Abstract: A clip connects two ferrules together, without a housing, to form a fiber optic connection. The clip has proximal and distal ends which define, and the clip has arms extending along the longitudinal axis to hold a cable-side ferrule in connection with fixed ferrule connected to a photonic module or die. The arms form an opening through which the cable-side ferrule is passed for connecting to the fixed ferrule. The arms have resilient bends forming a spring that can be resiliently extended along the longitudinal axis. The arms have a contact area at their ends which grasp the end of the cable-sided ferrule. The arms resiliently retract to compress the cable-sided ferrule towards the fixed ferrule with a predetermined force. The clip is positioned with respect to the circuit board using a pick and place system. The clip is not taller than either ferrule portion, enabling a limited vertical clearance.

Abstract: A micro-electronic cover has a planar portion sized and dimensioned to be positionable over and cover electronic components that are electrically connected on a board. The cover has a peripheral edge surrounding the planar portion and the electronic components. The peripheral edge connects the planar portion with the board to define a cover interior. The peripheral edge includes a side opening which provides access for passage of a connector part from a exterior to the cover to a position within the cover interior.

Abstract: Approaches for silicon photonics integration are provided. A method includes: forming at least one encapsulating layer over and around a photodetector; thermally crystallizing the photodetector material after the forming the at least one encapsulating layer; and after the thermally crystallizing the photodetector material, forming a conformal sealing layer on the at least one encapsulating layer and over at least one device. The conformal sealing layer is configured to seal a crack in the at least one encapsulating layer. The photodetector and the at least one device are on a same substrate. The at least one device includes a complementary metal oxide semiconductor device or a passive photonics device.

Abstract: A system for connecting a fiber optic cable to a laminate has a clip which attaches to a cover on the circuit board. The clip supports ferrules which are connected to a photonic device on the board. The clip has a backplane which supports retainers which hold the ferrules. The clip also has mating attachments for connecting to the cover. The cover additionally serves as a heat dissipator, which can include heat from the photonic device. An adapter is connected to the cover and receives the ferrules supported by the clip. The adapter connects to a standard connector, such as an LC connector. The adapter can be positioned at the edge of the laminate, or can be attached at an angle extending from an interior region of a circuit board to which the laminate is mounted.

Abstract: A system for connecting a fiber optic cable to a laminate has a clip which attaches to a cover on the circuit board. The clip supports ferrules which are connected to a photonic device on the board. The clip has a backplane which supports retainers which hold the ferrules. The clip also has mating attachments for connecting to the cover. The cover additionally serves as a heat dissipator, which can include heat from the photonic device. An adapter is connected to the cover and receives the ferrules supported by the clip. The adapter connects to a standard connector, such as an LC connector. The adapter can be positioned at the edge of the laminate, or can be attached at an angle extending from an interior region of a circuit board to which the laminate is mounted.

Abstract: The present disclosure relates to nitride based optoelectronic and electronic devices with Si CMOS. The disclosure provides a semiconductor device, comprising a sapphire substrate, and a laser region and a detector region deposed on the sapphire substrate. The laser is formed onto the substrate from layers of GaN, InGaN and optionally the AlGaN. The detector can be an InGaN detector. A waveguide may be interposed between the laser and detector regions coupling these regions. The semiconductor device allows integration of nitride base optoelectronic and electronic devices with Si CMOS. The disclosure also provides a method for making the semiconductor devices.

Abstract: A component assembly apparatus includes a first device supportive of a first component and a second device configured to bring a second component into contact with the first component. The second device is further configured to apply a first pressurizing force directed to force respective first surfaces of the first and second components together, and the first device is configured to convert a portion of the first pressurizing force into a second pressurizing force directed transversely with respect to the first pressurizing force to force respective second surfaces of the first and second components together.

Abstract: A bondline control fixture and an active bondline control fixture are provided for affixing first and second components. The bondline control fixture includes a base fixable relative to a first component maneuvering device and comprising a first body defining an aperture and a first chamber and a second body disposable within the first chamber and defining a second chamber, a flexible membrane disposable to seal the second chamber, a mobile plate to which the second component is removably attachable, the mobile plate being disposable in contact with the flexible membrane and a pressure regulating system coupled to the second body and configured to regulate a pressure within the second chamber to deform the flexible membrane.

Abstract: A technique relates to assembling a multi-chip system. A first chip stack element having two major surfaces and a first solder pad, a first vertical stop, a first lateral stop and a first waveguiding element is provided. A second chip stack element having two major surfaces and including a second solder pad, a flow resistor connected to the second solder pad, a second vertical stop, a second lateral stop, a reservoir pad connected to the flow resistor, and a second waveguiding element is provided. A solder material is plated to form a plated solder pad. A technique includes pre-aligning the first chip stack element and the second chip stack element, raising the temperature to a temperature above the melting temperature of the solder material, and flowing solder through the flow resistor. Aspects include aligning the first and second waveguiding elements and cooling the connected assembly to re-solidify the solder material.

