Patents by Inventor Wei Lu

Wei Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10916450
    Abstract: A method includes forming a release film over a carrier, forming a metal post on the release film, encapsulating the metal post in an encapsulating material, performing a planarization on the encapsulating material to expose the metal post, forming a redistribution structure over the encapsulating material and the metal post, decomposing a first portion of the release film to separate a second portion of the release film from the carrier, and forming an opening in the release film to expose the metal post.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: February 9, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Szu-Wei Lu, Ying-Ching Shih, Jing-Cheng Lin
  • Publication number: 20210035853
    Abstract: A semiconductor structure includes an integrated circuit, a first dielectric layer over the integrated circuit, an etch stop layer over the first dielectric layer, a barrier layer over the etch stop layer, a conductive layer over the barrier layer, and a void region vertically extending through the conductive layer, the barrier layer, and the etch stop layer. The void region has an upper portion, a middle portion below the upper portion, and a lower portion below the middle portion, the middle portion. The middle portion is narrower than the upper portion and the lower portion.
    Type: Application
    Filed: October 7, 2020
    Publication date: February 4, 2021
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tai-I YANG, Wei-Chen CHU, Hsin-Ping CHEN, Chih-Wei LU, Chung-Ju LEE
  • Publication number: 20210028081
    Abstract: An integrated circuit package and a method of forming the same are provided. A method includes stacking a plurality of integrated circuit dies on a wafer to form a die stack. A bonding process is performed on the die stack. The bonding process mechanically and electrically connects adjacent integrated circuit dies of the die stack to each other. A dam structure is formed over the wafer. The dam structure surrounds the die stack. A first encapsulant is formed over the wafer and between the die stack and the dam structure. The first encapsulant fills gaps between the adjacent integrated circuit dies of the die stack. A second encapsulant is formed over the wafer. The second encapsulant surrounds the die stack, the first encapsulant and the dam structure.
    Type: Application
    Filed: October 12, 2020
    Publication date: January 28, 2021
    Inventors: Chen-Hua Yu, Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu
  • Publication number: 20210029756
    Abstract: A signaling processing method and an apparatus relate to the field of communications technologies and include receiving, by an access and mobility management network element, control signaling from a session management network element, where the control signaling includes identification information of a protocol data unit (PDU) session of a terminal, and the PDU session is established based on a non-3rd Generation Partnership Project (3GPP) access network, and determining, by the access and mobility management network element, whether to send a first message to the terminal using a 3GPP access network when the terminal is in an idle mode on the non-3GPP access network, where the first message is triggered by the access and mobility management network element based on the control signaling.
    Type: Application
    Filed: October 9, 2020
    Publication date: January 28, 2021
    Inventors: Wei Lu, Hualin Zhu
  • Patent number: 10903547
    Abstract: An electronic package includes an antenna structure and an adjustment structure arranged on a carrier structure. The antenna structure includes an antenna body and a feed line that are disposed on different layers and a conductive pillar that interconnects the layers to electrically connect the antenna body and the feed line. The adjustment structure extends from the feed line to improve the bandwidth of the antenna body.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: January 26, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Ying-Wei Lu, Bo-Siang Fang, Kuan-Ta Chen
  • Publication number: 20210020633
    Abstract: In a method of manufacturing a semiconductor device, first and second gate structures are formed. The first (second) gate structure includes a first (second) gate electrode layer and first (second) sidewall spacers disposed on both side faces of the first (second) gate electrode layer. The first and second gate electrode layers are recessed and the first and second sidewall spacers are recessed, thereby forming a first space and a second space over the recessed first and second gate electrode layers and first and second sidewall spacers, respectively. First and second protective layers are formed in the first and second spaces, respectively. First and second etch-stop layers are formed on the first and second protective layers, respectively. A first depth of the first space above the first sidewall spacers is different from a second depth of the first space above the first gate electrode layer.
    Type: Application
    Filed: October 5, 2020
    Publication date: January 21, 2021
    Inventors: Hsiang-Ku SHEN, Chih Wei LU, Hui-Chi CHEN, Jeng-Ya David YEH
  • Publication number: 20210020534
    Abstract: A method of forming a semiconductor device includes attaching a first semiconductor device to a first surface of a substrate; forming a sacrificial structure on the first surface of the substrate around the first semiconductor device, the sacrificial structure encircling a first region of the first surface of the substrate; and forming an underfill material in the first region.
