Abstract: Methods and systems include adapting an initial prompt to a target domain corresponding to an input time series to generate an adapted prompt. The adapted prompt and the input time series are combined. The input time series is processed with the adapted prompt using a modular transformer encoder that has a plurality of sub-encoders, with a policy network selecting a subset of the plurality of encoders that are applied to the input time series and the adapted prompt.

Abstract: A touch-control display panel is provided, which includes a touch-control layer and a display functional layer, where the touch-control layer includes a plurality of first touch-control electrodes and a plurality of second touch-control electrodes; the first touch-control electrode includes a plurality of first touch-control electrode blocks, each of the first touch-control electrode blocks includes at least one first hollowed-out region and at least one second hollowed-out region, an area of the first hollowed-out region is larger than an area of the second hollowed-out region; and the touch-control layer further includes at least one first dummy electrode and at least one second dummy electrode, where the first dummy electrode is located in the corresponding first hollowed-out region, and the second dummy electrode is located in the corresponding second hollowed-out region.

Abstract: In some embodiments, the present disclosure relates to a 3D integrated circuit (IC) stack that includes a first IC die bonded to a second IC die. The first IC die includes a first semiconductor substrate, a first interconnect structure arranged on a frontside of the first semiconductor substrate, and a first bonding structure arranged over the first interconnect structure. The second IC die includes a second semiconductor substrate, a second interconnect structure arranged on a frontside of the second semiconductor substrate, and a second bonding structure arranged on a backside of the second semiconductor substrate. The first bonding structure faces the second bonding structure. Further, the 3D IC stack includes a first backside contact that extends from the second bonding structure to the backside of the second semiconductor substrate and is thermally coupled to at least one of the first or second interconnect structures.

Abstract: A package assembly and a manufacturing method thereof are provided. The package assembly includes a photonic integrated circuit component, an electric integrated circuit component, a lens and an optical signal port. The photonic integrated circuit component comprises an optical input/output portion configured to transmit and receive optical signal. The electric integrated circuit component is electrically connected to the photonic integrated circuit component. The lens is disposed on a sidewall of the photonic integrated circuit component. The optical signal port is optically coupled to the optical input/output portion.

Abstract: An antenna module includes a ground radiator, a first antenna, and a second antenna. The first antenna comprises a first radiator, a second radiator, and a third radiator. The first radiator and the second radiator resonate at a low frequency band and a first high frequency band, and a part of the first radiator and the third radiator resonate at a second high frequency band. The second antenna includes a fourth radiator, the second radiator, and a connecting section. The connecting section is connected between the fourth radiator and the second radiator. A part of the fourth radiator, the connecting section, and the second radiator resonate at the low frequency band and the second high frequency band, and the fourth radiator, the connecting section, and a part of the second radiator resonate at the first high frequency band.

Abstract: A method includes placing a first package component. The first package component includes a first alignment mark and a first dummy alignment mark. A second package component is aligned to the first package component. The second package component includes a second alignment mark and a second dummy alignment mark. The aligning is performed using the first alignment mark for positioning the first package component, and using the second alignment mark for position the second package component. The second package component is bonded to the first package component to form a package, with the first alignment mark being bonded to the second dummy alignment mark.

Abstract: A key structure of electronic device including a substrate, a light source disposed on the substrate, an elastic member disposed on the substrate, and a key cap disposed on the elastic member is provided. The elastic member has a tunnel for passing light generated by the light source and projecting toward the key cap. An inner diameter of the tunnel gradually expands from the light source toward the key cap.

Abstract: A package substrate includes a core layer, at least one functional component, at least one spacer, a filler, a first and a second build-up structures. The core layer has at least one opening and multiple conductive through vias. The functional component is disposed in the openings. The spacer is disposed on the functional component. The filler is filled in the opening, covering the functional component and spacer, and completely filling the gap between the opening, the functional component and the spacer. The first build-up structure is disposed on a first surface of the core layer and a third surface of the filler, and electrically connected to the functional component and the conductive through vias. The second build-up structure is disposed on a second surface of the core layer and a fourth surface of the filler, contacts the spacer and electrically connected to the conductive through vias.

Abstract: A lens module, constructed to include all necessary filters but retaining its wide-angle characteristic and short focal length, is comprised of a housing, a cover plate, and a filter switcher. The housing and the cover plate form a receiving cavity, the cavity containing the filter switcher. The filter switcher includes holder, two mounting frames, two first adhesive layers, and two filters, and is of minimal thickness. The two first adhesive layers fix the filters on the two mounting frames. An enlarged installation space within the lens module is not required. The disclosure also relates to an electronic device using the lens module.

Abstract: A susceptor assembly for supporting a crucible during a crystal growth process includes a susceptor base, a tubular sidewall connected to the susceptor base, and a removable sacrifice ring interposed between the susceptor base and the sidewall. Each of the susceptor base and the sidewall is formed of a carbon-containing material. The susceptor base has an annular wall and a shoulder extending radially outward from an outer surface of the annular wall. The sidewall has a first end that receives the annular wall to connect the sidewall to the susceptor base. The sacrifice ring has a first surface that faces the outer surface of the annular wall, a second surface that faces an interior surface of the sidewall, and a ledge extending outward from the second surface that engages the first end of the sidewall.

