SEMICONDUCTOR PACKAGING METHOD AND STRUCTURE THEREOF
A semiconductor packaging method includes providing a substrate having a plurality of pads, each of the pads comprises a first coupling surface having a plurality of first conductive contact areas and a plurality of first non-conductive contact areas; forming a conductible gel with anti-dissociation function on the substrate, said conductible gel includes a plurality of conductive particles and a plurality of anti-dissociation substances; mounting a chip on the substrate, said chip comprises a plurality of copper-containing bumps, each of the copper-containing bumps comprises a ring surface and a second coupling surface having a plurality of second conductive contact areas and a plurality of second non-conductive contact areas, wherein the conductive particles are electrically connected with the first conductive contact areas and the second conductive contact areas, said anti-dissociation substances are in contact with the second non-conductive contact area, and the ring surfaces are covered with the anti-dissociation substances.
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The present invention is generally related to a semiconductor packaging method, which particularly relates to the semiconductor packaging method that prevents copper ions from dissociation.
BACKGROUND OF THE INVENTIONModern electronic products gradually lead a direction of light, thin, short, and small. Accordingly, the circuit layout for electronic products destines to develop technique such as “micro space between two electronic connection devices”. However, a short phenomenon is easily occurred in mentioned circuit layout via an insufficient gap between two adjacent electronic connection devices.
SUMMARYThe primary object of the present invention is to provide a semiconductor packaging method includes providing a substrate having an upper surface and a plurality of pads disposed at the upper surface, and each of the pads comprises a first coupling surface having a plurality of first conductive contact areas and a plurality of first non-conductive contact areas; forming a conductible gel with anti-dissociation function on the upper surface and the pads of the substrate, wherein the conductible gel with anti-dissociation function includes a plurality of conductive particles and a plurality of anti-dissociation substances; mounting a chip on the substrate, the chip comprises an active surface facing toward the upper surface of the substrate and a plurality of copper-containing bumps disposed at the active surface, wherein the conductible gel with anti-dissociation function covers the copper-containing bumps, each of the copper-containing bumps comprises a second coupling surface and a ring surface, said second coupling surface comprises a plurality of second conductive contact areas and a plurality of second non-conductive contact areas, said copper-containing bumps are electrically connected with the pads via the conductive particles located between the first coupling surfaces and the second coupling surfaces, said conductive particles are electrically connected with the first conductive contact areas of the first coupling surfaces and the second conductive contact areas of the second coupling surfaces, wherein the anti-dissociation substances are located between adjacent conductive particles, each of the first coupling surfaces and each of the second coupling surfaces, said anti-dissociation substances are in contact with the second non-conductive contact areas of the second coupling surfaces, and the ring surfaces of the copper-containing bumps are covered with the anti-dissociation substances. As a result of the ring surfaces of the copper-containing bumps being covered by the anti-dissociation substances of the conductible gel with anti-dissociation function, when a dissociation phenomenon via copper ions from the copper-containing bumps is occurred, the anti-dissociation substances may capture those dissociated copper ions to avoid short phenomenon from happening.
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While this invention has been particularly illustrated and described in detail with respect to the preferred embodiments thereof, it will be clearly understood by those skilled in the art that it is not limited to the specific features and describes and various modifications and changes in form and details may be made without departing from the spirit and scope of this invention.
Claims
1. A semiconductor packaging method at least comprising:
- providing a substrate having an upper surface and a plurality of pads disposed on the upper surface, wherein each of the pads comprises a first coupling surface having a plurality of first conductive contact areas and a plurality of first non-conductive contact areas;
- forming a conductible gel with anti-dissociation function on the upper surface and the pads of the substrate, wherein the conductible gel with anti-dissociation function includes a plurality of conductive particles and a plurality of anti-dissociation substances; and
- mounting a chip on the substrate, the chip comprises an active surface facing toward the upper surface of the substrate and a plurality of copper-containing bumps disposed at the active surface, wherein the conductible gel with anti-dissociation function covers the copper-containing bumps, each of the copper-containing bumps comprises a second coupling surface and a ring surface, said second coupling surface comprises a plurality of second conductive contact areas and a plurality of second non-conductive contact areas, said copper-containing bumps are electrically connected with the pads via the conductive particles located between the first coupling surfaces and the second coupling surfaces, said conductive particles are electrically connected with the first conductive contact areas of the first coupling surfaces and the second conductive contact areas of the second coupling surfaces, wherein the anti-dissociation substances are located between adjacent conductive particles, each of the first coupling surfaces and each of the second coupling surfaces, said anti-dissociation substances are in contact with the second non-conductive contact areas of the second coupling surfaces, and the ring surfaces of the copper-containing bumps are covered with the anti-dissociation substances.
