Abstract: An embodiment of the invention is a magnetic head with overlaid lead pads that contact the top surface of the sensor between the hardbias structures and do not contact the hardbias structures which are electrically insulated from direct contact with the sensor. The lead pad contact area on the top of the sensor is defined by sidewall deposition of a conductive material to form leads pads on a photoresist prior to formation of the remainder of the leads. The conductive material for the lead pads is deposited at a shallow angle to maximize the sidewall deposition on the photoresist, then ion-milled at a high angle to remove the conductive material from the field while leaving the sidewall material. An insulation layer is deposited on the lead material at a high angle, then milled at a shallow angle to remove insulation from the sidewall.

Abstract: A perpendicular write head for writing data onto tracks includes a main pole, a trailing shield and bilayer trailing shield gap layer between the main pole and the trailing shield and improving writing and track width control.

Abstract: A fabricating process for an embedded circuit structure is provided. A through hole is formed in a core panel and penetrates the core panel. Two indent patterns are respectively formed on two opposite surfaces of the core panel. A conductive material is electroplated into the through hole and the indent patterns, so as to form a conductive channel in the through hole and two circuit patterns in the indent patterns respectively. Portions of the circuit patterns, which exceed the indent patterns respectively, are removed for planarizing the circuit patterns to be level with the two surfaces of the core panel respectively.

Abstract: A process of an embedded circuit structure is provided. A complex metal layer, a prepreg, a supporting board, another prepreg and another complex metal layer are laminated together, wherein each of the complex metal layers has an inner metal layer and an outer metal layer stacked on the inner metal layer, the roughness of the outer surfaces of the inner metal layers is less than the roughness of the second outer surfaces of the outer metal layers, and the outer surfaces of the outer metal layers after laminating are exposed outwards. Each of two patterned photoresist layers is respectively formed on the outer surfaces of the outer metal layers. A metal material is created on portions of the outer surfaces of the outer metal layers not covered by the patterned photoresist layers to form two patterned circuit layers. The patterned photoresist layers are then removed to form a laminating structure.

Abstract: An embedded circuit board including a glass fiber layer, two dielectric layers, and two circuit layers is provided. The glass fiber layer has a first surface and a second surface corresponding to the first surface. The dielectric layers are disposed on the first surface and the second surface, respectively. The circuit layers are embedded in the dielectric layers above the first surface and the second surface, respectively. The outer surface of each circuit layer is coplanar with the outer surface of each dielectric layer, and a distance between the circuit layer and the glass fiber layer is greater than or equal to 3 ?m. In addition, a process of the embedded circuit board is provided.

Abstract: A circuit board process is provided. First, multiple carriers is provided, and a first conductive layer having multiple concave structures is formed on each carrier. A dielectric layer is then provided, and the carriers with the first conductive layers are laminated on a first and a second surface of the dielectric layer respectively, wherein portions of the first conductive layers are embedded in the first and second surfaces. Next, the carriers are removed. Thereafter, the first conductive layer corresponding to at least one concave is removed to expose a portion of the dielectric layer. Next, the exposed dielectric layer is removed to form an opening. A second conductive layer is then formed on the inner wall of the opening, wherein the second conductive layer is electrically connected to the first conductive layers on both sides of the dielectric layer.

Abstract: In a perpendicular recording head, a notch is formed in the top write gap at a location on top of the main pole. A perpendicular head with this notched top write gap structure has less transition curvature and better writability while reducing the adjacent track interference (ATI). Also, the process used to fabricate the head ensures that the trailing edge (writing edge) of the main pole is extremely flat with no corner rounding.

Abstract: A method of fabricating a magnetic transducer is described which uses a trailing shield throat pad to set the trailing shield throat height. The trailing shield throat pad is used as a part of the structural form over which the material for the trailing shield is formed. The trailing shield throat pad is preferably made of a material which can selectively be removed from the gap layer with a selective etching process such as reactive-ion etching (RIE). The front edge of the trailing shield throat pad is used to define a peninsula on the trailing shield and thereby the throat of the trailing shield.

Abstract: A slider is disclosed having a continuous coil including front coils, back coils, and a center tab, a write head including upper and lower poles which sandwich at least a portion of the front coils of the continuous coil, and at least one underpass lead, which passes under a portion of the back coils of the continuous coil to make electrical connection with the center tab of the continuous coil. Also disclosed are first and second variations of methods for fabricating the slider with underpass leads.

Abstract: A read head for a disk drive and a method of fabricating the read head with overlaid lead pads that contact the top surface of the sensor between the hardbias structures to define the electrically active region of the sensor are described. The invention deposits the GMR and lead layers before milling away the unwanted material. A photoresist mask with a hole defining the active area of the sensor is preferably patterned over a layer of DLC that is formed into a mask. A selected portion of the exposed lead material is then removed using the DLC as a mask defining the active region of the sensor. A photoresist mask pad is patterned to define the full sensor width. The excess sensor and lead material exposed around the mask is milled away. The layers for the hardbias structure are deposited.

Abstract: A single-pole perpendicular magnetic recording head contains a bevel angle promotion layer that facilitates the fabrication of the bevel angle in a trapezoidal main pole. The bevel angle promotion layer is made of a non-magnetic material that is softer than the material (e.g., Al2O3) that normally underlies the main pole. In one embodiment, the bevel angle promotion layer is formed between an end of the yoke and the air bearing surface (ABS), with the top surface of the bevel angle promotion layer being substantially coplanar with the top surface of the yoke. In other embodiment the bevel angle promotion layer is integrated with a leading edge taper material, which is formed of a magnetic material, to broaden the magnetic flux path between the yoke and the main pole.

Abstract: A process for fabricating a circuit board with an embedded passive component is provided. First, an electrode-patterned layer having electrodes is formed on a surface of a conductive layer. Then, a passive component material is filled in the intervals between the electrodes. Then, the conductive layer and the electrode-patterned layer are laminated to a dielectric layer, wherein the electrode-patterned layer is embedded in the dielectric layer. Next, the conductive layer is patterned to form a circuit layer.

Abstract: A method for fabricating a magnetic head with a trapezoidal shaped pole piece tip is described. The body of the main pole piece is deposited, then one or more layers for the pole piece tip are deposited. A bed material is deposited over the pole piece tip material. A void is formed in the bed material over the area for the pole piece tip. The void is filled with an ion-milling resistant material such as alumina preferably using atomic layer deposition or atomic layer chemical vapor deposition. The excess ion-milling resistant material and the bed material are removed. The result is an ion-milling mask formed over the area for the pole piece tip. Ion milling is then used to remove the unmasked material in the pole piece tip layer and to form a beveled pole piece tip and preferably a beveled face on the main pole piece.

Abstract: A read element for a tape drive system is disclosed. The read element generally comprises a magneto-resistive sensor electrically coupled to first and second leads and at least one electrically conductive magnetic shield proximate the magneto-resistive element. A resistor is electrically connected to the conductive magnetic shield and to one or more of the first and second leads. The resistor is disposed between the first and second leads. The resistor continuously discharges electric charge that builds up on the conductive magnetic shield. The resistor typically has a resistance that is large enough to protect against noise due electrical shorting of the conductive magnetic shield and small enough to prevent a build-up of electric charge on the shield.

Abstract: This invention relates generally to a process for preparing composite particles. More specifically, this invention relates to a process for preparing polymer-coated composite particle dispersions wherein excess polymer is removed by a controlled washing step. This invention further relates to a process for preparing composite particles wherein the particles have an inner core particle coated with at least one polymer coating and at least one shell particle coating.