Abstract: An optical module includes a carrier, a light source disposed on an upper side of the carrier, an optical sensor disposed on the upper side of the carrier, and a housing disposed on the upper side of the carrier over the light source and the optical sensor. The housing defines a first aperture exposing at least a portion of the light source and a second aperture exposing at least a portion of the optical sensor. An outer sidewall of the housing includes at least one singulation portion adjacent to the upper side of the carrier and perpendicular to the upper side of the carrier.

Abstract: A digital background calibration circuit including a digital random number generator, an analog-to-digital converter (ADC) and a plurality of switches is provided. The digital random number generator is configured to generate a first digital sequence having a plurality of bits. The ADC includes a plurality of sampling capacitors. The switches receive the first digital sequence and are coupled to the sampling capacitors. During a calibration period, the digital random number generator controls the sampling capacitors via the switches to sample the first digital sequence.

Abstract: A display panel defining a display area and a border area surrounding the display area. The display panel includes a color filter substrate, a TFT substrate facing the color filter substrate, and a liquid crystal layer and a sealant between the color filter substrate and the TFT substrate. The sealant is in the border area and seals the liquid crystal layer between the color filter substrate and the TFT substrate. The display panel further includes at least one first retaining wall located in the sealant and surrounding the display area, and the first retaining wall connects the color filter substrate and the TFT substrate. A display device using the display panel is also provided.

Abstract: An optical plate with protrusions, an optical structure, a backlight module and a display device are provided. The optical plate includes a main body and several protrusions. The main body has a first surface. The protrusions are formed on and projected from the first surface. An area ratio of the protrusions to the first surface is in a range of 0.03˜35%. The protrusions have a pitch in a range of 0.5˜10 mm, and a portion of the first surface other than the protrusions has a first center line mean roughness Ra in a range of 0.01˜0.1 ?m.

Abstract: A lid array panel includes multiple lids, where each lid includes an outer side wall. The lid array panel further includes a bridge section surrounding and attached to the outer side walls of the lids, where the lids are connected to each other by the bridge section, the lid array panel further includes a reinforcement attached to the bridge section. A package structure includes a carrier, a chip disposed on an upper surface of the carrier, a lid, a bridge section, and a reinforcement. The lid includes a top wall and an outer side wall, the top wall and the outer side wall of the lid together define a cavity, and the outer side wall of the lid is attached to the upper surface of the carrier. The bridge section surrounds, and is attached to, the outer side wall of the lid. The reinforcement is attached to the bridge section.

Abstract: A control system of a switching voltage regulator includes an adjustable switched-capacitor conversion circuit, an error generator, and a controlling module. The adjustable switched-capacitor conversion circuit has a plurality of discrete conversion rates, and selects a corresponding conversion rate and outputs an output voltage according to a signal of the conversion rate. An error generator is connected to the adjustable switched-capacitor conversion circuit and compares the output voltage with an external reference voltage to obtain an error voltage. The controlling module is connected between the error generator and the adjustable switched-capacitor conversion circuit to store a plurality of control variable sets, and selects one of plurality of control variable sets according to the error voltage. Afterwards, the controlling module calculates to output the signal of the conversion rate and further adjust the output voltage according to the selected control variable sets.

Abstract: An optical device includes an active optical component including an optical area, an encapsulant covering the active optical component, and a passive optical component adhered to the encapsulant above the active optical component. The passive optical component has an optical axis, and the optical axis is substantially aligned with a center of the optical area.

Abstract: An electronic device comprises a carrier, an emitter, a detector, a separation wall and a light shielding layer. The emitter is disposed on a first portion of the top surface of the carrier. The detector is disposed on a second portion of the top surface of the carrier. The separation wall is disposed on the top surface of the carrier between the emitter and the detector. The light shielding layer disposed adjacent to the top surface of the carrier and extends from the separation wall to the second portion of the carrier.

Abstract: A method and an electronic device for enhancing efficiency of searching for a region of interest in a virtual environment are provided. The virtual environment includes a visible scene and an invisible scene. A picture-in-picture (PIP) is displayed in the visible scene as a directional guidance or distance hint related to the region of interest in the invisible scene, thereby saving time and enhancing efficiency of searching for the region of interest.

Abstract: A digital control system for voltage regulation and a method thereof are disclosed. The digital control system includes an adjustable voltage regulation circuit having multiple discrete conversion ratios, an error generator, a digital controller and a conversion ratio controller. The adjustable voltage regulation circuit, the error generator, the digital controller and the conversion ratio controller form a closed loop control system. The adjustable voltage regulation circuit includes a conversion ratio controlling terminal receiving a conversion ratio signal. The error generator compares an output voltage of the adjustable voltage regulation circuit with a reference voltage to generate an error voltage, and the digital controller outputs a digital control signal to the conversion ratio controller according to the error voltage.

Abstract: An optical module includes a substrate, a lid, a light-emitting component, a first sensor and a second sensor. The lid is disposed on a surface of the substrate. The lid defines a first opening, a second opening and a third opening. The second opening is between the first opening and the third opening. The light-emitting component is disposed on the surface of the substrate and in the first opening. The first sensor is disposed on the surface of the substrate and in the second opening. The second sensor is disposed on the surface of the substrate and in the third opening.