Abstract: A bondline control fixture and an active bondline control fixture are provided for affixing first and second components. The bondline control fixture includes a base fixable relative to a first component maneuvering device and comprising a first body defining an aperture and a first chamber and a second body disposable within the first chamber and defining a second chamber, a flexible membrane disposable to seal the second chamber, a mobile plate to which the second component is removably attachable, the mobile plate being disposable in contact with the flexible membrane and a pressure regulating system coupled to the second body and configured to regulate a pressure within the second chamber to deform the flexible membrane.

Abstract: A multi-chip system includes a top chip stack element comprising a top chip having two major surfaces and top solder pads arrayed along a plane of one of the major surfaces; a bottom chip stack element comprising a bottom substrate having two major surfaces and bottom solder pads arrayed along a plane of one of the major surfaces; one or more solder reservoir pads connected to one or more of the top solder pads or of the bottom solder pads; and solder material; and wherein at least one of the top solder pads is connected to one of the bottom solder pads by one of the solder material.

Abstract: An optical fiber component includes an optical fiber array and at least one fiber lid. The optical fiber array has a plurality of individual optical fibers extending between a first end and an opposing second end. The fiber lid has a first surface and an opposing second surface. A portion of the second surface is attached to a portion of the optical fiber array adjacent the second end so as to partially define an adhesion region of the optical fiber component and a compliance region of the fiber pigtail assembly to enable high-yield fiber re-alignment in grooves.

Abstract: A polarization splitter/combiner and method of forming the same includes a first waveguide having a direction of propagation in a first direction. The height of the first waveguide is greater than the width of the first waveguide. A second waveguide is in proximity to the first waveguide and has a direction of propagation substantially parallel to the first direction in an interaction region. The second waveguide includes a first portion having a greater than the width of the first portion and a second portion having a width greater than a height of the second portion.

Abstract: A method of fabricating a gas sensor on a substrate and a gas sensor fabricated on a substrate that includes optical and electronic components are described. The method includes fabricating a laser to output light over a range of wavelengths within a waveguide, fabricating a splitter to split the light output by the laser to a reference waveguide and to a detection waveguide, fabricating a reference cell to house the reference waveguide and a reference gas. An output of the reference waveguide is coupled to a first optical detector and an output of the detection waveguide is coupled to a second optical detector to identify or quantify an ambient gas.

Abstract: Various embodiments are directed to a connector for coupling optical signals to a semiconductor device. In one embodiment, the connector includes a connector member having a recessed portion to arrange a plurality of waveguides formed side-by-side in a transverse direction. A backup member is arranged within the recessed portion interposing the plurality of waveguides between the connector member and the backup member. The recessed portion includes a plurality of ridges arranged in a staggered pattern relative to the plurality of waveguides for positioning the plurality of waveguides relative to the connector.

Abstract: Techniques are provided for flip-chip assembly and packaging of microelectronic, photonics and optoelectronic devices in which three-dimensional alignment of package components is achieved using solder surface tension during a solder reflow process to move one or more package components and align such components in X, Y and Z directions using mechanical stops and chip butting techniques.

Abstract: A polarization splitter/combiner and method of forming the same includes a first waveguide having a direction of propagation in a first direction. The height of the first waveguide is greater than the width of the first waveguide. A second waveguide is in proximity to the first waveguide and has a direction of propagation substantially parallel to the first direction in an interaction region. The second waveguide includes a first portion having a greater than the width of the first portion and a second portion having a width greater than a height of the second portion.

Abstract: A component and chip assembly apparatus includes an assembly stage configured to support a chip, the chip including grooves defining a first pitch, the grooves including a first groove opening configured to receive a plurality of optical fibers and to align the plurality of optical fibers. A picker brings a fiber component including a plurality of optical fibers having a second pitch into contact with the chip such that each optical fiber is aligned with a respective groove. At least one of the assembly stage and the picker includes a comb having a plurality of teeth that define individual cavities therebetween, the cavities having a first cavity opening to receive the optical fibers and isolate each optical fiber from one another and pre-align the optical fibers so as to adjust the second pitch to substantially match the first pitch.

Abstract: Various embodiments are directed to a connector for coupling optical signals to a semiconductor device. In one embodiment, the connector includes a connector member having a recessed portion to arrange a plurality of waveguides formed side-by-side in a transverse direction. A backup member is arranged within the recessed portion interposing the plurality of waveguides between the connector member and the backup member. The recessed portion includes a plurality of ridges arranged in a staggered pattern relative to the plurality of waveguides for positioning the plurality of waveguides relative to the connector.

Abstract: A method of fabricating a gas sensor on a substrate and a gas sensor fabricated on a substrate that includes optical and electronic components are described. The method includes fabricating a laser to output light over a range of wavelengths within a waveguide, fabricating a splitter to split the light output by the laser to a reference waveguide and to a detection waveguide, fabricating a reference cell to house the reference waveguide and a reference gas. An output of the reference waveguide is coupled to a first optical detector and an output of the detection waveguide is coupled to a second optical detector to identify or quantify an ambient gas.