Abstract: A command processing method and a storage controller are provided. The command processing method includes performing a command merging process on commands sequentially received by a command queue. The command merging process includes an initialization step and multiple iterations. The initialization step includes transmitting the commands from the command queue to a continuity checking pool (CCP), transmitting an initial command of the commands from the CCP to a continuity list (CL) and setting a range of the CL. Each of the iterations includes transmitting the commands from the command queue to the CCP; determining whether the commands in the CCP and the range of the CL conform to a continuity condition; and when the commands in the CCP and the range conform to the continuity condition, appending the first command to the CL and resetting the range of the CL according to the first command.

Abstract: A semiconductor device package is provided, which includes a carrier, a first reflective element, a second reflective element, a first optical component, a second optical component and a microelectromechanical system (MEMS) device. The carrier has a first surface. The first reflective element is disposed on the first surface of the carrier. The second reflective element disposed on the first surface of the carrier. The first optical component is disposed on the first reflective element. The second optical component is disposed on the second reflective element. The MEMS device is disposed on the first surface of the carrier to provide light beams to the first reflective element and the second reflective element. The light beams provided to the first reflective element are reflected to the first optical component and the light beams provided to the second reflective element are reflected to the second optical component.

Abstract: An electronic apparatus having noise suppression mechanism is provided that includes a circuit board, a wireless communication circuit, a digital signal generation circuit, a metal shield and a grounding metal pillar. The wireless communication circuit is disposed on a chip disposing area of the circuit board and performs wireless communication within a wireless signal frequency range. The digital signal generation circuit is disposed on the chip disposing area and generates a digital signal transmitted through a transmission path within the chip disposing area. The metal shield is coupled to the circuit board to cover the chip disposing area. The grounding metal pillar is disposed on the chip disposing area of the circuit board. The grounding metal pillar extends for contacting the metal shield and increases a resonant frequency of the metal shield.

Abstract: A semiconductor device package includes a carrier, a wall disposed on a top surface of the carrier, a cover, and a sensor element. The cover includes a portion protruding from a bottom surface of the cover, where the protruding portion of the cover contacts a top surface of the wall to define a space. The sensor element is positioned in the space.

Abstract: An automatic control method and an automatic control device are provided. The automatic control device includes a processing unit, a memory unit and a camera unit. The memory unit records an object database and a behavior database. When the automatic control device is operated in an automatic learning mode, the camera unit obtains a continuous image, and the processing unit analyzes the continuous image to determine whether there is an object being moved and matching an object model recorded in the object database in a first placement area. When the continuous image displays the object is moved, the processing unit obtain control data corresponding to moving the object from the first placement area to a second placement area, and the processing unit records the control data to the behavior database. The control data includes trajectory data and motion posture data of the object.

Abstract: A rotor includes a yoke, an end cap, and a rotary shaft. The yoke is fixed relative to the end cap. The rotary shaft extends into the yoke. One end of the rotary shaft is connected to the end cap. The end cap is formed on the yoke and the rotary shaft by injection molding. The present invention further provides a motor and an electric tool including the rotor. In the rotor of this invention, the end cap is formed by injection molding, and the yoke and the rotary shaft are connected into a whole at the same time of forming the end cap. The traditional aluminium end cap is replaced with the molded end cap, which makes the rotor easier to fabricate and have a lighter weight and lower cost.

Abstract: The invention provides a device and system for decomposing and oxidizing of gaseous pollutants. A novel reaction portion reduces particle formation in fluids during treatment, thereby improving the defect of particle accumulation in a reaction portion. Also, the system includes the device, wherein a modular design enables the system to have the advantage of easy repair and maintenance.

Abstract: The invention provides a device and system for decomposing and oxidizing of gaseous pollutants. A novel reaction portion reduces particle formation in fluids during treatment, thereby improving the defect of particle accumulation in a reaction portion. Also, the system includes the device, wherein a modular design enables the system to have the advantage of easy repair and maintenance.

Abstract: The invention provides a device and system for decomposing and oxidizing of gaseous pollutants. A novel reaction portion reduces particle formation in fluids during treatment, thereby improving the defect of particle accumulation in a reaction portion. Also, the system includes the device, wherein a modular design enables the system to have the advantage of easy repair and maintenance.

