Abstract: The present disclosure relates to a transgenic plant cell comprising polynucleotide sequences encoding glycolate dehydrogenase, malate synthase, and an inhibitory polynucleotide targeting an endogenous glycolate transporter Plgg1, wherein expression of endogenous glycolate transporter Plgg1 in the transgenic plant cell is about 20% to 80% of expression of endogenous glycolate transporter Plgg1 in a plant cell that is not transformed with an inhibitory polynucleotide targeting an endogenous glycolate transporter Plgg1. Also disclosed are transgenic plants, transgenic plant cultures, and methods for increasing photosynthesis efficiency in plants. The disclosed methods enhance biomass productivity and reduce the negative impact of photorespiration and introduction of transgenic constructs on plant growth.

Abstract: A mobile device includes a system circuit board, a metal frame, one or more other antenna elements, a display device, a first feeding element, and an RF (Radio Frequency) module. The system circuit board includes a system ground plane. The metal frame at least includes a first portion and a second portion. The metal frame at least has a first cut point positioned between the first portion and the second portion. The metal frame further has a second cut point for separating the other antenna elements from the first portion. The first cut point is arranged to be close to a middle region of the display device. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion.

Abstract: The present invention provides an emitter made of a hafnium carbide (HfC) single crystal that stably emits electrons with high efficiency, a method for manufacturing the emitter, and an electron gun and an electronic device using the emitter. An emitter according to an embodiment of the present invention is an emitter including a nanowire, in which the nanowire is made of the hafnium carbide (HfC) single crystal, at least an end of the nanowire through which electrons are to be emitted is coated with hafnium oxycarbide (HfC1?xOx: 0<x?0.5), and a field electron emission pattern of the end obtained by a field emission microscope (FEM) is a single spot.

Abstract: A motor drive system includes an electric motor, a drive circuit and a control unit. The drive circuit provides a driving current to the electric motor. A current command generator of the control unit generates a current command according to a torque command and a motor operating information. The driving current is converted into a d-axis current and/or a q-axis current by the control unit. Consequently, the driving current is close to the d-axis current command and/or the q-axis current command corresponding to the current command. If a value of the torque command is positive, the current command generator generates the corresponding current command according to a MTPA lookup table. If the value of the torque command is negative, the current command generator generates the corresponding current command according to a zero recycle lookup table.

Abstract: A micro light-emitting diode display panel includes a substrate, at least one light-emitting element, a reflective layer and a light-absorbing layer. The at least one light-emitting element is disposed on the substrate to define at least one pixel, and each light-emitting element includes micro light-emitting diodes. The reflective layer is disposed on the substrate and located between the micro light-emitting diodes. The reflective layer has cavities surrounding the micro light-emitting diodes, such that a thickness of a portion of the reflective layer close to any one of the micro light-emitting diodes is greater than a thickness of a portion of the reflective layer away from the corresponding micro light-emitting diode. The light-absorbing layer is at least disposed in the cavities of the reflective layer.

Abstract: A method includes depositing solder paste over first contact pads of a first package component. Spring connectors of a second package component are aligned to the solder paste. The solder paste is reflowed to electrically and physically couple the spring connectors of the second package component to the first contact pads of the first package component. A device includes a first package component and a second package component electrically and physically coupled to the first package component by way of a plurality of spring coils. Each of the plurality of spring coils extends from the first package component to the second package component.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: An electronic device and a forming method thereof are provided. The electronic device includes a substrate, a metal layer, a first insulating layer, a first conductive layer, a second insulating layer, and a second conductive layer. The metal layer is disposed on the substrate and includes a sensing line and a drain electrode. The first insulating layer is disposed on the metal layer. The first conductive layer is disposed on the first insulating layer and includes a touch electrode. The second insulating layer is disposed on the first conductive layer. The second conductive layer is disposed on the second insulating layer and includes a conductive pattern. The conductive pattern is electrically connected to the sensing line and the touch electrode.

Abstract: A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.

Abstract: The present invention provides a simpler method for sharpening a tip of an emitter. In addition, the present invention provides an emitter including a nanoneedle made of a single crystal material, an emitter including a nanowire made of a single crystal material such as hafnium carbide (HfC), both of which stably emit electrons with high efficiency, and an electron gun and an electronic device using any one of these emitters. A method for manufacturing the emitter according to an embodiment of the present invention comprises processing a single crystal material in a vacuum using a focused ion beam to form an end of the single crystal material, through which electrons are to be emitted, into a tapered shape, wherein the processing is performed in an environment in which a periphery of the single crystal material fixed to a support is opened.

