Patents by Inventor Wei Chan

Wei Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10989205
    Abstract: A micro fan is provided. The micro fan includes a rotor and a stator. The stator includes an axial induced coil unit and a circuit board. The axial induced coil unit is made by twining a coil in an axial direction for at least two layers and in a radial direction for at least two layers.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: April 27, 2021
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chao-Wen Lu, Chih-Wei Chan, Che-Wei Lee
  • Patent number: 10982694
    Abstract: The present invention relates to a fluid control device and a connector for the same. The connector includes a first unit and a second unit to form a connector in a particular shape. Thus, the connector and an adjacent connector can be stacked upon each other to allow simple disassembling. The present invention also provides a fluid control device including the connector.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: April 20, 2021
    Assignee: SIW ENGINEERING PTE. LTD.
    Inventor: Chee-Wei Chan
  • Publication number: 20210112109
    Abstract: Techniques are described for encapsulating AV1 encoded video data within NAL units. For example, the NAL units can be H.264 or HEVC NAL units. Encapsulation can comprise using a reserved NAL unit type. For example, an open bitstream unit comprising AV1 encoded video data can be encapsulated within a NAL unit using a reserved NAL unit type. The NAL unit can be packetized for delivery to another computing device via a computer network.
    Type: Application
    Filed: November 1, 2019
    Publication date: April 15, 2021
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Mei-Hsuan Lu, Satya Sasikanth Bendapudi, Chun-Wei Chan, Ming-Chieh Lee
  • Publication number: 20210102550
    Abstract: A fan includes a fan impeller. The fan impeller includes an inner frame, an outer frame and a disturbing structure. The inner frame rotates along a rotation axis. The outer frame is disposed around the inner frame. The blades are disposed between the inner frame and the outer frame and arranged radially. The disturbing structure has a plurality of protrusion columns disposed on the outer frame, and the protrusion columns are arranged surrounding the blades. The protrusion columns are provided to generate vortexes in the flow field for disturbing the flow as to reduce noise, and the wind pressure can be increased to obtain better operating characteristics.
    Type: Application
    Filed: August 15, 2020
    Publication date: April 8, 2021
    Inventors: Chih-Wei CHAN, Cheng-Hsien YEH, Hui-Lun CHIN
  • Patent number: 10954946
    Abstract: A thin fan includes a frame and a driving device. The fan frame includes a base and a frame shell. The driving device includes a stator structure and a rotor structure disposed corresponding to the stator structure. The stator structure includes a stator pole group, a bushing, a bearing and a compression-resistant pillar. The rotor structure includes a hollow-cylindrical shaft, a rotor shell, a magnetic structure and an impeller. The shaft is mounted on the outer periphery of the compression-resistant pillar and is disposed between the compression-resistant pillar and the bearing. The rotor shell is connected to the shaft. The magnetic structure is disposed on the inner wall of the rotor shell, and the impeller is connected to the rotor shell. The maximum height of the rotor structure is lower than the height of the compression-resistant pillar when the rotor structure is connected to the stator structure.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: March 23, 2021
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Cheng-Hsien Yeh, Chih-Wei Chan
  • Patent number: 10946334
    Abstract: The invention provides a device and system for decomposing and oxidizing of gaseous pollutants. A novel reaction portion reduces particle formation in fluids during treatment, thereby improving the defect of particle accumulation in a reaction portion. Also, the system includes the device, wherein a modular design enables the system to have the advantage of easy repair and maintenance.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: March 16, 2021
    Assignee: SIW ENGINEERING PTE. LTD.
