Patents by Inventor Wei Lu

Wei Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210066914
    Abstract: Provided are a load transfer method and system in thunder and lightning weather. The method includes: detecting lightning and predicting a position and time of a lightning strike to obtain a lightning prediction result; determining a transmission line possibly struck by lightning in a power grid according to the lightning prediction result; determining a load transfer scheme; and before the lightning occurs, transferring at least part of loads on the transmission line possibly struck by lightning according to the load transfer scheme.
    Type: Application
    Filed: August 7, 2020
    Publication date: March 4, 2021
    Inventors: Yunfeng CAI, Chong TONG, Ning WANG, Yang XU, Huiwen LU, Kang DAI, Wei YIN, Bowen WU, Liang WANG, Jianqiang MIAO
  • Publication number: 20210067632
    Abstract: Aspects of this disclosure are directed to a voice message display method and apparatus in an application, a computer device, and a computer-readable storage medium. The method can be performed by a terminal on which an application is installed and is capable of receiving a voice message. The method can include starting an application, and obtaining n voice messages published by at least one user account. The method can further include displaying a voice message presentation interface of the application, where the voice message presentation interface displays the voice message in a virtual world and the voice message are displayed by using a visible element in the virtual world as a carrier.
    Type: Application
    Filed: November 12, 2020
    Publication date: March 4, 2021
    Applicant: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Wei DAI, Kun LU, Qinghua ZHONG, Jun WU, Yingren WANG, Rong HUANG
  • Publication number: 20210060091
    Abstract: The disclosure discloses Bacteroides ovatus for relieving endotoxin infection and application thereof, and belongs to the technical field of microorganisms. The Bacteroides ovatus CCFM1021 of the disclosure has low immunogenicity, and can reduce the content of pro-inflammatory factors and increase the concentration of anti-inflammatory factors in the blood of mice infected with endotoxin, up-regulate the number of Foxp3+ regulatory T cells and stabilize the composition of the intestinal microbiota. A pharmaceutical composition of the Bacteroides ovatus CCFM1021 for relieving endotoxin infection has broad application prospects.
    Type: Application
    Filed: October 28, 2020
    Publication date: March 4, 2021
    Inventors: Wei CHEN, Qixiao ZHAI, Huizi TAN, Wenwei LU, Fengwei TIAN, Jianxin ZHAO, Hao ZHANG
  • Publication number: 20210067860
    Abstract: A method of adjusting a tone and a tone-adjustable earphone includes obtaining bioinformation of the user, wherein the bioinformation includes a head volume, calculating a nature frequency of the head of the user according to the bioinformation and adjusting a playback tone of the earphone according to the nature frequency of the head.
    Type: Application
    Filed: August 27, 2020
    Publication date: March 4, 2021
    Inventor: Ryan Meng-Wei LU
  • Publication number: 20210066211
    Abstract: A package structure includes a circuit substrate and a semiconductor package. The semiconductor package is disposed on the circuit substrate, and includes a plurality of semiconductor dies, an insulating encapsulant and a connection structure. The insulating encapsulant comprises a first portion and a second portion protruding from the first portion, the first portion is encapsulating the plurality of semiconductor dies and has a planar first surface, and the second portion has a planar second surface located at a different level than the planar first surface. The connection structure is located over the first portion of the insulating encapsulant on the planar first surface, and located on the plurality of semiconductor dies, wherein the connection structure is electrically connected to the plurality of semiconductor dies and the circuit substrate.
    Type: Application
    Filed: May 4, 2020
    Publication date: March 4, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Fu Tsai, Kung-Chen Yeh, Li-Chung Kuo, Szu-Wei Lu, Ying-Ching Shih
  • Publication number: 20210066151
    Abstract: A package structure includes a circuit substrate, a semiconductor package, a lid structure, a passive device and a barrier structure. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semiconductor package. The lid structure is attached to the circuit substrate through an adhesive material. The passive device is disposed on the circuit substrate in between the semiconductor package and the lid structure. The barrier structure is separating the passive device from the lid structure and the adhesive material, and the barrier structure is in contact with the adhesive material.