Abstract: A micro-light-emitting diode chip includes an epitaxial structure, an electrode, a transparent structure, and a reflection layer. The epitaxial structure has a light exit surface, a back surface opposite to the light exit surface, and a sidewall surface. The sidewall surface is connected to the light exit surface and the back surface. The electrode is electrically coupled to the epitaxial structure. The transparent structure has an inner surface and an outer surface opposite to the inner surface. The inner surface is connected to the sidewall surface. A distance between the outer surface and the inner surface on a plane where the back surface is located is less than a distance between the outer surface and the inner surface on a plane where the light exit surface is located. The reflection layer is in direct contact with the outer surface. A micro-light-emitting diode display is also provided.

Abstract: Disclosed are semiconductor devices including a substrate, a first transistor formed over a first portion of the substrate, wherein the first transistor comprises a first nanosheet stack including N nanosheets and a second transistor over a second portion of the substrate, wherein the second transistor comprises a second nanosheet stack including M nanosheets, wherein N is different from M in which the first and second nanosheet stacks are formed on first and second substrate regions that are vertically offset from one another.

Abstract: A package structure including a semiconductor die, an encapsulant, a redistribution structure, and a through insulating via is provided. The first redistribution structure includes an insulating layer and a circuit layer. The semiconductor die is disposed on the first redistribution structure. The semiconductor die includes a semiconductor base, through semiconductor vias, a dielectric layer, and bonding connectors. Through semiconductor vias penetrate through the semiconductor base. The dielectric layer is disposed on a backside of the semiconductor base. The dielectric layer of the semiconductor die is bonded with the insulating layer of the first redistribution structure. The bonding connectors are embedded in the dielectric layer and connected to the through semiconductor vias. The bonding connectors of the semiconductor die are bonded with bonding pads of the circuit layer. The encapsulant is disposed on the first redistribution structure and encapsulates the semiconductor die.

Abstract: In an automatic gamma adjustment system with environmental adaptability, the system is installed in a display device and an image signal source is selected, such that an image signal is received and converted into first YUV signals, while detecting the surrounding situation to obtain at least one environmental data, and obtaining a gamma control parameter of a display screen of the display device according to the environmental data. When the environmental data is calculated to obtain a maximum brightness current value, the gamma control parameter is used to calculate the first YUV signals as second YUV signals, and the maximum brightness current value and the second YUV signals are sent to the display device for displaying the image. Therefore the grayscale layering effect of an image presented to people can be adjusted by automatically correcting the gamma value according to the surrounding situation at any time.

Abstract: A robotic surgical system includes a surgical robot holding a surgical instrument, a wearable device worn by a person, a camera for capturing images, and a computer device. The camera captures images of a base marker, and a dynamic reference frame disposed on an affected part of a patient. The computer device calculates a plurality of conversion relationships among different coordinate systems, and controls the surgical robot to move the surgical instrument according to a pre-planned surgical path and based on the conversion relationships. Furthermore, the computer device transmits data of a 3D model and the pre-planned surgical path to the wearable device, such that the wearable device is configured to present the 3D model in combination with the pre-planned surgical path as an AR image based on the conversion relationships.

Abstract: Systems and methods are provided for machine-learned models including convolutional neural networks that generate predictions using continuous convolution techniques. For example, the systems and methods of the present disclosure can be included in or otherwise leveraged by an autonomous vehicle. In one example, a computing system can perform, with a machine-learned convolutional neural network, one or more convolutions over input data using a continuous filter relative to a support domain associated with the input data, and receive a prediction from the machine-learned convolutional neural network. A machine-learned convolutional neural network in some examples includes at least one continuous convolution layer configured to perform convolutions over input data with a parametric continuous kernel.

Abstract: A method includes forming a transistor, which includes forming a gate dielectric on a semiconductor region, forming a gate electrode over the gate dielectric, and forming a source/drain region extending into the semiconductor region. The method further includes forming a source/drain contact plug over and electrically coupling to the source/drain region, and forming a gate contact plug over and in contact with the gate electrode. At least one of the forming the gate electrode, the forming the source/drain contact plug, and the forming the gate contact plug includes forming a metal nitride barrier layer, and depositing a metal-containing layer over and in contact with the metal nitride barrier layer. The metal-containing layer includes at least one of a cobalt layer and a metal silicide layer.

Abstract: A slurry blending tool may include a blending tank to receive and blend one or more materials into a slurry, and at least one inlet pipe connected to the blending tank and to provide the one or more materials to the blending tank. The at least one inlet pipe may vertically enter the blending tank and may not contact the blending tank. The slurry blending tool may include a blending pump partially provided within the blending tank and to blend the one or more materials into the slurry. The slurry blending tool may include an outlet pipe connected to the blending pump and to remove the slurry from the blending tank.

Abstract: An electronic device includes a storage array, a row fan, a distance sensor, and a controller. The storage array includes a plurality of storage units. The row fan cools the storage array. The distance sensor senses the distance between the storage array and the row fan and outputs a corresponding distance signal. The controller receives the distance signal and sets the distance threshold of each of the storage units. When the distance is longer than the distance threshold, the controller outputs a control signal to the row fan to increase the rotation speed of the row fan.