2. The semiconductor packaging method in accordance with claim 1, wherein the anti-dissociation substances are in contact with the first non-conductive contact areas of the first coupling surfaces.
3. The semiconductor packaging method in accordance with claim 1, wherein each of the pads comprises a lateral surface being covered with the anti-dissociation substances.
4. The semiconductor packaging method in accordance with claim 1, wherein the anti-dissociation substance can be an organic solderability preservative.
5. The semiconductor packaging method in accordance with claim 4, wherein the material of the organic solderability preservative can be chosen from one of benzimidazole or imidazole derivative.
6. The semiconductor packaging method in accordance with claim 5, wherein the imidazole derivative can be one of Brenzotriazole, Phenylimidazole, Substituted Benzimidazole, Aryl Phonylimidazole or a mixture thereof, and the benzimidazole can be one of Brenzotriazole, Phenylimidazole, Substituted Benzimidazole, Aryl Phonylimidazole or a mixture thereof.
7. The semiconductor packaging method in accordance with claim 1, wherein the material of the copper-containing bumps can be chosen from one of copper/nickel or copper/nickel/gold.
8. A semiconductor packaging structure at least includes:
- a substrate having an upper surface and a plurality of pads disposed at the upper surface, each of the pads comprises a first coupling surface having a plurality of first conductive contact areas and a plurality of first non-conductive contact areas;
- a conductible gel with anti-dissociation function formed on the upper surface and the pads of the substrate, said conductible gel with anti-dissociation function includes a plurality of conductive particles and a plurality of anti-dissociation substances; and
- a chip mounted on the substrate, said chip comprises an active surface facing toward the upper surface of the substrate and a plurality of copper-containing bumps disposed at the active surface, each of the copper-containing bumps is covered with the conductible gel with anti-dissociation function and comprises a second coupling surface and a ring surface, said second coupling surface comprises a plurality of second conductive contact areas and a plurality of second non-conductive contact areas, wherein the copper-containing bumps are electrically connected with the pads via the conductive particles located between the first coupling surfaces and the second coupling surfaces, said conductive particles are electrically connected with the first conductive contact areas of the first coupling surfaces and the second conductive contact areas of the second coupling surfaces, wherein the anti-dissociation substances are located between adjacent conductive particles, each of the first coupling surfaces and each of the second coupling surfaces, said anti-dissociation substances are in contact with the second non-conductive contact areas of the second coupling surfaces, and the ring surfaces of the copper-containing bumps are covered with the anti-dissociation substances.
9. The semiconductor packaging structure in accordance with claim 8, wherein the anti-dissociation substances are in contact with the first non-conductive contact areas of the first coupling surfaces.
10. The semiconductor packaging structure in accordance with claim 8, wherein each of the pads comprises a lateral surface being covered with the anti-dissociation substances.
11. The semiconductor packaging structure in accordance with claim 8, wherein the anti-dissociation substance can be an organic solderability preservative.
12. The semiconductor packaging structure in accordance with claim 11, wherein the material of the organic solderability preservative can be chosen from one of benzimidazole or imidazole derivative.
13. The semiconductor packaging structure in accordance with claim 12, wherein the imidazole derivative can be one of Brenzotriazole, Phenylimidazole, Substituted Benzimidazole, Aryl Phonylimidazole or a mixture thereof, and the benzimidazole can be one of Brenzotriazole, Phenylimidazole, Substituted Benzimidazole, Aryl Phonylimidazole or a mixture thereof.
14. The semiconductor packaging structure in accordance with claim 8, wherein the material of the copper-containing bumps can be chosen from one of copper/nickel or copper/nickel/gold.
Type: Application
Filed: Feb 16, 2012
Publication Date: Aug 22, 2013
Applicant: CHIPBOND TECHNOLOGY CORPORATION (Hsinchu)
Inventors: Cheng-Hung Shih (Changhua County), Shu-Chen Lin (Pingtung County), Cheng-Fan Lin (Hsinchu County), Yung-Wei Hsieh (Hsinchu City), Bo-Shiun Jiang (Taipei City)
Application Number: 13/398,081
International Classification: H01L 23/488 (20060101); H01L 21/60 (20060101);