Abstract: Various examples of a circuit device that includes gate stacks and gate seals are disclosed herein. In an example, a substrate is received that has a fin extending from the substrate. A placeholder gate is formed on the fin, and first and second gate seals are formed on sides of the placeholder gate. The placeholder gate is selectively removed to form a recess between side surfaces of the first gate seal and the second gate seal. A functional gate is formed within the recess and between the side surfaces of the first gate seal and the second gate seal.

Abstract: An electronic device including a panel. The panel includes a first substrate, a second substrate opposite to the first substrate, a medium layer between the first substrate and the second substrate, first electrodes between the first substrate and the medium layer, connecting lines between the second substrate and the first electrodes, and a conductive spacer. The first electrodes include a connecting first electrode and an adjacent first electrode. The connecting lines include a first connecting line and a second connecting line. The conductive spacer is electrically connected to the connecting first electrode and the first connecting line. The second connecting line is adjacent to the first connecting line. The conductive spacer is separated from the second connecting line by a third space S3. The third space S3 is greater than or equal to 3 ?m and less than or equal to 50 ?m.

Abstract: Structures and formation methods of a semiconductor device structure are provided. The method includes forming a first gate structure over a substrate, and the first gate structure includes a first metal electrode. The method includes forming a second gate structure adjacent to the first gate structure, and the second gate structure includes a second metal electrode. The method also includes forming a mask structure covering the first gate structure and exposing the second gate structure, and etching a portion of the second metal electrode of the second gate structure to form an extending conductive portion. The method includes forming a metal layer over the first gate structure and the extending conductive portion, and etching the metal layer, such that no metal layer is remaining over the first gate structure, and a remaining portion of the metal layer is over the extending conductive portion.

Abstract: The disclosure provides an optical module packaging structure, including a molding compound layer, a photonic integrated circuit, a fan-out redistribution layer, and an electronic integrated circuit. The photonic integrated circuit is disposed in the molding compound layer. The fan-out redistribution layer is disposed on the molding compound layer. The electronic integrated circuit is disposed on the fan-out redistribution layer. The fan-out redistribution layer electrically couples the photonic integrated circuit and the electronic integrated circuit.

Abstract: In one embodiment of the present disclosure, the simulator apparatus a disposable, replaceable filter cartridge insertable into a recessed cavity of the main tubing in the interior chamber of a distal end of the cylindrical body, wherein the disposable cartridge comprises a base, spinach, ginger, cranberry extracts, carrot, pomegranate, citrus extract, broccoli, wheat germ and kale; and, a removably attachable coupling securing the filter cartridge in place at the distal end of the cylindrical body to lock the filter cartridge into the recessed cavity of the main tubing. In one embodiment, the apparatus further comprises a removably attachable cover, wherein the cover comprises a grid. In another embodiment the removably attachable cover comprises a screen.

Abstract: A lock case interlockable with an anti-theft latch is mounted on a door. The lock case includes a latch coupled with a latch hole in a door frame for retaining the door in a closed position. The anti-theft latch can be operated to engage with the door frame. When the latch is picked, the anti-theft latch still remains engaged with the door frame to prevent opening of the door. When normally operated, an inner operating device or an outer operating device can be operated to disengage the latch from the latch hole while disengaging the anti-theft latch from the door frame, permitting easy, convenient opening of the door.

Abstract: A collaborative session (e.g., a virtual time capsule) in which access to a collaborative object and added virtual content is selectively provided to participants/users. In one example of the collaborative session, authentication of the collaborative object is performed by all of the users to complete the collaborative session. Each user authenticates the collaborative object, such as using a stamping gesture on a user interface of a client device or in an augmented reality session. User specific data is recorded with the stamping gesture to authenticate the collaborative object and the associated virtual content. In an example, user specific data may include device information, participant profile information, or biometric signal information. Biometric signal information, such as a fingerprint from a mobile device or a heart rate received from a connected smart device can be used to provide an authenticating signature to the seal.

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

Abstract: One aspect of the present disclosure pertains to an integrated circuit (IC) package assembly. The IC package assembly includes a printed circuit board (PCB); a packaged IC structure mounted on a top surface of the PCB; a heat sink structure disposed over the packaged IC structure; and a back plate secured on a bottom surface of the PCB. The back plate includes a base portion and a protruding portion. The protrusion portion protrudes from the base portion and a portion of the PCB is below the packaged IC structure. A lateral width of the protrusion portion is smaller than a lateral width of the base portion.

Abstract: A semiconductor device including a package, a lid and a thermal interface material is provided. The package includes a packaging substrate, semiconductor dies and an insulating encapsulation, wherein the semiconductor dies are disposed on and electrically connected to the packaging substrate, and the insulating encapsulation encapsulates the semiconductor dies. The lid is disposed on the packaging substrate, the lid includes a cover portion and foot portion extending from the cover portion to the packaging substrate, wherein the cover portion covers the semiconductor dies and the insulating encapsulation, the foot portion includes foot segments laterally spaced apart from one another, and the foot segments are attached to the packaging substrate. The cover portion of the lid is attached to the package through the thermal interface material.