    Type: Application
    Filed: April 12, 2020
    Publication date: March 4, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsien-Pin Hu, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu, Wen-Hsin Wei, Chih-Chien Pan
  • Publication number: 20210059552
    Abstract: A smart system for monitoring a cognition status of a user includes an electroencephalography (EEG) acquisition module, configured to capture a plurality of brainwave signals; an analog filter circuit, coupled to the EEG acquisition module and configured to amplify the plurality of brainwave signals; an analog to digital (ADC) circuit, coupled to the analog filter circuit and configured to transform the plurality of brainwave signals into a plurality of digital signals; and a digital signaling processing (DSP) circuit, configured to retrieve a plurality of characteristics from the plurality of digital signals to determine the cognition status of the user.
    Type: Application
    Filed: September 2, 2019
    Publication date: March 4, 2021
    Inventors: Li-Wei Ko, Pei-Lun Wu, Heng-An Tzou, Yang Chang, Yi-Chen Lu, Shyh-Jian Tang, Chia-Lung Yeh, Pin-Jun Lin, Jia-Siang Ruan
  • Publication number: 20210065976
    Abstract: The present invention discloses an inter-layer transition forming machine for winding of a large-sized superconducting coil. A vertically movable forming mechanism and a horizontally movable forming mechanism are mounted on a fixing plate. When the winding of a large-sized superconducting coil performs inter-layer transition, an armored superconducting conductor is clamped by wedge clamping mechanisms with right- and left-handed threads on the vertically movable forming mechanism and the horizontally movable forming mechanism, and a reference line on the conductor is ensured to be aligned with a reference line on a forming mold. The vertically movable forming mechanism is pressed down, under the drive of a double-acting hydraulic cylinder, in a vertical direction to form inter-layer transition, and the horizontally movable forming mechanism moves in a horizontal direction according to the reduction of the vertically movable forming mechanism.
    Type: Application
    Filed: August 27, 2019
    Publication date: March 4, 2021
    Inventors: Xing SHEN, Wei WEN, Jin CHEN, Yuntao SONG, Kun LU, Weiyue WU
  • Publication number: 20210059511
    Abstract: A method for distinguishing plaque and calculus is provided. The method is used in a device and includes the following steps: emitting, by a blue light-emitting diode, blue light to illuminate teeth in an oral cavity, wherein the blue light is used to generate autofluorescence of plaque and calculus on the teeth; sensing, by an image sensor, the autofluorescence of plaque and calculus; and distinguishing, by a processor, a plaque area and a calculus area on the teeth based on the autofluorescence.
    Type: Application
    Filed: January 28, 2020
    Publication date: March 4, 2021
    Inventors: Kai-Ju CHENG, Hsin-Lun HSIEH, Chin-Yuan TING, Tsung-Hsin LU, Huan-Tang WU, Shao-Ang CHEN, Yu-Hsun CHEN, Jia-Chyi WANG, Chih-Wei SUNG, Huan-Pin SHEN
  • Publication number: 20210059423
    Abstract: An electric adjustment device for sofa headrest includes a first fixing member, a second fixing member, and a drive device having an output end that linearly reciprocates. One end of the second fixing member is pivotally connected to the first fixing member, and the drive device is pivotally connected to the first fixing member and arranged flush with the first fixing member. A sliding direction of the output end is perpendicular to a pivotal axis about which the second fixing member is pivotable to the first fixing member. Specifically, the second fixing member is extended downward to form a fixed end for fixing to a backrest support frame. The electric adjustment device is installed in the headrest support frame instead of the backrest support frame, so that other functional parts are installed inside internal space of the backrest support frame which improves the function of the sofa.