Abstract: A digital background calibration circuit including a digital random number generator, an analog-to-digital converter (ADC) and a plurality of switches is provided. The digital random number generator is configured to generate a first digital sequence having a plurality of bits. The ADC includes a plurality of sampling capacitors. The switches receive the first digital sequence and are coupled to the sampling capacitors. During a calibration period, the digital random number generator controls the sampling capacitors via the switches to sample the first digital sequence.

Abstract: An electronic device comprises a carrier, a leadframe, a package body and a plurality of electronic components. The carrier has an open top surface, a closed bottom surface and sidewalls extending between the closed bottom surface and the open top surface. The carrier has a circular cavity in its open top surface extending toward the closed bottom surface. The carrier includes a leadframe including a die pad and a plurality of leads. The leads are physically isolated from the die pad by at least one gap. The package body partially encapsulates the leadframe such that a portion of an upper surface of the die pad and a portion of each of the leads are exposed from the package body. The exposed portions of the leads are arranged radially along the die pad. The electronic components are disposed on the die pad.

Abstract: A command processing method and a storage controller using the same are provided. The command processing method includes: receiving a plurality of I/O commands; categorizing the I/O commands into a plurality of groups according to a processor effort index of the I/O commands; selecting a first group from the groups, resetting a timer and obtaining an expiration time corresponding to the first group according to the I/O commands of the first group, and executing the I/O commands of the first group; and selecting a second group from the groups and resetting the timer when the expiration time of the first group expires, wherein when the processor effort index of the first group is less than a threshold, a clock frequency of the processor is lowered before the expiration time expires.

Abstract: A motor includes a shaft, a shell, a sleeve, an abrasion-resistance piece, a bearing, an oil seal, and several compressed springs. The shaft has an axial line. The shell is connected to the shaft. The sleeve has an accommodating space, and the wall of the accommodating space forms a first inclined surface which is inclined at an angle with respect to the axial line. The abrasion-resistance piece is disposed at the bottom of the accommodating space. The bearing is disposed in the accommodating space, and the outer wall of the bearing forms a second inclined surface corresponding to the first inclined surface. The shaft passes through the bearing and abuts the abrasion-resistance piece. The oil seal is affixed to the wall of the accommodating space and covers the bearing. The compressed springs are connected between the oil seal and the bearing.

Abstract: A motor includes a shaft, a shell, a sleeve, an abrasion-resistance piece, a bearing, an oil seal, and several compressed springs. The shaft has an axial line. The shell is connected to the shaft. The sleeve has an accommodating space, and the wall of the accommodating space forms a first inclined surface which is inclined at an angle with respect to the axial line. The abrasion-resistance piece is disposed at the bottom of the accommodating space. The bearing is disposed in the accommodating space, and the outer wall of the bearing forms a second inclined surface corresponding to the first inclined surface. The shaft passes through the bearing and abuts the abrasion-resistance piece. The oil seal is affixed to the wall of the accommodating space and covers the bearing. The compressed springs are connected between the oil seal and the bearing.

Abstract: An electronic device comprises a carrier, a leadframe, a package body and a plurality of electronic components. The carrier has an open top surface, a closed bottom surface and sidewalls extending between the closed bottom surface and the open top surface. The carrier has a circular cavity in its open top surface extending toward the closed bottom surface. The carrier includes a leadframe including a die pad and a plurality of leads. The leads are physically isolated from the die pad by at least one gap. The package body partially encapsulates the leadframe such that a portion of an upper surface of the die pad and a portion of each of the leads are exposed from the package body. The exposed portions of the leads are arranged radially along the die pad. The electronic components are disposed on the die pad.

Abstract: A semiconductor device package is provided, which includes a carrier, a first reflective element, a second reflective element, a first optical component, a second optical component and a microelectromechanical system (MEMS) device. The carrier has a first surface. The first reflective element is disposed on the first surface of the carrier. The second reflective element disposed on the first surface of the carrier. The first optical component is disposed on the first reflective element. The second optical component is disposed on the second reflective element. The MEMS device is disposed on the first surface of the carrier to provide light beams to the first reflective element and the second reflective element. The light beams provided to the first reflective element are reflected to the first optical component and the light beams provided to the second reflective element are reflected to the second optical component.

Abstract: A semiconductor device package is provided, which includes a carrier, an emitter and a first transparent encapsulant. The carrier has a first surface. The emitter is disposed on the first surface. The first transparent encapsulant encapsulates the emitter. The first transparent encapsulant includes a body and a lens portion. The body has a first planar surface. The lens portion is disposed on the body and has a first planar surface. The first planar surface of the lens portion is substantially coplanar with the first planar surface of the body.

Abstract: The present invention relates to a fluid control device and a connector for the same. The connector includes a first unit and a second unit to form a connector in a particular shape. Thus, the connector and an adjacent connector can be stacked upon each other to allow simple disassembling. The present invention also provides a fluid control device including the connector.