    Inventor: Chee-Wei Chan
  • Patent number: 10910532
    Abstract: A semiconductor device package is provided, which includes a carrier, an emitter and a first transparent encapsulant. The carrier has a first surface. The emitter is disposed on the first surface. The first transparent encapsulant encapsulates the emitter. The first transparent encapsulant includes a body and a lens portion. The body has a first planar surface. The lens portion is disposed on the body and has a first planar surface. The first planar surface of the lens portion is substantially coplanar with the first planar surface of the body.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: February 2, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hsin-Ying Ho, Hsun-Wei Chan
  • Patent number: 10898853
    Abstract: The invention provides a device and system for decomposing and oxidizing of gaseous pollutants. A novel reaction portion reduces particle formation in fluids during treatment, thereby improving the defect of particle accumulation in a reaction portion. Also, the system includes the device, wherein a modular design enables the system to have the advantage of easy repair and maintenance.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: January 26, 2021
    Assignee: SIW ENGINEERING PTE. LTD.
    Inventor: Chee-Wei Chan
  • Patent number: 10900516
    Abstract: A motor includes a shaft, a shell, a sleeve, an abrasion-resistance piece, a bearing, an oil seal, and several compressed springs. The shaft has an axial line. The shell is connected to the shaft. The sleeve has an accommodating space, and the wall of the accommodating space forms a first inclined surface which is inclined at an angle with respect to the axial line. The abrasion-resistance piece is disposed at the bottom of the accommodating space. The bearing is disposed in the accommodating space, and the outer wall of the bearing forms a second inclined surface corresponding to the first inclined surface. The shaft passes through the bearing and abuts the abrasion-resistance piece. The oil seal is affixed to the wall of the accommodating space and covers the bearing. The compressed springs are connected between the oil seal and the bearing.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: January 26, 2021
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Cheng-Hsien Yeh, Chih-Wei Chan
  • Publication number: 20210003136
    Abstract: A micro fan is provided. The micro fan includes a rotor and a stator. The stator includes an axial induced coil unit and a circuit board. The axial induced coil unit is made by twining a coil in an axial direction for at least two layers and in a radial direction for at least two layers.
    Type: Application
    Filed: September 18, 2020
    Publication date: January 7, 2021
    Inventors: Chao-Wen LU, Chih-Wei CHAN, Che-Wei LEE
  • Publication number: 20210005522
    Abstract: The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.
    Type: Application
    Filed: September 21, 2020
    Publication date: January 7, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chun-Han CHEN, Hsun-Wei CHAN, Mei-Yi WU
  • Patent number: 10869040
    Abstract: An image and video compression method includes defining one or more encoding quality patterns, the one or more encoding quality patterns each have pre-determined areas of quality adjustment, the pre-determined areas of quality adjustment including one or more pre-defined regions of lower quality adjustment and one or more pre-defined regions of higher quality adjustment; receiving a frame associated with content to be encoded; selecting one of the one or more encoding quality patterns; processing the frame via an encoder, the processing using the selected one of the one or more encoded quality patterns; and producing a final output of an encoded bit.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: December 15, 2020
    Inventor: Chun-Wei Chan
  • Patent number: 10862014
    Abstract: In an aspect, an optical device includes a substrate, a light source mounted on a top surface of the substrate, and a lid attached to the top surface of the substrate, the lid defining a reflective cup positioned over the light source. In another aspect, an optical device includes a substrate, a light source disposed on the substrate, and a lid disposed on the substrate. The lid defines a reflective cup for concentrating and passing light from the light source. The optical device further includes a film formed on an inner sidewall of the reflective cup for reflecting the light from the light source. The film includes a primer layer, a reflecting layer and a protective layer.
    Type: Grant
    Filed: November 12, 2015
    Date of Patent: December 8, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hsin-Ying Ho, Hsun-Wei Chan, Lu-Ming Lai, Shih-Chieh Tang
  • FAN
    Publication number: 20200355083
    Abstract: A fan includes a hub and a plurality of fan blades. The hub has an axle center. The fan blades are disposed around the hub. Each of the fan blades has a bent portion, and the bent portions of the fan blades are extended along a surrounding direction surrounding the axle center. The hub is welded with the bent portion of each of the fan blades along the surrounding direction. As a result, the number of fan blades is maximized, the strength is simultaneously ensured to be enough, and the advantages of effectively enhancing the fan characteristics are achieved.