    Type: Application
    Filed: November 1, 2019
    Publication date: March 4, 2021
    Inventor: Wei Lu
  • Publication number: 20210066688
    Abstract: The present disclosure relates to an energy storage assembly for a construction machine, such as a tracked construction machine, comprising at least a first and a second energy storage device such as a first and a second battery device, the energy storage devices each being configured to power a working equipment and/or locomotion of the construction machine, a rack mountable to the construction machine, the rack being configured to support the first and second energy storage devices, such as vertically above each other, and a first damping device for damping vertical shocks acting on the first energy storage device and a separate second damping device for damping vertical shocks acting on the second energy storage device.
    Type: Application
    Filed: July 29, 2020
    Publication date: March 4, 2021
    Inventors: Weilin Wu, Wen Cai, Wei Lu
  • Patent number: 10938628
    Abstract: The present disclosure provides a battery management system and a communication method. The method includes: determining, by a main BMU, from a plurality of managed units a fault unit that communicates abnormally with the main BMU, and transmitting, by the main BMU, to a backup BMU a fault frequency at which the fault unit communicates abnormally with the main BMU; selecting, by the backup BMU, from the managed units a managed unit that communicates normally with the backup BMU and the fault unit as a target unit; transmitting, by the backup BMU, frequency-conversion information to the fault unit through the target unit based on the fault frequency; converting, by the fault unit, its frequency to a frequency; transmitting the frequency to the main BMU if the backup BMU communicates normally with the fault unit using the frequency; and communicating, by the main BMU, with the fault unit using the frequency.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: March 2, 2021
    Assignee: Contemporary Amperex Technology Co., Limited
    Inventors: Zhimin Dan, Wenbin Lu, Wei Zhang, Yizhen Hou, Jia Xu, Jiechao Luo, Teng Yu
  • Patent number: 10934552
    Abstract: The disclosure herein relates to construction and application of engineering bacteria capable of secreting and expressing diacetylchitobiose deacetylase, and belongs to the technical field of fermentation engineering. Firstly, recombinant B. subtilis capable of heterologously secreting and expressing a diacetylchitobiose deacetylase gene is constructed, and a signal peptide fragment yncM is added into the recombinant vector for the first time. The signal peptide can secrete the target protein diacetylchitobiose deacetylase outside the cells of the recombinant B. subtilis, and a mutant of the 5?-end untranslated region is acquired, thereby significantly increasing the expression level of the target protein, and greatly simplifying the subsequent enzyme separation and purification steps. When the acquired diacetylchitobiose deacetylase is fermented and cultured in a fermentation medium for 50-60 h, the enzyme activity reaches a maximum of 1,548.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: March 2, 2021
    Assignees: Jiangnan University, SHANDONG RUNDE BIOTECHNOLOGY CO., LTD
    Inventors: Long Liu, Jian Chen, Guocheng Du, Xueqin Lv, Jianghua Li, Zhu Jiang, Wei Lu, Hongzhi Zhang, Jianxing Lu, Changfeng Liu
  • Patent number: 10932704
    Abstract: A device for measuring brain oxygen level of a subject, including a probe (210) and a detecting means (220), which are respectively coupled to a processor (230). According to the example, the probe (210) includes three light sources (215a, 215b, 215c) that simultaneously emit the first, second, and third NIR wavelengths across the brain of the subject. The first NIR wavelength is the isosbestic wavelength for oxy-hemoglobin (HbO2) and deoxy-hemoglobin (Hb), the second NIR wavelength is shorter than the first NIR wavelength, and the third NIR wavelength is longer than the first NIR wavelength. The detecting means (220) includes a first, second and third detectors (221, 222, 223) for respectively detecting the NIR intensities of the first, second and third NIR wavelengths traveled across the brain. The processor (230) is configured to determine blood oxygen level based on the measured NIR intensities of the first, second and third NIR wavelengths by use of build-in algorithm derived from Beer-Lambert Law.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: March 2, 2021
    Assignee: MACKAY MEMORIAL HOSPITAL
    Inventors: Wen-Han Chang, Chih-Wei Lu
  • Publication number: 20210057384
    Abstract: Semiconductor packages and methods of forming the same are provided. One of the semiconductor packages includes a first semiconductor die, an adhesive layer, a second semiconductor die and an underfill. The first semiconductor die includes a first surface, and the first surface includes a central region and a peripheral region surrounding the central region. The adhesive layer is adhered to the peripheral region and exposes the central region. The second semiconductor die is stacked over the first surface of the first semiconductor die. The underfill is disposed between the first semiconductor die and the second semiconductor die.
