Abstract: A method for manufacturing fine-pitch bumps comprises the steps of providing a silicon substrate; forming a titanium-containing metal layer on the silicon substrate, wherein the titanium-containing metal layer comprises a plurality of first zones and a plurality of second zones; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer to form a plurality of opening slots; forming a plurality of copper bumps at the opening slots, wherein each of the copper bumps comprises a first top surface and a ring surface; heating the photoresist layer to form a plurality of body portions and a plurality of removable portions; etching the photoresist layer; and removing the second zones to enable each of the first zones to form an under bump metallurgy layer having a bearing portion and an extending portion.

Abstract: A semiconductor packaging method includes providing a substrate having a plurality of pads, each of the pads comprises a first coupling surface having a plurality of first conductive contact areas and a plurality of first non-conductive contact areas; forming a conductible gel with anti-dissociation function on the substrate, said conductible gel includes a plurality of conductive particles and a plurality of anti-dissociation substances; mounting a chip on the substrate, said chip comprises a plurality of copper-containing bumps, each of the copper-containing bumps comprises a ring surface and a second coupling surface having a plurality of second conductive contact areas and a plurality of second non-conductive contact areas, wherein the conductive particles are electrically connected with the first conductive contact areas and the second conductive contact areas, said anti-dissociation substances are in contact with the second non-conductive contact area, and the ring surfaces are covered with the anti-dis

Abstract: A semiconductor structure comprises a carrier, a plurality of under bump metallurgy layers, a plurality of copper containing bumps and an organic barrier layer, wherein the carrier comprises a protective layer and a plurality of conductive pads, mentioned protective layer comprises a plurality of openings, the conductive pads exposed by the openings, mentioned under bump metallurgy layers being formed on the conductive pads, mentioned copper containing bumps being formed on the under bump metallurgy layers, each of the copper containing bumps comprises a top surface and a ring surface in connection with the top surface, mentioned organic barrier layer having a first coverage portion, and mentioned first coverage portion covers the top surface and the ring surface of each of the copper containing bumps.

Abstract: A bumping process includes providing a silicon substrate, forming a titanium-containing metal layer on the silicon substrate, wherein the titanium-containing metal layer comprises a plurality of first areas and a plurality of second areas, forming a photoresist layer on the titanium-containing metal layer, patterning the photoresist layer to form a plurality of opening slots corresponded to the first areas of the titanium-containing metal layer, forming a plurality of copper bumps at the opening slots, proceeding a heat procedure, forming a plurality of bump isolation layers on the copper bumps, forming a plurality of connective layers on the bump isolation layers, removing the photoresist layer, removing the second areas and enabling each the first areas to form an under bump metallurgy layer.

Abstract: A light bulb includes a base unit, an electrical connecting unit, a light-emitting unit, and a lamp cover unit. The base unit includes a base body connected with the electrical connecting unit. The light-emitting unit includes a substrate body disposed on the base body, a plurality of blue and red light emitting groups disposed on the substrate body and electrically connected with the substrate body, and a phosphor resin body formed on the substrate body to cover the blue and red light emitting groups. Each blue light emitting group includes a plurality of blue light emitting elements electrically connected with each other in series, and each red light emitting group includes a plurality of red light emitting elements electrically connected with each other in series. The lamp cover unit includes a light-permitting cover disposed on the top side of the base body to cover the light-emitting unit.

Abstract: A circular polarization antenna includes a substrate, a ground plane, a tuning stub, a feeding element, and a cavity structure. The substrate has a first surface and a second surface. The feeding element is disposed on the first surface of the substrate. The ground plane is disposed on the second surface of the substrate and has a hole. The tuning stub is disposed on the second surface of the substrate and connected to the edge of the hole. The cavity structure is connected to the ground plane and configured to reflect an electromagnetic wave.

Abstract: An antenna is provided. The antenna includes a radiator, a feed conductor and a ground conductor. The radiator includes a body and a parasitic element. An aperture is formed on the body, and the body encloses the aperture. The parasitic element is connected to the body and extended into the aperture, wherein the parasitic element is connected to the body at a parasitic location. The feed conductor is connected to the body, wherein a signal, fed to the body by the feed conductor, travels on the body, and passes the parasitic location to the parasitic element. The ground conductor is connected to the body.

Abstract: A semiconductor device and methods for forming the same are provided. The semiconductor device includes a first doped region and a second, oppositely doped, region both formed in a substrate, a first gate formed overlying a portion of the first doped region and a portion of the second doped region, two or more second gates formed over the substrate overlying a different portion of the second doped region, one or more third doped regions in the second doped region disposed only between the two or more second gates such that the third doped region and the second doped region having opposite conductivity types, a source region in the first doped region, and a drain region in the second doped region disposed across the second gates from the first gate.

Abstract: A wideband antenna includes: a substrate, having a first surface and a second surface; a ground plane, disposed on the second surface; an exciting element, disposed on the first surface, and having a feed point coupled to a signal source; a connection element, disposed on the first surface, and coupled to the ground plane; a first branch, disposed on the first surface, and coupled to the connection element; a second branch, disposed on the first surface, and coupled to the connection element; and a coupling element, disposed on the first surface, and coupled to the connection element.

Abstract: A termination circuit for a plurality of memories controlled by a controller is provided. The termination circuit includes a plurality of drivers, a plurality of resistors and a plurality of capacitors. Each of the drivers is coupled to the memories via a transmission line. Each of the resistors is coupled to the corresponding driver via the corresponding transmission line. Each of the capacitors is coupled between the corresponding resistor and a reference voltage. The controller is coupled to the memories via the drivers, and the controller provides a specific code to one of the drivers when a quantity of logic “0” and a quantity of logic “1” transmitted to the memories via the transmission line corresponding to the one of the drivers are unbalanced, so as to adjust a termination voltage of the capacitor corresponding to the one of the drivers.

