Abstract: A method includes forming a set of through-vias in a substrate, the set of through-vias partially penetrating a thickness of the substrate. First connectors are formed over the set of through-vias on a first side of the substrate. The substrate is singulated to form dies. The first side of the dies are attached to a carrier. The dies are thinned from the second side to expose the set of through-vias. Second connectors are formed over the set of through-vias on the second side of the dies. A device die is bonded to the second connectors. The dies and device dies are singulated into multiple packages. Corresponding structures result from these methods.

Abstract: Patients diagnosed with a cancer harboring an IDH-1 mutation can be treated by the administration of a therapeutically effective amount of a pharmaceutical composition comprising Compound 1, a selective inhibitor of 2-HG production from mIDH-1 enzymes including the R132 mutations R132C, R132H, R132L, R132G, and R132S.

Abstract: Optical devices and methods of manufacture are presented in which a multi-tier connector is utilized to transmit and receive optical signals to and from an optical device. In embodiments a multi-tier connection unit receives optical signals from outside of an optical device, wherein the optical signals are originally in multiple levels. The multi-tier connection unit then routes the optical signals into a single level of optical components.

Abstract: A device structure includes: an interposer including metal wiring structures and optical waveguides that are embedded in interlayer dielectric layers, wherein the interposer includes a stepped outer sidewall including an outermost vertical surface segment, a laterally-recessed sidewall segment that is laterally recessed relative to the outermost vertical surface segment, and a connecting horizontal surface segment that connects the outermost vertical surface segment and the laterally-recessed vertical sidewall segment; and a fiber access unit having a first end that is optically coupled to a subset of the optical waveguides through at least one optical glue portion that is interposed between the fiber access unit and the laterally-recessed sidewall segment of the stepped outer sidewall.

Abstract: The present disclosure discloses a method and system for recognizing human action in an apron based on thermal infrared vision, the method comprises: acquiring a plurality of video sequences from an infrared monitoring video; labeling a set target in each image frame in each video sequence with a target box to obtain a target tracking result; intercepting, for each image frame in the video sequence, a target-box enlarged area according to the labeled target box; adding, for each image frame in the video sequence, the position information of the image labeled with target box to the target-box enlarged area to obtain a three-channel sub-image; training an action recognition model by using three-channel sub-image sequences corresponding to a plurality of video sequences as a training set, to obtain a trained action recognition model; obtaining a to-be-recognized video sequence from another infrared monitoring video, and obtaining a three-channel sub-image sequence corresponding to the to-be-recognized video sequ

Abstract: A memory processing unit (MPU) can include a first memory, a second memory, a plurality of processing regions and control logic. The first memory can include a plurality of regions. The plurality of processing regions can be interleaved between the plurality of regions of the first memory. The processing regions can include a plurality of compute cores. The second memory can be coupled to the plurality of processing regions. The control logic can configure data flow between compute cores of one or more of the processing regions and corresponding adjacent regions of the first memory. The control logic can also configure data flow between the second memory and the compute cores of one or more of the processing regions. The control logic can also configure data flow between compute cores within one or more respective ones of the processing regions.

Abstract: A multimedia cloud service method, a communication cloud system and a computer readable storage medium are disclosed. The method may include, receiving, by the signaling cloud system, a media service request; controlling, according to the media service request, by the signaling cloud system, the media control entity to process the media service rule; and establishing, according to the media service rule, by the media control entity, a media data interaction path between the terminal device and the media exchange entity.

Abstract: In one embodiment, a method of forming metal interconnects uses a direct metal etch approach to form and fill the metal gap. The method may include directly etching a metal layer to form metal patterns. The metal patterns may be spaced apart from one another by recesses. A dielectric spacer may be formed extending along the sidewalls of each of the recesses. The recesses may be filled with a conductive material to form a second set of metal patterns. By directly etching the metal film, the technique allows for reduced line width roughness. The disclosed structure may have the advantages of increased reliability, better RC performance and reduced parasitic capacitance.

Abstract: An authentication method, applied to a user equipment, includes: determining, from one or more first entities, a target entity with which communication is requested; and deriving an application key KAF based on a fully qualified domain name (FQDN) of the target entity, wherein a first proxy entity provides an authentication proxy function for the target entity.

Abstract: In an embodiment, a device includes: a substrate having a first side and a second side opposite the first side; an interconnect structure adjacent the first side of the substrate; and an integrated circuit device attached to the interconnect structure; a through via extending from the first side of the substrate to the second side of the substrate, the through via being electrically connected to the integrated circuit device; an under bump metallurgy (UBM) adjacent the second side of the substrate and contacting the through via; a conductive bump on the UBM, the conductive bump and the UBM being a continuous conductive material, the conductive bump laterally offset from the through via; and an underfill surrounding the UBM and the conductive bump.

