Abstract: The invention discloses a semiconductor package structure including a package carrier, at least one electronic component, a packaging layer, a support component and a shielding layer. The electronic component is disposed on a first surface of the package carrier. The packaging layer is disposed on the first surface and covers the electronic component. The support component is embedded in the packaging layer to surround the electronic component. An end surface of the support component is electrically connected to a build-up circuit and electrically grounded. A patterned metal layer of the shielding layer is electrically connected to the support component. The shielding range of the patterned metal layer covers at least electronic component. A shielding space, which covers the electronic component, is formed by the support component and the shielding layer. In addition, a semiconductor EMI shielding component and a method of making a semiconductor package structure are also disclosed.

Abstract: An improved fiber-optic gyroscope (FOG) is proposed for enhancing the optical measurement sensitivity through the application of a heterodyne effect. The improved FOG is characterized by the use of a dual-injection polarization-maintaining 3×3 directional coupler which is configured to receive a pair of source light beams that are injected thereinto in a bi-directional manner. The forward-injected light beam is used to be split into a pair of interrogating beams for use by a coiled optical fiber to implement the detection and measurement of the Sagnac effect due to a rotational movement. On the other hand, the backward-injected light beam is used to be mixed with the paired interrogating beams that have passed through and returned from the coiled optical fiber to thereby provide a heterodyne effect that can boost the differential optical power amplitude of the paired interrogating beams, thereby enhancing the optical measurement sensitivity of the FOG application.

Abstract: In an embodiment, a package includes a first package structure including a first die having a first active side and a first back-side, the first active side including a first bond pad and a first insulating layer a second die bonded to the first die, the second die having a second active side and a second back-side, the second active side including a second bond pad and a second insulating layer, the second active side of the second die facing the first active side of the first die, the second insulating layer being bonded to the first insulating layer through dielectric-to-dielectric bonds, and a conductive bonding material bonded to the first bond pad and the second bond pad, the conductive bonding material having a reflow temperature lower than reflow temperatures of the first and second bond pads.

Abstract: A film thickness measurement device includes a spectroscopic ellipsometer, and the spectroscopic ellipsometer includes a projection module and a light receiving module. The projection module is configured to project a multi-wavelength polarized light onto a thin film. The projection module includes a light source and a polarization state generator. The light receiving module includes a polarization analyzer and an optical detector. The polarization analyzer is configured to screen out a multi-wavelength polarized reflection light according to reflection of the multi-wavelength polarized light by the thin film. The optical detector is configured to receive the multi-wavelength polarized reflection light. The optical detector includes at least one optical splitting unit, at least two optical filtering units and at least two optical detection units.

Abstract: An over-current protection device includes an electrode layer and a heat-sensitive layer. The heat-sensitive layer includes a polymer matrix and a conductive filler. The polymer matrix includes a polyolefin-based polymer and an olefin-acrylate copolymer. The polyolefin-based polymer is represented by a formula (I): ?wherein R1 and R2 are selected from the group consisting of CH3, C2H5, and C3H7. The olefin-acrylate copolymer is represented by a formula (II): ?wherein R is selected from the group consisting of COOCH3, COOC2H5, and COOC4H9.

Abstract: The present disclosure pertains to a die bonding structure. The die bonding structure includes a carrier substrate, a sintered layer, a nano-twinned layer, an adhesive layer and a chip. The sintered layer is located on the carrier substrate. The nano-twinned layer is located on the sintered layer, in which the surface of the nano-twinned layer has [111] crystal orientation with a density greater than 80%, in which the nano-twinned layer comprises parallel-arranged twin boundaries, the parallel-arranged twin boundaries comprise more than 40% [111] crystal orientation, and the spacing between the parallel-arranged twin boundaries is 10 to 100 nm. The adhesive layer is located on the nano-twinned layer. The chip is located on the adhesive layer.

