Abstract: A fan includes a fan impeller. The fan impeller includes an inner frame, an outer frame and a disturbing structure. The inner frame rotates along a rotation axis. The outer frame is disposed around the inner frame. The blades are disposed between the inner frame and the outer frame and arranged radially. The disturbing structure has a plurality of protrusion columns disposed on the outer frame, and the protrusion columns are arranged surrounding the blades. The protrusion columns are provided to generate vortexes in the flow field for disturbing the flow as to reduce noise, and the wind pressure can be increased to obtain better operating characteristics.

Abstract: A method of forming dice includes the following steps. First, a wafer structure is provides, which includes a substrate and a stack of semiconductor layers disposed in die regions and a scribe line region. Then, the substrate and the stack of the semiconductor layers in the scribe line region are removed to form a groove in the substrate. After the formation of the groove, the substrate is further thinned to obtain the substrate with a reduced thickness. Finally, a separation process is performed on the substrate with the reduced thickness.

Abstract: A fan includes a hub and a blade assembly. The hub has a central portion and an extension portion. The extension portion is extended outwardly from a peripheral edge of the central portion. The blade assembly includes a plurality of blades. Each blade has a leading edge, each of the leading edges is an end point of each blade that is most close to the central portion. The blades are disposed around the hub. At least a part of the leading edges of the blades are connected to the extension portion, and distances between a center of the central portion and the leading edges of at least two blades are different. Therefore, the factors of fan and the quality of voice could be enhanced, and the multi-frequencies noise could be avoided during operation.

Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.

Abstract: A traffic light recognition system including a map, a localization module, at least one image capturing device and an image processing module is provided. The map is configured to provide an information relevant to a traffic light. The localization module is configured to provide a positioning information relevant to the traffic light. At least one image capturing device is configured to capture a real-time road image relevant to the traffic light. The image processing module is configured to combine the map and the positioning information of the traffic light provided by the localization module to generate a region of interest in the real-time road image captured by the image capturing device, and to recognize the traffic light in the region of interest, wherein the traffic light includes a light box and at least one light signal.

Abstract: A chip structure includes a substrate, a bottom conductive layer, a semiconductor layer, an interlayer dielectric layer, at least one electrode, and at least one top electrode. The substrate includes in order a core layer and a composite material. The bottom conductive layer is disposed on the bottom surface of the core layer, the semiconductor layer is disposed on the substrate, and an interlayer dielectric layer is disposed on the semiconductor layer. The at least one electrode is disposed between the semiconductor layer and the interlayer dielectric layer, and the at least one top electrode is disposed on the interlayer dielectric layer and electrically coupled to the at least one electrode.

Abstract: An apparatus for treatment of gaseous pollutants, the apparatus comprising a reaction portion and a passage. The reaction portion comprises a gas inlet unit, a reaction unit, a combustion unit and a cooling unit. The passage comprises a transverse section, a connection section and a straight section, the transverse section is provided with a top gas inlet in communication with the reaction portion and a lateral gas inlet, the connection section is connected between the transverse section and the straight section, the top gas inlet receives an effluent passing through the reaction portion and then flowing downwards, the lateral gas inlet receives a transverse air flow, and the effluent is driven by the transverse gas flow to form a cyclone and is discharged from an outlet of the straight section by means of the connection section.

Abstract: An optical transceiver includes an input assembly, an output port, a fiber patch panel, multiple first optical fibers and multiple second optical fibers. The input assembly is arranged on a circuit board and has a first input port and a second input port. The fiber patch panel is arranged between the input assembly and the output port, and has multiple first fiber patch slots and multiple second fiber patch slots. The first optical fibers are connected to the first input port and the output port. The first optical fiber passes through the first fiber patch slot and the second fiber patch slot. The second optical fibers are connected to the second input port and the output port. The second optical fiber passes through the first fiber patch slot and the second fiber patch slot. The second fiber patch slot accommodates the first optical fiber and the second optical fiber.