Abstract: Embodiments of the present disclosure relate to a method, an electronic device, and a computer program product for processing workloads. The method includes determining a priority threshold for a task queue based on queue data of the task queue. The method further includes acquiring a priority of a workload at the queue head of the task queue. The method further includes processing the workload by using a processor in response to the priority being greater than the priority threshold. In addition, the method further includes processing the workload without using the processor in response to the priority being less than or equal to the priority threshold. Through the solution in the embodiments of the present disclosure, the priority threshold can be dynamically adjusted to prioritize high-priority loads by utilizing the processor when processor resources are insufficient, thereby ensuring that the high-priority workloads are prioritized for processing.

Abstract: A semiconductor package includes a first semiconductor die, an adhesive layer, a second semiconductor die, a plurality of conductive pillars and an encapsulant. The adhesive layer is adhered to the first semiconductor die. The second semiconductor die is stacked over the first semiconductor die. The conductive pillars surround the first semiconductor die. The encapsulant encapsulates the first semiconductor die and the conductive pillars, wherein a top surface of the encapsulant is higher than top surfaces of the conductive pillars.

Abstract: A semiconductor package includes semiconductor bridge, first and second multilayered structures, first encapsulant, and a pair of semiconductor dies. Semiconductor dies of the pair include semiconductor substrate and conductive pads disposed at front surface of semiconductor substrate. Semiconductor bridge electrically interconnects the pair of semiconductor dies. First multilayered structure is disposed on rear surface of one semiconductor die. Second multilayered structure is disposed on rear surface of the other semiconductor die. First encapsulant laterally wraps first multilayered structure, second multilayered structure and the pair of semiconductor dies. Each one of first multilayered structure and second multilayered structure includes a top metal layer, a bottom metal layer, and an intermetallic layer. Each one of first multilayered structure and second multilayered structure has surface coplanar with surface of first encapsulant.

Abstract: A matrix multiplication engine can include a plurality of processing elements configured to compute a matrix dot product as a summation of a sequence of vector-vector outer-products.

Abstract: An amplifier may include multiple transistors with two transistors having their gates tied together via a common connection. The amplifier may utilize a local common mode feedback resistor as part of the amplifier. The local common mode feedback resistor may be coupled between the common connection and respective terminals of two transistors of multiple transistors. The local common mode feedback resistor may include a group of resistors coupled in series. The local common mode feedback resistor may also include a metal oxide semiconductor (MOS) resistor coupled in parallel with one or more of the first group of resistors. In the local common mode feedback, the first MOS resistor provides different levels of resistance to different process corners to reduce overshoot when the amplifier is enabled.

Abstract: A package includes an optical engine attached to a package substrate, wherein the optical engine includes a first waveguide; and a waveguide structure attached to the package substrate adjacent the optical engine, wherein the waveguide structure includes a second waveguide within a transparent block, wherein a first end of the second waveguide is optically coupled to the first waveguide, wherein the waveguide structure is configured to be connected to an optical fiber component such that a second end of the second waveguide is optically coupled to an optical fiber of the optical fiber component.

Abstract: A display panel and a display device are disclosed. The display panel includes an array substrate, an electrode layer disposed on the array substrate, a light-emitting layer disposed on the electrode layer, and a cathode layer disposed on the light-emitting layer. The electrode layer includes an anode and a contact electrode disposed apart from each other on the array substrate. The contact electrode has a pattern, the contact electrode contacts the cathode layer through the light-emitting layer.

Abstract: A method for waking up a smart device includes receiving sound information; determining whether the sound information includes a multi-frequency tone; and when the sound information includes the multi-frequency tone, waking up a preset function of the smart device based on the multi-frequency tone. A device for waking up a smart device as well as a smart device incorporating the device includes processing elements for performing the method. A non-transitory computer-readable storage medium stores computer instructions to cause processing elements to perform the method for waking up a smart device.

Abstract: A package structure and methods of forming a package structure are provided. The package structure includes a first die, a second die, a wall structure and an encapsulant. The second die is electrically bonded to the first die. The wall structure is located aside the second die and on the first die. The wall structure is in contact with the first die and a hole is defined within the wall structure for accommodating an optical element. The encapsulant laterally encapsulates the second die and the wall structure.

Abstract: Implementations can receive user input during a dialog session between a user and an automated assistant at a client device of the user and via an automated assistant platform, and in response to determining that the user input requires a user interaction with a non-assistant platform: store a state of the dialog session between the user and the automated assistant, transmit a request to initiate the user interaction to the non-assistant platform that causes an additional client device of the user to render a prompt for completing the user interaction, and receive a token associated with the user interaction from the non-assistant platform. In response to receiving the token associated with the user interaction, implementations can cause the dialog session between the user and the automated assistant to be resumed based on the stored state of the dialog session and based on the token associated with the user interaction.