Abstract: A method of motion adaptive spatial smoothing includes determining a difference of a block duty of a selected block of a current frame and a block duty of the selected block of a previous frame, generating an original smoothing matrix for the selected block, generating a motion adaptive matrix according to the original smoothing matrix and a difference of the block duty of the selected block of the current frame and the block duty of the selected block of the previous frame, updating a block duty for each block with a corresponding motion adaptive matrix to generate an updated frame, and performing spatial smoothing for the updated frame.

Abstract: A semiconductor device includes a channel structure, source region, a drain region, metal gate structure, and a self-assembled layer. The source region and the drain region are on opposite sides of the channel structure. A bottom surface of the source region is lower than a bottom surface of the channel structure, and a top surface of the source region is higher than a top surface of the channel structure. The metal gate structure covers the channel structure and between the source region and the drain region. The self-assembled layer is between the source region and the metal gate structure. The self-assembled layer is in contact with the bottom surface of the channel structure but spaced apart from the top surface of the channel structure.

Abstract: Disclosed is a pixel array substrate including a first conductive pattern, a first dielectric layer, and a second conductive pattern. The first conductive pattern includes scan lines and first test lines. The second conductive pattern includes gate signal lines, data lines, second test lines, a first gate test line, and a second gate test line. The data lines are respectively electrically connected to the second test lines. The scan lines are respectively electrically connected to the gate signal lines, and the gate signal lines are respectively electrically connected to the first test lines. First portion of the gate signal lines are electrically connected to the first gate test lines, while second portion of the gate signal lines are electrically connected to the second gate test line. The first portion of the gate signal lines and the second portion of the gate signal lines are alternately arranged.

Abstract: The present disclosure is directed to a high-voltage magnetron sputtering tool with an enhanced power source including a vacuum chamber containing a magnetron cathode with a magnet array, a target, and an anode, as well as the enhanced power source that includes high-power DC power source and controller that produces a pulsed output. In an aspect, the enhanced power source may include a standard power source that is retrofitted a supplemental high-power DC power source and controller, and alternatively, a high-power DC power source and controller that replaces the standard power source. In addition, the present disclosure is directed to methods for depositing a hydrogen-free diamond-like carbon film on a semiconductor substrate using the high-voltage magnetron sputtering tool. In an aspect, the hydrogen-free diamond-like carbon film may be an etch mask having a sp3 carbon bonding that is greater than 60 percent.

Abstract: A vehicle seat assembly, suitable for vehicles such as locomotives and the like, includes a main cushion body and a lifting cushion. The main cushion body has a sliding cushion connected to a vehicle body with a sliding structure. The lifting cushion is connected to the vehicle body with a linkage mechanism. The lifting cushion is moved into a carriage when the sliding cushion is in a first position, and when the sliding cushion slides laterally into a second position to form a space portion, the lifting cushion can be lifted from the carriage and moved into the space portion and then positioned, or can be lowered into the carriage again, so that the sliding cushion can be moved back to the first position, thereby allowing the user to adjust seat cushion length according to their needs.

Abstract: A gas shield protection device for thermal spraying includes a spraying member and a gas shield generation device. The spraying member includes a nozzle and a shield body disposed on the nozzle. The nozzle is configured to align with one of a plurality of workpieces on a worktable. The gas shield generation device is configured to align with the worktable and includes a housing and a second gas ejection portion. The housing has a gas passageway therein. The second gas ejection portion has at least one gas ejection port intercommunicating with the gas passageway. The at least one gas ejection port is configured to face the plurality of workpieces, such that an area of a gas shield ejected from the at least one gas ejection port of the second gas ejection portion covers the plurality of workpieces. Thus, oxidation of the coating on the workpiece can be avoided.