Abstract: A method of forming dice includes the following steps. First, a wafer structure is provides, which includes a substrate and a stack of semiconductor layers disposed in die regions and a scribe line region. Then, the substrate and the stack of the semiconductor layers in the scribe line region are removed to forma groove in the substrate. After the formation of the groove, the substrate is further thinned to obtain the substrate with a reduced thickness. Finally, a separation process is performed on the substrate with the reduced thickness.

Abstract: A sensor package includes a carrier, a sensor, an interconnection structure, a conductor and a housing. The sensor is disposed on the carrier. The interconnection structure is disposed on the carrier and surrounds the sensor. The interconnection structure has a first surface facing away from the carrier. The conductor is disposed on the first carrier. The conductor having a first portion covered by the interconnection structure and a second portion exposed from the first surface of the interconnection structure. The housing is disposed on the carrier and surrounds the interconnection structure.

Abstract: The present invention relates to a fluid control device and a connector for the same. The connector includes a first unit and a second unit to form a connector in a particular shape. Thus, the connector and an adjacent connector can be stacked upon each other to allow simple disassembling. The present invention also provides a fluid control device including the connector.

Abstract: The present invention relates to a fluid control device and a connector for the same. The connector includes a first unit and a second unit to form a connector in a particular shape. Thus, the connector and an adjacent connector can be stacked upon each other to allow simple disassembling. The present invention also provides a fluid control device including the connector.

Abstract: A semiconductor device package includes a carrier, a die, an encapsulation layer and a thickness controlling component. The die is disposed on the carrier, wherein the die includes a first surface. The encapsulation layer is disposed on the carrier, and encapsulates a portion of the first surface of the die. The encapsulation layer defines a space exposing another portion of the first surface of the die. The thickness controlling component is disposed in the space.

Abstract: An optical module and a method of manufacturing an optical module are provided. The optical module includes a carrier, an electronic component, a lid, a diffuser and a bonding layer. The electronic component is disposed on the carrier. The lid is disposed on the carrier. The lid has a first cavity to accommodate the electronic component. The lid defines a first aperture over the first cavity. The diffuser is disposed within the first aperture. The bonding layer is disposed between the diffuser and a sidewall of the first aperture.

Abstract: Techniques are described for encapsulating AV1 encoded video data within NAL units. For example, the NAL units can be H.264 or HEVC NAL units. Encapsulation can comprise using a reserved NAL unit type. For example, an open bitstream unit comprising AV1 encoded video data can be encapsulated within a NAL unit using a reserved NAL unit type. The NAL unit can be packetized for delivery to another computing device via a computer network.

Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.

Abstract: A method of validating learning outcomes of a student is disclosed. In the method, a teaching application includes a validation program to determine an execution score and a completion rate for the student's execution result, the teaching application includes a task database storing task packages which are teaching contents previously taught to the student, and the task package include a sub-task package for the student to execute tasks, the sub-task package includes a validation program for acceptance of the execution result and statistics of an execution score and a completion rate. According to the insufficiency of the student in response to the student's execution score and the completion rate displayed on the teaching application, the teaching application automatically assigns the student to challenge the failed task again or assigns a remedial task to the student, so as to improve the student in knowledge or skills learned in course.

Abstract: A device, a method and a storage medium for accelerating activation function in relation to data processing by artificial neural network provides a register for storing a storage table, a matching unit including a plurality of comparators, a logic unit, and a selection unit. The comparators compare an input variable of the activation function with the variable intervals of the activation function to obtain a comparison output result, the logic unit performs a logical operation according to the comparison output result to obtain a logic output result and determines a variable interval to be calculated according to the logic output. The selection unit queries the storage table according to the variable interval to be calculated and obtains parameters of fitted quadratic function. A calculation unit performs calculations on the input variable according to the parameters.

Abstract: A model parameters security protection method is implemented in a computing device in communication connection with at least one security protection device. The method includes training a data model based on an artificial neural network using a number of images and obtaining parameter information of the data model, encrypting the parameter information and generating a configuration file comprising the encrypted parameter information, and sending the configuration file to the at least one security protection device. The parameter information includes at least one of a weight of neuron and an offset value of the neuron of the artificial neural network.