    Type: Application
    Filed: August 22, 2019
    Publication date: February 25, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chin-Fu Kao, Chih-Yuan Chien, Li-Hui Cheng, Szu-Wei Lu
  • Publication number: 20210058368
    Abstract: Embodiments are directed to host discovery for firewall coordination. An embodiment of a storage medium includes instructions for discovering a network topology for a network branch, the network branch including multiple access points including a first access point, the first access point having an interface to a network, the discovery of the network topology including identifying any access point that is linked to the first access point directly or via one or more intermediary access points; discovering one or more host devices that are connected by wireless or wired connections to one or more access points in the network branch; and generating a firewall coordination plan for the network branch based on the discovered network topology and the discovered one or more hosts, the firewall coordination plan including applying a firewall process for an access point to which a first host device is attached and bypassing one or more other firewall processes.
    Type: Application
    Filed: August 22, 2019
    Publication date: February 25, 2021
    Inventors: Hao Lu, Yan Liu, Wei Huang, Rajini Balay
  • Publication number: 20210055804
    Abstract: An interaction method, device and equipment for operable object.
    Type: Application
    Filed: May 9, 2019
    Publication date: February 25, 2021
    Inventors: Guibin CHEN, Chi FANG, Wei LU, Huayun MIAO, Yonghao LUO, Yi LI, Yumeng LI
  • Publication number: 20210057383
    Abstract: A method includes bonding a first and a second package component on a top surface of a third package component, and dispensing a polymer. The polymer includes a first portion in a space between the first and the third package components, a second portion in a space between the second and the third package components, and a third portion in a gap between the first and the second package components. A curing step is then performed on the polymer. After the curing step, the third portion of the polymer is sawed to form a trench between the first and the second package components.
    Type: Application
    Filed: November 10, 2020
    Publication date: February 25, 2021
    Inventors: Szu-Wei Lu, Ying-Da Wang, Li-Chung Kuo, Jing-Cheng Lin
  • Publication number: 20210057432
    Abstract: A memory device includes a conductive strip stack structure having conductive strips and insulating layers stacked in a staggered manner and a channel opening passing through the conductive strips and the insulating layer; a memory layer disposed in the channel opening and overlying the conductive strips; a channel layer overlying the memory layer; a semiconductor pad extending upwards from a bottom of the channel opening beyond an upper surface of a bottom conductive strip, in contact with the channel layer, and electrically isolated from the conductive strips; wherein the channel layer includes a first portion having a first doping concentration and a second portion having a second doping concentration disposed on the first portion.
    Type: Application
    Filed: August 19, 2019
    Publication date: February 25, 2021
    Inventors: Chun-Chang LU, Wen-Jer TSAI, Guan-Wei WU, Yao-Wen CHANG
  • Publication number: 20210057343
    Abstract: A package structure is provided. The package structure includes a first redistribution structure and an interposer over the first redistribution structure. The package structure also includes a molding compound layer surrounding the interposer, and a second redistribution structure over the interposer. The molding compound layer is between the first redistribution structure and the second redistribution structure. The package structure further includes a first semiconductor die and a second semiconductor die over the second redistribution structure.
    Type: Application
    Filed: August 22, 2019
    Publication date: February 25, 2021
    Inventors: Chin-Chuan CHANG, Szu-Wei LU