    Type: Application
    Filed: October 5, 2020
    Publication date: January 21, 2021
    Inventors: Chih-Chien Pan, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu
  • Patent number: 10897244
    Abstract: Apparatus and methods are described for voltage dependent delay. An example apparatus includes an oscillator including a delay circuit that is configured to provide an oscillating output signal has a delay based on a delay of the delay circuit. The delay of the delay circuit is based on a voltage it receives. For example, the delay of the delay circuit increases for an increasing received voltage and decreases for a decreasing received voltage. As a result, the oscillating output signal provided by the oscillator is based on the received voltage. For example, a frequency of the oscillating output signal decreases for increasing received voltage and increases for decreasing received voltage. Described in another way, the frequency of the oscillating output signal is relatively low for relatively high received voltage and relatively high for relatively low received voltage.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: January 19, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Zhi Qi Huang, Wei Lu Chu, Dong Pan
  • Publication number: 20210011732
    Abstract: Techniques for computing matrix convolutions in a plurality of multiply and accumulate units including data reuse of adjacent values. The data reuse can include reading a current value of the first matrix in from memory for concurrent use by the plurality of multiply and accumulate units. The data reuse can also include reading a current value of the second matrix in from memory to a serial shift buffer coupled to the plurality of multiply and accumulate units. The data reuse can also include reading a current value of the second matrix in from memory for concurrent use by the plurality of multiply and accumulate units.
    Type: Application
    Filed: December 31, 2019
    Publication date: January 14, 2021
    Inventors: Jacob Botimer, Mohammed Zidan, Chester Liu, Fan-hsuan Meng, Timothy Wesley, Wei Lu, Zhengya Zhang
  • Publication number: 20210011863
    Abstract: A monolithic integrated circuit (IC) including one or more compute circuitry, one or more non-volatile memory circuits, one or more communication channels and one or more communication interface. The one or more communication channels can communicatively couple the one or more compute circuitry, the one or more non-volatile memory circuits and the one or more communication interface together. The one or more communication interfaces can communicatively couple one or more circuits of the monolithic integrated circuit to one or more circuits external to the monolithic integrated circuit.
    Type: Application
    Filed: June 5, 2020
    Publication date: January 14, 2021
    Inventors: Zhengya ZHANG, Mohammed Zidan, Fan-hsuan MENG, Chester LIU, Jacob BOTIMER, Timothy WESLEY, Wei LU
  • Publication number: 20210014686
    Abstract: Example methods for controlling access of a terminal to a network and a network element are described. One example method includes detecting whether a target terminal is exposed to a security threat and sending a message to a storage function network element based on a detection result. The message includes device information and network access indication information, the device information indicates at least one terminal including the target terminal, and the network access indication information indicates that the at least one terminal is allowed or forbidden to access a network. Thus the security function network element outputs an allowed or forbidden indication to the storage function network element, and the storage function network element controls, based on the foregoing indication, access of the terminal to the network.
    Type: Application
    Filed: September 28, 2020
    Publication date: January 14, 2021
    Inventors: Li HU, Yizhuang WU, Wei LU, Jing CHEN, Yong WANG
  • Publication number: 20210013583
    Abstract: An electronic package is provided. A functioning member having a concave portion and a second antenna portion is disposed on a carrier having a first antenna portion. The concave portion and the carrier form a functioning space. The first antenna portion and the second antenna portion are disposed in a projection space of the functioning space. The first antenna portion induces the second antenna portion.
    Type: Application
    Filed: August 29, 2019
    Publication date: January 14, 2021
    Inventors: Ying-Wei Lu, Bo-Siang Fang, Kuan-Ta Chen, Chia-Chu Lai
  • Patent number: 10889567
    Abstract: The invention relates to inhibitors of mutant isocitrate dehydrogenase (mt-IDH) proteins with neomorphic activity useful in the treatment of cell-proliferation disorders and cancers, having the Formula: where A, U, W1, W2, W3, R1-R6, and R9 are described herein.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: January 12, 2021
    Assignee: FORMA Therapeutics, Inc.
    Inventors: Jian Lin, Anna Ericsson, Ann-Marie Campbell, Gary Gustafson, Zhongguo Wang, R. Bruce Diebold, Susan Ashwell, David R. Lancia, Jr., Justin Andrew Caravella, Wei Lu
  • Publication number: 20210007172
    Abstract: Embodiments of this application disclose a capability exposure method. The method may include obtaining, by an access network device, a request message from an application server, where the request message includes at least one of first time information or second time information, where the first time information is used to set a time for which the terminal device is in a first state of a connected mode and the second time information is used to set a time for which the terminal device is in a second state of the connected mode. The access network device can then set the connected mode of the terminal device based on the first time information or the second time information.