Abstract: A chemical mechanical planarization system includes a chemical mechanical planarization pad that rotates during a chemical mechanical planarization process. A chemical mechanical planarization head places a semiconductor wafer in contact with the chemical mechanical planarization pad during the process. A slurry supply system supplies a slurry onto the pad during the process. A pad conditioner conditions the pad during the process. An impurity removal system removes debris and impurities from the slurry.

Abstract: An electronic apparatus performs a method of coding video data. The method includes receiving, from a bitstream of the video data, a first syntax that indicates an affine motion model enabled for a current coding block, estimating parameters of the affine motion model using gradients of motion vectors of multiple spatial neighboring blocks of the current coding block, and constructing motion vectors of the affine motion model for the current coding block by using the estimated parameters. In some embodiments, constructing motion vectors further includes converting the estimated parameters into control point motion vectors (CPMVs), and adding the CPMVs into a current affine merge candidate list. In some embodiments, constructing motion vectors further includes deriving a motion vector predictor for an affine mode.

Abstract: A method of verifying an integrated circuit stack includes adding a first dummy layer to a first contact pad of a circuit, wherein a location of the first dummy layer is determined based on a location of a second contact pad of a connecting substrate. The method further includes converting the first dummy layer location to the connecting substrate. The method further includes adjusting the first dummy layer location in the circuit in response to a determination that the first dummy layer location is misaligned with the second contact pad. The method further includes performing a first layout versus schematic (LVS) check of the connecting substrate including the first dummy layer in response to a determination that the first dummy layer is aligned with the second contact pad.

Abstract: Methods, systems, and devices for wireless communications are described. A receiving device (such as user equipment (UE)) may receive a downlink grant including an indication to report channel state information. The receiving device may identify, based on the downlink grant, a number of channel state information processing units associated with reporting the channel state information, and may determine that an available number of channel state information processing units is less than the number of channel state information processing units. In some cases, the receiving device may allocate, based on the determining, a set of channel state information processing units including the available number of channel state information processing units and one or more additional channel state information processing units. The receiving device may then transmit the channel state information report based on the set of channel state information processing units.

Abstract: A method for detecting defects in products from images thereof and an electronic device applying the method inputs a defect image repair data set into an autoencoder to train the autoencoder, and generates a reconstructed image, calculates a reference error value between the sample image and the reconstructed image by a preset error function, and set a threshold value based on the reference error value. The electronic device inputs an image possibly revealing a defect into the autoencoder and generates the reconstructed image corresponding to the image to be detected, and uses the preset error function to calculate the reconstruction error between the image and the reconstructed image, thereby determining whether the image being analyzed does reveal defects. When the reconstruction error is greater than the threshold value, a determination is made that a defect is revealed.

Abstract: An antenna device includes a substrate and four antenna units. The four antenna units are disposed on the substrate. Each of the four antenna units includes an L-shaped radiation portion, a hook-shaped coupling portion and a ground portion. The hook-shaped coupling portion is adjacent to the L-shaped radiation portion. The ground portion is disposed around the L-shaped radiation portion and the hook-shaped coupling portion. One end of the hook-shaped coupling portion is connected to the ground portion.

Abstract: The present application provides a reworking method of a failed hard mask layer on a via opening in a dielectric layer, including removing the failed hard mask layer; forming an underfill layer to fill the via opening; forming a top hard mask layer on the underfill layer; and forming a mask layer on the top hard mask layer.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment may determine a transmission power for an uplink shared channel communication based at least in part on at least one of a code rate parameter, a block length parameter, or a target block error rate parameter associated with the uplink shared channel communication. In some aspects, the user equipment may transmit the uplink shared channel communication using the transmission power based at least in part on determining the transmission power. Numerous other aspects are provided.

Abstract: A display substrate and a display device are provided. The display substrate includes light emitting diode chips, each light emitting diode chip includes light emitting units which respectively emit light of different colors, each light emitting unit includes a first electrode, a light emitting layer, a base and a second electrode, and the base and the second electrode are respectively located at both sides of the light emitting layer. In each light emitting diode chip, the light emitting units share the base and the first electrode, the light emitting layers of the light emitting units emit light of the same color, and at least one light emitting unit further includes a first color conversion layer located at a side of the base away from the light emitting layer, so as to convert first color light emitted by the light emitting layer into second color light.

Abstract: An end cover assembly includes: an end cover with a through hole for injecting electrolyte and a first clamping portion, wherein the first clamping portion is disposed along a circumferential direction of the through hole and is located on one side of the end cover away from an interior of the battery cell; a sealing ring for sealing the through hole; and a pressure relief device covering at least part of the sealing ring and closing the through hole; wherein the pressure relief device includes a second clamping portion, and is rotatable such that when the pressure relief device is rotated to a first position, the second clamping portion is clamped with the first clamping portion; and when the pressure relief device is rotated to a second position, the second clamping portion is disengaged from the first clamping portion.