Abstract: A package structure according to the present disclosure includes a package substrate, a package component disposed over the package substrate, a lid disposed over the package substrate and the package component, and an active cooling device embedded in the lid.

Abstract: In an embodiment, a method includes attaching a die to an interposer; attaching and electrically coupling the interposer to a package substrate; attaching a package lid and a first thermal interface material to the die and to the package substrate; attaching and electrically coupling the package substrate to an assembly substrate; and attaching a heat sink and a second thermal interface material to the package lid using a screw extending between the heat sink and the assembly substrate, the heat sink comprising first sensing modules in physical contact with the second thermal interface material.

Abstract: A semiconductor package according to the present disclosure includes an interposer and a component mounted on the interposer. The component includes a first die and a second die disposed over the first die having a surface away from the first die. The second die includes a metal pad. A top surface of the metal pad is coplanar with the surface. The metal pad is electrically floating.

Abstract: The presently claimed invention relates to dielectric polishing composition and methods thereof. The presently claimed invention particularly relates to a composition comprising: (A) surface-modified colloidal silica particles comprising a negatively-charged group on the surface of the particles, wherein the surface-modified colloidal silica particles have a negative charge, a particle size of from 60 nm to 200 nm, and a zeta potential <?35 mV at a pH in the range of from ?2.0 to ?4.5; (B) first corrosion inhibitor selected from at least one guanidine derivative; (C) second corrosion inhibitor selected from polyacrylamides or polyacrylamide copolymers; (D) at least one iron (III) oxidizer; (E) at least one silicon oxide removal rate enhancer selected from phosphoric acid and salts thereof; (F) at least one stabilizer; and (G) an aqueous medium, wherein the pH of the composition is in the range of from ?2.0 to ?4.5.

Abstract: In an embodiment, a device includes: an interposer including: a front-side redistribution structure; a back-side redistribution structure; an encapsulant between the front-side redistribution structure and the back-side redistribution structure; an interconnection die in the encapsulant; and a thermal reservoir die in the encapsulant, the thermal reservoir die adjacent the interconnection die; a memory device attached to the front-side redistribution structure, the memory device overlapping the thermal reservoir die in a plan view; and a logic device attached to the front-side redistribution structure, the logic device and the memory device each overlapping the interconnection die in the plan view.

Abstract: A package structure and method for manufacturing the same are provided. A package structure is provided. The package structure includes a redistribution structure and a first package component and a second package component attached to the redistribution structure in a first direction and spaced apart from each other in a second direction. The package structure further includes an underfill formed around lower portions of the first package component and the second package component over the redistribution structure and a molding layer formed over the underfill and around upper portions of the first package component and the second package component. In addition, the molding layer includes a base material and fillers embedded in the base material. Furthermore, a thermal conductivity of the fillers is greater than about 400 W/mK.

Abstract: A heavy duty lock case is mounted on a door and includes a latch coupled with a door frame for retaining the door in a closed position. An anti-theft latch can be operated to engage with the door frame. The latch cooperates with an anti-pick member to avoid the latch from being picked to disengage from the door frame when the door is in the closed position. When normally operated, an inner operating device or an outer operating device can be operated to disengage the latch from the door frame while disengaging the anti-theft latch from the door frame, permitting easy, convenient opening of the door.

Abstract: A semiconductor structure can include a high voltage region, a first moat trench isolation structure electrically insulating the high voltage region from low voltage regions of the semiconductor structure, and a second moat trench isolation structure electrically insulating the high voltage region from the low voltage regions of the semiconductor structure. The first moat trench isolation structure can include dielectric sidewall spacers and a conductive fill material portion located between the dielectric sidewall spacers. The second moat trench isolation structure can include only at least one dielectric material, and can include a dielectric moat trench fill structure having a same material composition as the dielectric sidewall spacers and having a lateral thickness that is greater than a lateral thickness of the dielectric sidewall spacers and is less than twice the lateral thickness of the dielectric sidewall spacers.

Abstract: Collaborative sessions in which access to added virtual content is selectively made available to participants/users. A participant (the host) creates a new session and invites participants to join. The invited participants receive an invitation to join the session. The session creator (i.e., the host) and other approved participants can access the contents of a session. The session identifies a new participant when they join the session, and concurrently notifies the other participants in the session that a new participant is waiting for permission to access the added virtual content. The host or approved participants can set up the new participant with permissions for accessing added virtual content.

Abstract: A mesh network system and a mesh network resource allocation method are provided. The mesh network system includes a first router having a processor. The processor is used to detect a network architecture, according to the network architecture, designate a role of a second router as a transmitting device or a receiving device, and assign a work to the second router base on the role. After receiving the work assignment, the second router processes an event of the work and continuously monitors an activity related to the work.