Abstract: A light bulb includes a base unit, an electrical connecting unit, a light-emitting unit, and a lamp cover unit. The base unit includes a base body connected with the electrical connecting unit. The light-emitting unit includes a substrate body disposed on the base body, a plurality of blue and red light emitting groups disposed on the substrate body and electrically connected with the substrate body, and a phosphor resin body formed on the substrate body to cover the blue and red light emitting groups. Each blue light emitting group includes a plurality of blue light emitting elements electrically connected with each other in series, and each red light emitting group includes a plurality of red light emitting elements electrically connected with each other in series. The lamp cover unit includes a light-permitting cover disposed on the top side of the base body to cover the light-emitting unit.

Abstract: A cathode material with double carbon coatings is provided. The cathode material includes a lithium metal phosphate matrix, a first carbon coating, and a second carbon coating. The first carbon coating is coated on the lithium metal phosphate matrix. The second carbon coating is coated on the first carbon coating. The carbon source of the first carbon coating is a carbohydrate or a water-soluble macromolecule compound having relatively smaller molecular weight. The carbon source of the second carbon coating is a macromolecule compound having relatively higher molecular weight.

Abstract: A wideband antenna includes: a substrate, having a first surface and a second surface; a ground plane, disposed on the second surface; an exciting element, disposed on the first surface, and having a feed point coupled to a signal source; a connection element, disposed on the first surface, and coupled to the ground plane; a first branch, disposed on the first surface, and coupled to the connection element; a second branch, disposed on the first surface, and coupled to the connection element; and a coupling element, disposed on the first surface, and coupled to the connection element.

Abstract: A method, a system, and a computer program product for object color correction are provided. Two images of the same target provided by two image capturing devices are introduced into an image conversion model constructed by an image conversion algorithm, and a color coefficient and a luminance coefficient for color space conversion are found, so as to convert the two images to a target color space. Then, the two images in the target color space are introduced into an image color distribution space model constructed by the image conversion algorithm, so as to obtain two different image color distribution space principal axes. The two image color distribution space principal axes are compared and adjusted to be parallel, thereby adjusting a color difference between the two images. The two images that are adjusted are converted back to an original color space, so as to obtain the two corrected images.

Abstract: A portable electronic device is provided. The portable electronic device includes a housing, a circuit board, an amplifier, an antenna and a short element. The circuit board is disposed in the housing, wherein the circuit board includes a first edge and a second edge, and the first edge is opposite to the second edge. The amplifier is disposed on the circuit board and adjacent to the first edge. The antenna is disposed on the second edge of the circuit board, wherein the antenna transmits a wireless signal. The short element is disposed on the second edge of the circuit board, wherein the short element is separated from the antenna, and the short element couples with the antenna to reduce Specific Absorption Rate (SAR) value around the amplifier.

Abstract: A semiconductor structure comprises a carrier, a plurality of under bump metallurgy layers, a plurality of copper containing bumps and an organic barrier layer, wherein the carrier comprises a protective layer and a plurality of conductive pads, mentioned protective layer comprises a plurality of openings, the conductive pads exposed by the openings, mentioned under bump metallurgy layers being formed on the conductive pads, mentioned copper containing bumps being formed on the under bump metallurgy layers, each of the copper containing bumps comprises a top surface and a ring surface in connection with the top surface, mentioned organic barrier layer having a first coverage portion, and mentioned first coverage portion covers the top surface and the ring surface of each of the copper containing bumps.

Abstract: In order to protect IMD layers, particularly low-k dielectrics, a protection film is formed on the sidewall of an opening in the IMD layers prior to etching a trench in the underlying silicon substrate. After etching the trench, such as through a TMAH wet etch, at least part of the protection film can be removed. The protection film can be removed in an anisotropic etch process such that a portion of the protection film remains as a sidewall spacer on the sidewall of the opening within the IMD layers.

Abstract: An antenna module is provided. The antenna module includes a radiator, a feed pin, a ground element, a first parasitic arm, a second parasitic arm and an impedance matching unit. The radiator includes a first section and a second section, wherein an end of the first section is connected to the second section, and the first section is perpendicular to the second section. The feed pin is connected to another end of the first section. The first parasitic arm is parallel to the second section, wherein an end of first parasitic arm is connected to the ground element, and the first parasitic arm couples with the second section of the radiator. The impedance matching unit is connected to the second section and the ground element. The second parasitic arm is partially parallel to the first section, and the second parasitic arm couples with the first section of the radiator, and an end of the second parasitic arm is connected to the ground element.

Abstract: A method for manufacturing fine-pitch bumps comprises providing a silicon substrate; forming a titanium-containing metal layer having a plurality of first zones and a plurality of second zones on the silicon substrate; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer; forming a plurality of copper bumps having a plurality of first top surfaces and a plurality of first ring surfaces; heating the photoresist layer to form a plurality of body portions and removable portions; etching the photoresist layer; forming a plurality of bump protection layers on the titanium-containing metal layer, the first top surface and the first ring surface, each of the bump protection layers comprises a bump coverage portion; plating a plurality of gold layers at the bump coverage portion; eventually, removing the second zones to enable each of the first zones to form an under bump metallurgy layer.

Abstract: The present invention provides a method and device for position detection. For detection of a touch position, a segment of surface acoustic wave (SAW) is provided multiple times to be propagated on a SAW touch panel, and the multiple SAW segments are received by the SAW touch panel. In addition, during or after reception, partial output electrical signals are provided based on different portions of each received SAW segment to construct a complete output electrical signal.