    Type: Application
    Filed: September 23, 2020
    Publication date: January 7, 2021
    Inventors: Wei LU, Huan LI, Weisheng JIN
  • Patent number: 10883320
    Abstract: A ground wellhole dedicated protective pipe, disposed inside a ground wellhole for gas extraction of a mining-induced area, includes a casing, and a chain inside the casing and slidable relative to the casing. The chain includes a chain formed by a plurality of chain drums through serial connection, and a detachable connecting piece connecting between chains. A plurality of air holes is opened in the chain drum along an axial direction of the chain drum.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: January 5, 2021
    Assignee: SHANDONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Wei Lu, Qianting Hu, Guansheng Qi, Weimin Cheng, Jinliang Li, Dong Wang, Zhen Liu
  • Patent number: 10885998
    Abstract: A circuit may include a voltage line and latch circuitry. The latch circuitry may be characterized by a switching voltage threshold and may be coupled to the voltage line. The latch circuitry may generate an output used to determine a state of a fuse. The circuit may also include generation circuitry coupled to the latch circuitry via the voltage line, wherein the generation circuitry is configured to pre-charge the voltage line to a first voltage between a system logical low voltage and the switching voltage threshold.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: January 5, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Wei Lu Chu, Dong Pan
  • Publication number: 20200409516
    Abstract: A method, a device and a mobile terminal for data transmission are provided. The transmission method is applied in the mobile terminal, when a user wants to share data, target data can be determined in a present application by the mobile terminal, then the mobile terminal is moved to obtain a moving direction and a moving displacement when the mobile terminal moves; an application currently corresponding to the screen of the mobile terminal is determined according to the moving direction, the moving displacement and an initial position of each application; when a predetermined condition is satisfied, an application corresponding to the screen of the mobile terminal is determined to be a target application, and the determined target data are transmitted to the target application; it only needs to move the mobile terminal to determine the target application when a predetermined condition is met for transmitting data to the target application.
    Type: Application
    Filed: September 15, 2020
    Publication date: December 31, 2020
    Inventors: Chi FANG, Wei LU, Yi LI, Yumeng LI
  • Publication number: 20200411399
    Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a circuit carrier, a dielectric layer, a conductive terminal, a semiconductor die, and an insulating encapsulation. The circuit carrier includes a first surface and a second surface opposite to each other, a sidewall connected to the first and second surfaces, and an edge between the first surface and the sidewall. The dielectric layer is disposed on the first surface of the circuit carrier and extends to at least cover the edge of the circuit carrier. The conductive terminal is disposed on and partially embedded in the dielectric layer to be connected to the circuit carrier. The semiconductor die encapsulated by the insulating encapsulation is disposed on the second surface of the circuit carrier and electrically coupled to the conductive terminal through the circuit carrier.
    Type: Application
    Filed: June 27, 2019
    Publication date: December 31, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih
  • Publication number: 20200409479
    Abstract: The disclosure provides a method, device and equipment for launching an application. The method includes: a mobile terminal presetting one or more initial positions for one or more applications, wherein the one or more initial positions of the one or more applications are located outside the mobile terminal; then determining a target application from the one or more applications according to a current position of the mobile terminal; and then when a moving operation of a user on the mobile terminal is detected, shortening a distance between the mobile terminal and the target application according to the moving operation, then determining a first distance between the mobile terminal and the target application, and furthermore, launching the target application when the first distance is less than a preset threshold.
    Type: Application
    Filed: September 11, 2020
    Publication date: December 31, 2020
    Inventors: Chi FANG, Wei LU, Huayun MIAO
  • Patent number: 10879455
    Abstract: Methods of fabricating MRAM devices are provided. The method includes forming an etch stop layer over a substrate, and depositing a bottom electrode layer on the etch stop layer. The method also includes patterning the bottom electrode layer to form a bottom electrode. The method further includes depositing a magnetic tunnel junction (MTJ) layer on the bottom electrode, and depositing a top electrode layer on the MTJ layer. In addition, the method includes patterning the top electrode layer to form a top electrode, and patterning the MTJ layer to form an MTJ structure.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: December 29, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsi-Wen Tien, Wei-Hao Liao, Pin-Ren Dai, Chih-Wei Lu, Chung-Ju Lee