Abstract: A semiconductor device package includes a carrier; a sensor element disposed on or within the carrier; a cover disposed above the carrier and comprising a top surface, a bottom surface and an inner sidewall, the inner sidewall defining a penetrating hole extending from the top surface to the bottom surface; and a light transmissive element covering the penetrating hole, wherein the sensor element senses or detects light passing through the light transmissive element.

Abstract: A data management method and a storage controller are provided. The method includes: receiving write sectors corresponding to a write command and transmitting the write sectors to a partial block buffer or a full block buffer; when the write sectors corresponding to a first block are transmitted to the partial block buffer, starting a timer corresponding to the first block; when the partial block buffer receives first write sectors corresponding to the first block and the first write sectors and the write sectors corresponding to the first block in the partial block buffer form a full first block, the first block is transmitted to the full block buffer before or when the timer is expired; and when the timer is expired and the full first block is not yet formed in the partial block buffer, performing a read-modify-write operation according to the write sectors corresponding to the first block.

Abstract: At least some embodiments of the present disclosure relate to a lid for covering an optical device. The lid includes a metal member and a transparent encapsulant. The metal member includes a top surface, a first bottom surface, and a second bottom surface between the top surface and the first bottom surface. The transparent encapsulant is surrounded by the metal member and covers at least a portion of the second bottom surface.

Abstract: A data management method and a storage controller are provided. The method includes: receiving write sectors corresponding to a write command and transmitting the write sectors to a partial block buffer or a full block buffer; when the write sectors corresponding to a first block are transmitted to the partial block buffer, starting a timer corresponding to the first block; when the partial block buffer receives first write sectors corresponding to the first block and the first write sectors and the write sectors corresponding to the first block in the partial block buffer form a full first block, the first block is transmitted to the full block buffer before or when the timer is expired; and when the timer is expired and the full first block is not yet formed in the partial block buffer, performing a read-modify-write operation according to the write sectors corresponding to the first block.

Abstract: A command processing method and a storage controller are provided. The command processing method includes performing a command merging process on commands sequentially received by a command queue. The command merging process includes an initialization step and multiple iterations. The initialization step includes transmitting the commands from the command queue to a continuity checking pool (CCP), transmitting an initial command of the commands from the CCP to a continuity list (CL) and setting a range of the CL. Each of the iterations includes transmitting the commands from the command queue to the CCP; determining whether the commands in the CCP and the range of the CL conform to a continuity condition; and when the commands in the CCP and the range conform to the continuity condition, appending the first command to the CL and resetting the range of the CL according to the first command.

Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.

Abstract: Methods for the production of immunogenic compositions containing a non-natural amino acid are disclosed. The non-natural amino acid can be a site for attachment of antigens, such as bacterial capsular polysaccharides, to make immunogenic conjugates. Bio-orthogonal attachment chemistry incorporated into the non-natural amino acids allows for more efficient and potent antigen presentation to the immune system, simplified purification, and more well-defined structure of these semi-synthetic immunogens.

Abstract: An eye protection device including a first transparent substrate, a second transparent substrate, and a high reflection interference film is provided. The second transparent substrate is opposite to the first transparent substrate. The high reflection interference film is disposed on the first transparent substrate or the second transparent substrate.

Abstract: An optical device includes a substrate, an electronic component and a lid. The electronic component is disposed on the substrate. The lid is disposed on the substrate. The lid has a first cavity over the electronic component and a second cavity over the first cavity. The sidewall of the second cavity is inclined.

Abstract: A sensor package includes a carrier, a sensor, an interconnection structure, a conductor and a housing. The sensor is disposed on the carrier. The interconnection structure is disposed on the carrier and surrounds the sensor. The interconnection structure has a first surface facing away from the carrier. The conductor is disposed on the first carrier. The conductor having a first portion covered by the interconnection structure and a second portion exposed from the first surface of the interconnection structure. The housing is disposed on the carrier and surrounds the interconnection structure.

Abstract: A semiconductor device package includes: (1) a carrier; (2) a sensor element disposed on or within the carrier; and (3) a cover including a top surface, a bottom surface and an inner sidewall, the inner sidewall defining a penetrating hole extending from the top surface to the bottom surface, and the penetrating hole exposing the sensor element. The semiconductor device package is characterized such that (i) the inner sidewall is divided into an upper portion and a lower portion, the upper portion is substantially perpendicular to the top surface, and the lower portion is tilted; or (ii) the entire inner sidewall is tilted. The lower portion of the inner sidewall or the entire inner sidewall is tilted at an angle of between about 10° to less than about 90°, relative to the top surface.