Abstract: A method of fabricating a gas sensor on a substrate and a gas sensor fabricated on a substrate that includes optical and electronic components are described. The method includes fabricating a laser to output light over a range of wavelengths within a waveguide, fabricating a splitter to split the light output by the laser to a reference waveguide and to a detection waveguide, fabricating a reference cell to house the reference waveguide and a reference gas. An output of the reference waveguide is coupled to a first optical detector and an output of the detection waveguide is coupled to a second optical detector to identify or quantify an ambient gas.

Abstract: Waveguide connector assembly device and methods of forming waveguide connectors include a cap having an inner portion to protect a connection end face of a polymer waveguide, wherein the cap includes one or more insertion structures to position the polymer waveguide in relation to one or more components of an assembled connector, and an inner wall to seal around the assembled connector to prevent contaminants from entering the inner portion.

Abstract: Various embodiments are directed to a connector for coupling optical signals to a semiconductor device. In one embodiment, the connector includes a connector member having a recessed portion to arrange a plurality of waveguides formed side-by-side in a transverse direction. A backup member is arranged within the recessed portion interposing the plurality of waveguides between the connector member and the backup member. The recessed portion includes a plurality of ridges arranged in a staggered pattern relative to the plurality of waveguides for positioning the plurality of waveguides relative to the connector.

Abstract: Waveguide connectors and methods of forming the same include heating a polymer waveguide having one or more waveguide cores and alignment features to a first temperature. A ferrule having alignment features is heated to the first temperature, the ferrule having a different coefficient of thermal expansion from the polymer waveguide. The alignment features of the polymer waveguide align with the alignment features of the ferrule when the polymer waveguide and the ferrule are heated to the first temperature. The polymer waveguide is positioned on the ferrule without a waveguide backfilm. The alignment features of the polymer waveguide are bonded to the corresponding alignment features of the ferrule.

Abstract: A technique relates to assembling a multi-chip system. A first chip stack element having two major surfaces and a first solder pad, a first vertical stop, a first lateral stop and a first waveguiding element is provided. A second chip stack element having two major surfaces and including a second solder pad, a flow resistor connected to the second solder pad, a second vertical stop, a second lateral stop, a reservoir pad connected to the flow resistor, and a second waveguiding element is provided. A solder material is plated to form a plated solder pad. A technique includes pre-aligning the first chip stack element and the second chip stack element, raising the temperature to a temperature above the melting temperature of the solder material, and flowing solder through the flow resistor. Aspects include aligning the first and second waveguiding elements and cooling the connected assembly to re-solidify the solder material.

Abstract: Embodiments are directed to a method of forming an optical coupler system. The method includes forming at least one waveguide over a substrate, and forming gratings in a first region over the substrate. The method further includes configuring the gratings to couple optical signals to or from the at least one waveguide, and forming a v-groove in the first region over the substrate, wherein forming the v-groove includes removing the gratings from the first region.

Abstract: Embodiments are directed to a method of forming an optical coupler system. The method includes forming at least one waveguide over a substrate, and forming a sacrificial optical coupler in a first region over the substrate. The method further includes configuring the sacrificial optical coupler to couple optical signals to or from the at least one waveguide, and forming a v-groove in the first region over the substrate, wherein forming the v-groove includes removing the sacrificial optical coupler from the first region.

Abstract: Various embodiments are directed to a connector for coupling optical signals to a semiconductor device. In one embodiment, the connector includes a connector member having a recessed portion to arrange a plurality of waveguides formed side-by-side in a transverse direction. A backup member is arranged within the recessed portion interposing the plurality of waveguides between the connector member and the backup member. The recessed portion includes a plurality of ridges arranged in a staggered pattern relative to the plurality of waveguides for positioning the plurality of waveguides relative to the connector.

Abstract: Waveguide connectors include a ferrule having first alignment features. A waveguide has one or more a topclad portions, each with a waveguide core, second alignment features fastened to the first alignment features, and underclad portion that is thicker than the one or more topclad portions.

Abstract: A clip connects two ferrules together, without a housing, to form a fiber optic connection. The clip has proximal and distal ends which define, and the clip has arms extending along the longitudinal axis to hold a cable-side ferrule in connection with fixed ferrule connected to a photonic module or die. The arms form an opening through which the cable-side ferrule is passed for connecting to the fixed ferrule. The arms have resilient bends forming a spring that can be resiliently extended along the longitudinal axis. The arms have a contact area at their ends which grasp the end of the cable-sided ferrule. The arms resiliently retract to compress the cable-sided ferrule towards the fixed ferrule with a predetermined force. The clip is positioned with respect to the circuit board using a pick and place system. The clip is not taller than either ferrule portion, enabling a limited vertical clearance.

