chroma mode, wherein when the illumination system is in the high-performance mode, the control unit controls a current ratio of the second light-emitting element to be greater than a current ratio of the first light-emitting element, and when the illumination system is in the high-chroma mode, the control unit controls the current ratio of the second light-emitting element to be less than the current ratio of the first light-emitting element.

Abstract: The present application provides a method for determining a stability of a welding equipment. The method includes acquiring initial welding images of the welding equipment; obtaining at least one welding spot position of each of at least one welded workpiece in each initial welding image by processing the initial welding images; determining a welding center position of each welded workpiece based on the at least one welding spot position of each welded workpiece, and obtaining welding center positions of all welded workpieces comprised in the initial welding images; and determining a stability of welding equipment based on the welding center positions of all welded workpieces. The method determines whether the welding equipment is stable by analyzing the welding images, thereby improving an accuracy of a detection of a stability of the welding equipment.

Abstract: Text-to-image generation generally refers to the process of generating an image from one or more text prompts input by a user. While artificial intelligence has been a valuable tool for text-to-image generation, current artificial intelligence-based solutions are more limited as it relates to text-to-3D content creation. For example, these solutions are oftentimes category-dependent, or synthesize 3D content at a low resolution. The present disclosure provides a process and architecture for high-resolution text-to-3D content creation.

Abstract: A lock case interlockable with an anti-theft latch is mounted on a door. The lock case includes a latch coupled with a latch hole in a door frame for retaining the door in a closed position. The anti-theft latch can be operated to engage with the door frame. When the latch is picked, the anti-theft latch still remains engaged with the door frame to prevent opening of the door. When normally operated, an inner operating device or an outer operating device can be operated to disengage the latch from the latch hole while disengaging the anti-theft latch from the door frame, permitting easy, convenient opening of the door.

Abstract: A method of decoding video data, comprising: receiving, from bitstream, video data corresponding to a non-skip mode coded block; determining a parameter set associated with the non-skip mode coded block; if the parameter set satisfies a first condition, retrieving a first syntax element from the bitstream; if the parameter set satisfies a second condition, retrieving a second syntax element from the bitstream; if the parameter set satisfies a third condition, retrieving a third syntax element from the bitstream; decoding the video data corresponding to the non-skip mode coded block using palette mode when the first syntax element and the third syntax element have the first value; decoding the video data using intra prediction mode when the first syntax element has the first value and the third syntax element has a second value; and decoding the video data using inter prediction mode when the first syntax element has the second value.

Abstract: A method of decoding a syntax element for a current coding unit of video data is performed by an electronic apparatus. The electronic apparatus identifies, for the current coding unit, an above coding unit and a coding tree unit including the current coding unit. After determining that the above coding unit is within the coding tree unit, the electronic apparatus decodes, from a video bitstream, a corresponding syntax element for the current coding unit based, at least in part, on a syntax element associated with the above coding unit retrieved from a line buffer associated with the coding tree unit; otherwise, the electronic apparatus decodes, from the video bitstream, the corresponding syntax element for the current coding unit based, at least in part, on a default value assigned to the syntax element associated with the above coding unit.

Abstract: A first protective layer is formed on a first die and a second die, and openings are formed within the first protective layer. The first die and the second die are encapsulated such that the encapsulant is thicker than the first die and the second die, and vias are formed within the openings. A redistribution layer can also be formed to extend over the encapsulant, and the first die may be separated from the second die.

Abstract: One wireless sensing method includes: generating a measurement request frame, wherein the measurement request frame is configured to carry indication information for phase report from a sensing responder, and sending the measurement request frame to the sensing responder. Another wireless sensing method includes: generating a measurement report frame, wherein the measurement report frame is configured to carry phase information, and sending the measurement report frame to a sensing initiator.

Abstract: A package structure and a formation method of a package structure are provided. The method includes disposing a chip structure over a substrate and forming a first adhesive element directly on the chip structure. The first adhesive element has a first thermal conductivity. The method also includes forming a second adhesive element directly on the chip structure. The second adhesive element has a second thermal conductivity, and the second thermal conductivity is greater than the first thermal conductivity. The method further includes attaching a protective lid to the chip structure through the first adhesive element and the second adhesive element.

Abstract: A water quality detection device including a detection tank, a sensor, the cleaner and a processor is provided. The sensor is disposed on the detection tank and is configured to sense a to-be-detected liquid within the detection tank. The cleaner is configured to clean the sensor. The processor is electrically connected to the sensor and the cleaner and is configured to: execute an initialization procedure, which includes driving the sensor to sense the to-be-detected liquid to obtain a number of initial sensing values and calculating a threshold value according to the initial sensing values; drive the sensor to sense the to-be-detected liquid to obtain a sensing value of the to-be-detected liquid, and determine whether the sensing value of the to-be-detected liquid reaches the threshold value; drive the cleaner to operate when the sensing value of the to-be-detected liquid reaches the threshold value.

Abstract: A case tampering detection device, used for a computer system covered with a computer case, includes at least one detector for detecting whether the computer case is opened and generating a detection result; a storage unit; a microcontroller unit, coupled to the storage unit, for generating a case tampering event and storing the case tampering event in the microcontroller unit or the storage unit when being powered; and a power supply unit, coupled to the at least one detector, for receiving the detection result, and supplying power to the microcontroller unit when the detection result indicates that the computer case is opened.

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.