Abstract: The present invention provides a method and device for position detection. For detection of a touch position, a segment of surface acoustic wave (SAW) is provided multiple times to be propagated on a SAW touch panel, and the multiple SAW segments are received by the SAW touch panel. In addition, during or after reception, partial output electrical signals are provided based on different portions of each received SAW segment to construct a complete output electrical signal.

Abstract: The present invention provides a method and device for position detection. For detection of a touch position, a segment of surface acoustic wave (SAW) is provided multiple times to be propagated on a SAW touch panel, and the multiple SAW segments are received by the SAW touch panel. In addition, during or after reception, partial output electrical signals are provided based on different portions of each received SAW segment to construct a complete output electrical signal.

Abstract: A method for manufacturing fine-pitch bumps comprises providing a silicon substrate; forming a titanium-containing metal layer having a plurality of first zones and a plurality of second zones on the silicon substrate; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer; forming a plurality of copper bumps having a plurality of first top surfaces and a plurality of first ring surfaces; heating the photoresist layer to form a plurality of body portions and removable portions; etching the photoresist layer; forming a plurality of bump protection layers on the titanium-containing metal layer, the first top surface and the first ring surface, each of the bump protection layers comprises a bump coverage portion; plating a plurality of gold layers at the bump coverage portion; eventually, removing the second zones to enable each of the first zones to form an under bump metallurgy layer.

Abstract: A method for manufacturing fine-pitch bumps comprises the steps of providing a silicon substrate; forming a titanium-containing metal layer on the silicon substrate, wherein the titanium-containing metal layer comprises a plurality of first zones and a plurality of second zones; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer to form a plurality of opening slots; forming a plurality of copper bumps at the opening slots, wherein each of the copper bumps comprises a first top surface and a ring surface; heating the photoresist layer to form a plurality of body portions and a plurality of removable portions; etching the photoresist layer; and removing the second zones to enable each of the first zones to form an under bump metallurgy layer having a bearing portion and an extending portion.

Abstract: An apparatus for controlling electric field distribution is provided, where the apparatus includes at least one portion of a portable electronic device, the portable electronic device includes a plurality of wireless communication functions respectively corresponding to different communication standards, and the plurality of wireless communication functions includes a mobile phone function and at least one other wireless communication function. The apparatus includes: a main antenna, connected to a first side of a PCB of the portable electronic device, for performing the mobile phone function; and a plurality of short trace structures, positioned at the first side of the PCB and connected to the PCB, wherein at least one of the plurality of short trace structures is selectively utilized as at least one short trace or utilized as at least one secondary antenna corresponding to the at least one other wireless communication function.

Abstract: A semiconductor packaging method includes providing a substrate having a plurality of pads, each of the pads comprises a first coupling surface having a plurality of first conductive contact areas and a plurality of first non-conductive contact areas; forming a conductible gel with anti-dissociation function on the substrate, said conductible gel includes a plurality of conductive particles and a plurality of anti-dissociation substances; mounting a chip on the substrate, said chip comprises a plurality of copper-containing bumps, each of the copper-containing bumps comprises a ring surface and a second coupling surface having a plurality of second conductive contact areas and a plurality of second non-conductive contact areas, wherein the conductive particles are electrically connected with the first conductive contact areas and the second conductive contact areas, said anti-dissociation substances are in contact with the second non-conductive contact area, and the ring surfaces are covered with the anti-dis

Abstract: A method for manufacturing fine-pitch bumps comprises providing a silicon substrate; forming a titanium-containing metal layer having a plurality of first zones and a plurality of second zones on the silicon substrate; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer; forming a plurality of copper bumps having a plurality of first top surfaces and a plurality of first ring surfaces; heating the photoresist layer to form a plurality of body portions and removable portions; etching the photoresist layer; forming a plurality of bump protection layers on the titanium-containing metal layer, the first top surface and the first ring surface, each of the bump protection layers comprises a bump coverage portion; plating a plurality of gold layers at the bump coverage portion; eventually, removing the second zones to enable each of the first zones to form an under bump metallurgy layer.

Abstract: A semiconductor packaging method includes providing a substrate having a plurality of pads, each of the pads comprises a first coupling surface having a plurality of first conductive contact areas and a plurality of first non-conductive contact areas; forming a conductible gel with anti-dissociation function on the substrate, said conductible gel includes a plurality of conductive particles and a plurality of anti-dissociation substances; mounting a chip on the substrate, said chip comprises a plurality of copper-containing bumps, each of the copper-containing bumps comprises a ring surface and a second coupling surface having a plurality of second conductive contact areas and a plurality of second non-conductive contact areas, wherein the conductive particles are electrically connected with the first conductive contact areas and the second conductive contact areas, said anti-dissociation substances are in contact with the second non-conductive contact area, and the ring surfaces are covered with the anti-dis

Abstract: A semiconductor packaging method includes providing a substrate having a plurality of connection pads; mounting a chip on the substrate, wherein the chip comprises a plurality of copper-containing bumps directly coupled to the connection pads, and each of the copper-containing bumps comprises a ring surface; forming an anti-dissociation gel between the substrate and the chip, wherein the anti-dissociation gel comprises a plurality of anti-dissociation substances, and the ring surfaces of the copper-containing bumps are covered by the anti-dissociation substances.

Abstract: A vehicle license plate recognition method and a system thereof are disclosed. A region where a vehicle license plate image exists is detected according to the edge densities of an input image and a vehicle license plate specification. A text area of the vehicle license plate image is divided into a plurality of character images. The character images are binarized to obtain a plurality of binarized character images. A plurality of characters is recognized from the binarized character images. The characters are recombined to form a character string. The abovementioned steps are repeated to obtain a new character string from another image of the same vehicle, which is captured at a next time point. The character string is compared with the new character string character by character to obtain a comparison result for verifying reliability of recognition through a voting technique.