Abstract: An optical fiber component includes an optical fiber array and at least one fiber lid. The optical fiber array has a plurality of individual optical fibers extending between a first end and an opposing second end. The fiber lid has a first surface and an opposing second surface. A portion of the second surface is attached to a portion of the optical fiber array adjacent the second end so as to partially define an adhesion region of the optical fiber component and a compliance region of the fiber pigtail assembly to enable high-yield fiber re-alignment in grooves.

Abstract: Approaches for silicon photonics integration are provided. A method includes: forming at least one encapsulating layer over and around a photodetector; thermally crystallizing the photodetector material after the forming the at least one encapsulating layer; and after the thermally crystallizing the photodetector material, forming a conformal sealing layer on the at least one encapsulating layer and over at least one device. The conformal sealing layer is configured to seal a crack in the at least one encapsulating layer. The photodetector and the at least one device are on a same substrate. The at least one device includes a complementary metal oxide semiconductor device or a passive photonics device.

Abstract: Waveguide connectors include a ferrule having first alignment features. A polymer waveguide has one or more a topclad portions, each with a waveguide core, second alignment features fastened to the first alignment features, and underclad portion that is thicker than the one or more topclad portions. The polymer waveguide has a higher coefficient of thermal expansion than the ferrule and is fastened to the ferrule under tension.

Abstract: An optical fiber component includes an optical fiber array and at least one fiber lid. The optical fiber array has a plurality of individual optical fibers extending between a first end and an opposing second end. The fiber lid has a first surface and an opposing second surface. A portion of the second surface is attached to a portion of the optical fiber array adjacent the second end so as to partially define an adhesion region of the optical fiber component and a compliance region of the fiber pigtail assembly to enable high-yield fiber re-alignment in grooves.

Abstract: A system for connecting a fiber optic cable to a laminate has a clip which attaches to a cover on the circuit board. The clip supports ferrules which are connected to a photonic device on the board. The clip has a backplane which supports retainers which hold the ferrules. The clip also has mating attachments for connecting to the cover. The cover additionally serves as a heat dissipator, which can include heat from the photonic device. An adapter is connected to the cover and receives the ferrules supported by the clip. The adapter connects to a standard connector, such as an LC connector. The adapter can be positioned at the edge of the laminate, or can be attached at an angle extending from an interior region of a circuit board to which the laminate is mounted.

Abstract: A clip connects two ferrules together, without a housing, to form a fiber optic connection. The clip has proximal and distal ends which define, and the clip has arms extending along the longitudinal axis to hold a cable-side ferrule in connection with fixed ferrule connected to a photonic module or die. The arms form an opening through which the cable-side ferrule is passed for connecting to the fixed ferrule. The arms have resilient bends forming a spring that can be resiliently extended along the longitudinal axis. The arms have a contact area at their ends which grasp the end of the cable-sided ferrule. The arms resiliently retract to compress the cable-sided ferrule towards the fixed ferrule with a predetermined force. The clip is positioned with respect to the circuit board using a pick and place system. The clip is not taller than either ferrule portion, enabling a limited vertical clearance.

Abstract: The present disclosure relates to nitride based optoelectronic and electronic devices with Si CMOS. The disclosure provides a semiconductor device, comprising a sapphire substrate, and a laser region and a detector region deposed on the sapphire substrate. The laser is formed onto the substrate from layers of GaN, InGaN and optionally the AlGaN. The detector can be an InGaN detector. A waveguide may be interposed between the laser and detector regions coupling these regions. The semiconductor device allows integration of nitride base optoelectronic and electronic devices with Si CMOS. The disclosure also provides a method for making the semiconductor devices.

Abstract: A clip connects two ferrules together, without a housing, to form a fiber optic connection. The clip has proximal and distal ends which define, and the clip has arms extending along the longitudinal axis to hold a cable-side ferrule in connection with fixed ferrule connected to a photonic module or die. The arms form an opening through which the cable-side ferrule is passed for connecting to the fixed ferrule. The arms have resilient bends forming a spring that can be resiliently extended along the longitudinal axis. The arms have a contact area at their ends which grasp the end of the cable-sided ferrule. The arms resiliently retract to compress the cable-sided ferrule towards the fixed ferrule with a predetermined force. The clip is positioned with respect to the circuit board using a pick and place system. The clip is not taller than either ferrule portion, enabling a limited vertical clearance.

Abstract: A micro-electronic cover has a planar portion sized and dimensioned to be positionable over and cover electronic components that are electrically connected on a board. The cover has a peripheral edge surrounding the planar portion and the electronic components. The peripheral edge connects the planar portion with the board to define a cover interior. The peripheral edge includes a side opening which provides access for passage of a connector part from a exterior to the cover to a position within the cover interior.

Abstract: A picktip is provided and includes a picktip member configured to extend along a longitudinal axis defined in parallel with emissions from an ultraviolet (UV) light source. The picktip member partially includes UV transparent material through which the emissions are directed and has an end face from which the emissions are exited. The picktip member defines vacuum pathways terminating at the end face, and the end face has a non-planar topography.