    Type: Application
    Filed: January 3, 2020
    Publication date: November 12, 2020
    Inventors: Ching-Hsien Yeh, Chih-Wei Chan
  • Patent number: 10823225
    Abstract: A motor includes a shaft, a shell, a sleeve, an abrasion-resistance piece, a bearing, an oil seal, and several compressed springs. The shaft has an axial line. The shell is connected to the shaft. The sleeve has an accommodating space, and the wall of the accommodating space forms a first inclined surface which is inclined at an angle with respect to the axial line. The abrasion-resistance piece is disposed at the bottom of the accommodating space. The bearing is disposed in the accommodating space, and the outer wall of the bearing forms a second inclined surface corresponding to the first inclined surface. The shaft passes through the bearing and abuts the abrasion-resistance piece. The oil seal is affixed to the wall of the accommodating space and covers the bearing. The compressed springs are connected between the oil seal and the bearing.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: November 3, 2020
    Assignee: Delta Electronics, Inc.
    Inventors: Cheng-Hsien Yeh, Chih-Wei Chan
  • Patent number: 10816033
    Abstract: A bearing structure includes a plurality of wave-shaped grooves and an inner surface. The wave-shaped grooves are formed on the inner surface for receiving a lubricating fluid. Each of the wave-shaped grooves extends along a longitudinal axis of the bearing structure. Each of the wave-shaped grooves includes a first peak section, a second peak section, two first connecting sections, two second connecting sections and a trough section. The two first connecting sections are connected to opposite sides of the first peak section, and the two second connecting sections are connected to opposite sides of the second peak section. The trough section is disposed between the first peak section and the second peak section, and the trough section is connected to one of the first connecting sections and one of the second connecting sections. The first and second peak sections and the trough section have a circular arc structure.
    Type: Grant
    Filed: October 1, 2018
    Date of Patent: October 27, 2020
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Ching-Hsien Yeh, Chih-Wei Chan
  • Patent number: 10814271
    Abstract: The invention provides a device and system for decomposing and oxidizing of gaseous pollutants. A novel reaction portion reduces particle formation in fluids during treatment, thereby improving the defect of particle accumulation in a reaction portion. Also, the system includes the device, wherein a modular design enables the system to have the advantage of easy repair and maintenance.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: October 27, 2020
    Assignee: SIW Engineering Pte. Ltd.
    Inventor: Chee-Wei Chan
  • Publication number: 20200328322
    Abstract: An optical module and a method of manufacturing an optical module are provided. The optical module includes a carrier, an electronic component, a lid, a diffuser and a bonding layer. The electronic component is disposed on the carrier. The lid is disposed on the carrier. The lid has a first cavity to accommodate the electronic component. The lid defines a first aperture over the first cavity. The diffuser is disposed within the first aperture. The bonding layer is disposed between the diffuser and a sidewall of the first aperture.
    Type: Application
    Filed: April 15, 2019
    Publication date: October 15, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsiang-Chen TSAI, Lu-Ming LAI, Hsun-Wei CHAN, Ying-Chung CHEN
  • Patent number: 10804173
    Abstract: The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: October 13, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chun-Han Chen, Hsun-Wei Chan, Mei-Yi Wu
  • Patent number: 10782919
    Abstract: A command processing method and a storage controller are provided. The command processing method includes performing a command merging process on commands sequentially received by a command queue. The command merging process includes an initialization step and multiple iterations. The initialization step includes transmitting the commands from the command queue to a continuity checking pool (CCP), transmitting an initial command of the commands from the CCP to a continuity list (CL) and setting a range of the CL. Each of the iterations includes transmitting the commands from the command queue to the CCP; determining whether the commands in the CCP and the range of the CL conform to a continuity condition; and when the commands in the CCP and the range conform to the continuity condition, appending the first command to the CL and resetting the range of the CL according to the first command.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: September 22, 2020
    Assignee: Shenzhen EpoStar Electronics Limited CO.
    Inventors: Ke-Wei Chan, Di-Hsien Ngu, Hung-Chih Hsieh