Abstract: A signal sensing device includes a body and two signal sensing elements disposed in the body. An insulating layer is sandwiched between the two signal sensing elements. Each of the two signal sensing elements incudes a signal transmission section and a signal sensing section in electrical connection with the signal transmission section. The signal transmission sections are planar antennae parallel to each other and each having an antenna shape of meander-line type. The antenna shape of each transmission section has a vertical projection on a plane parallel to each signal transmission section. The vertical projections of the antenna shapes do not overlap completely. When a portion of the body forms a surrounding portion which surrounds a to-be-sensed target, a portion or an entirety of each signal sensing section is located on the surrounding portion.

Abstract: A cooling module for a heterogeneous integrated semiconductor package structure is disclosed. The heterogeneous integrated semiconductor package structure is arranged on a circuit board. The cooling module includes a cooling plate and a plurality of nanowires. The nanowires may be configured to be bonded to the cooling plate, or may be configured to bond the cooling plate to the heterogeneous integrated semiconductor package structure, or may be configured to bond the cooling plate to the circuit board, or may be configured to bond the cooling plate to both the heterogeneous integrated semiconductor package structure and the circuit board.

Abstract: A lock device includes a lock seat, a lock cylinder, an actuating plate, an extension plate, a guide plate, and hooks. The lock seat is fixed to a window panel. The lock cylinder is connected to the lock seat. The actuating plate extends from the lock cylinder. The extension plate is connected to the window panel. The guide plate extends from the extension plate over the actuating plate. The hooks are connected to the extension plate and engageable with engagement slots of a main housing. Each hook has an inclined guide surface. When the lock cylinder rotates, the actuating plate moves the guide plate and the hooks so that the hooks are disengaged from the engagement slots to unlock the window panel. The inclined guide surface is slidable to the main housing to move the extension plate when the window panel is to be locked.

Abstract: The present disclosure relates to the technical field of medicaments. Particularly, the present disclosure provides a pharmaceutical combination/composition comprising a phosphodiesterase type 5 (PDE5) inhibitor, arginine, and N-acetylcysteine and its applications in treating cardiovascular diseases and erectile dysfunction.

Abstract: A signal sensing device includes a signal amplifying structure to amplify the strength of the measured signal. The signal sensing device includes a body, a signal sensing element, and a signal amplifying portion. The signal sensing element is disposed in the body and includes a signal transmission section and a signal sensing section in electrical connection with the signal transmission section. The signal amplifying portion includes a plurality of protruding structures protruding outward from the body. Each of the plurality of protruding structures is cylindrical and has a diameter of 250-400 ?m and a height of 40-75 ?m. When a portion of the body forms a surrounding portion surrounding a to-be-sensed target, a portion or an entirety of the signal sensing section is located on the surrounding portion, and the signal amplifying portion is partially or entirely in contact with the to-be-sensed target.

Abstract: A device is provided to excite and locate methylene blue two-photon fluorescence (MB-2 PF) signals under skin surface. The device comprises a laser source, a nonlinear optical microscope unit, a beam-splitter unit, an optical-signal capturing and observing unit, and an image processing unit. Second harmonic generation (SHG) signals and the MB-2 PF signals are combined and observed simultaneously to form images of nerve fiber structures at different depths under the surface of human skin. The MB-2 PF signals directly observe the nerve fiber structure under the skin surface. The SHG signals reflects the signals of collagen fibers in dermal layer of the skin. The junction between the dermal layer and the epidermal layer are located to divide the dermis and epidermis layers for determining whether the nerve fiber structure passes through the epidermis and dermis layers. Thus, the density of intraepidermal nerve fiber is calculated in a non-invasive way.

Abstract: A power supply unit for a computer component includes a voltage regulator and an enclosure. The voltage regulator receives an input voltage at a first voltage level and provides a regulated output voltage at a second voltage level. The enclosure houses the voltage regulator and includes a first slot to receive a first rectifier module and a second slot to receive a second rectifier module. The first slot is configured to couple a first output from the first rectifier module to the input of the first voltage regulator, and the second slot is configured to couple a first output from the second rectifier module to the input of the first voltage regulator.