Abstract: Disclosed herein are a display, a source driver of the display and a method for driving the same. The source driver includes a determining unit. The determining unit is configured to temporarily store data in response to a latch enable signal, to output a plurality of digital data values continuous in time sequence, and to sequentially convert a first digital data value and a second digital data value of the digital data values to a first analog signal and a second analog signal, respectively, and to compare the first digital data value with the second digital data value. When the first digital data value and the second digital data value are the same, the determining unit continuously outputs the first analog signal and the second analog signal.

Abstract: A management method for reducing the utilization rate of random access memory (RAM) while reading data from or writing data to the flash memory is disclosed. A physical memory set is constructed from a plurality of physical memory blocks in the flash memory. A logical set is constructed from a plurality of logical blocks wherein the data stored in the logical set are stored in the physical memory set. Further, the data stored in each of the logical blocks are stored in one number of physical memory blocks. A mapping table is constructed and includes a hash function, a logical set table, a physical memory set table, and a set status table for managing the relationship among the physical memory sets, physical memory blocks, and logical blocks while reading data from or writing data to the flash memory.

Abstract: A mobile communication device for operating in LTE and WWAN bands is provided in the invention. The mobile communication device includes a system circuit board and an antenna. The system circuit board includes a system ground plane. The antenna includes: an antenna substrate, substantially parallel to the system ground plane; a first radiation element, disposed on the antenna substrate; a second radiation element, disposed on the antenna substrate; an antenna ground plane, disposed on the antenna substrate, and coupled to the system ground plane; and a transmission line, disposed on the antenna substrate, coupled to the first and second radiation elements, and having a feed point. The mobile communication device is further configured to accommodate a data transmission component.

Abstract: A flash memory system and managing and collecting methods for flash memory with invalid page messages thereof are described. When the valid data pages of the flash memory are changed to invalid data pages, a recording area is used to record the message of the invalid data pages to effectively collect the occupied space of the invalid data pages in the flash memory. Further, while garbage collecting step is performed, a block is rapidly selected according to the message of the recording area and the valid data pages in the selected block are correctly identified, copied and removed.

Abstract: The present invention provides an eye drop container with an alignment component, including a body, a spout, and a reflective surface. The body has a top surface. The spout has a bottom integrated with the top surface and an opening opposite to the bottom. The reflective surface is disposed on the top surface of the body and has a central hole, wherein the bottom of the spout is disposed in the central hole.

Abstract: A LED package structure for increasing the light uniforming effect includes a substrate unit, a light emitting unit, a first package unit, and a second package unit. The substrate unit includes at least one substrate body. The light emitting unit includes at least one light emitting element disposed on the at least one substrate body and electrically connected to the at least one substrate body. The first package unit includes a first package resin body formed on the at least one substrate body to cover the at least one light emitting element. The second package unit includes a second package resin body formed on the at least one substrate body to cover the first package resin body. The second package resin body is a light uniforming resin body having a light diffusing material mixed therein, and the second package resin body has an exposed light uniforming surface formed thereon.

Abstract: An antenna module is provided. The antenna module includes a radiator, a feed pin, a ground element, a first parasitic arm, a second parasitic arm and an impedance matching unit. The radiator includes a first section and a second section, wherein an end of the first section is connected to the second section, and the first section is perpendicular to the second section. The feed pin is connected to another end of the first section. The first parasitic arm is parallel to the second section, wherein an end of first parasitic arm is connected to the ground element, and the first parasitic arm couples with the second section of the radiator. The impedance matching unit is connected to the second section and the ground element. The second parasitic arm is partially parallel to the first section, and the second parasitic arm couples with the first section of the radiator, and an end of the second parasitic arm is connected to the ground element.

Abstract: The present invention relates to a semiconductor structure having an integrated passive network and a method for making the same. The semiconductor structure includes a substrate which can be an interposer. The substrate can include a plurality of conductive vias. In various embodiments, the substrate includes a dielectric layer disposed thereon, the dielectric layer having an opening forming a straight hole allowing electrical connection between the passive network and the conductive via. The passive network includes a series of patterned dielectric and conductive layers, forming passive electronic components. In an embodiment, the passive device includes a common resistor coupled to a pair of inductors, each of the inductors coupled to a capacitor. In another embodiment, the passive device includes a resistor and an inductor electrically connected to each other, a bottom surface of the inductor coplanar with a bottom surface of the resistor.

Abstract: A disposable thermometer probe sheath includes a bottom piece and a plastic cover film sealed onto the bottom piece. The plastic cover film comprising an upper plastic sheet film and a lower plastic sheet film, each of which has a front edge provided with an opening, a rear edge provided with a tip, and a sealed peripheral edge except for the opening, so as to receive a thermometer probe. The plastic cover film is made of a flexible and deformable material, while the plastic cover film is provided with two notches respectively formed on two side edges adjacent to the tip. The upper plastic sheet film is provided with a first flap attached to the opening thereof, while the lower plastic sheet film is provided with a second flap attached to the opening. When the thermometer probe is inserted into the plastic cover film, the notches are tightly engaged with the thermometer probe.

Abstract: A vehicle license plate recognition method and a system thereof are disclosed. A region where a vehicle license plate image exists is detected according to the edge densities of an input image and a vehicle license plate specification. A text area of the vehicle license plate image is divided into a plurality of character images. The character images are binarized to obtain a plurality of binarized character images. A plurality of characters is recognized from the binarized character images. The characters are recombined to form a character string. The abovementioned steps are repeated to obtain a new character string from another image of the same vehicle, which is captured at a next time point. The character string is compared with the new character string character by character to obtain a comparison result for verifying reliability of recognition through a voting technique.