Patents by Inventor Wei Shi

Wei Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12062898
    Abstract: A method for manufacturing a busbar (1), in particular a laminated busbar (1), configured for mounting an electronic component, in particular a passive electronic component such as a capacitor, on the busbar (1), comprising: providing a first conductive layer (11) made from aluminum, providing a first connector element (15) for connecting the first conductive layer (11) and the electronic component, wherein the first connector element (15) is at least partially covered with nickel and/or tin, and creating an bond between the first conductive layer (11) and the first connector element (15) by laser welding.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: August 13, 2024
    Assignee: ROGERS BV
    Inventors: Wei Shi, Liang Tang
  • Patent number: 12055633
    Abstract: In some implementations, a housing for an electro-optical device comprises a molded dielectric structural component, an electromagnetic interference (EMI) shield, and a plurality of conductive traces. The molded dielectric structural component may be configured to separate the EMI shield and the plurality of conductive traces.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: August 6, 2024
    Assignee: Lumentum Operations LLC
    Inventors: Wei Shi, Huanlin Zhu, Lijun Zhu, Raman Srinivasan, Ed Murphy
  • Publication number: 20240238901
    Abstract: A method for forming a busbar (1) having a contact element (20) comprising: —providing a first conductive section (11) made from aluminum, —providing a second conductive section (12) made from aluminum, wherein the second conductive section (12) is connected to the contact element (20), the contact element (20) being made from a material different from aluminum, preferably from copper, and wherein the second conductive section (12) is at least partially covered with nickel and/or tin and—creating a laser welding bond, in particular a laser welding scam (10), between the first conductive section (11) and the second conductive section (12), by laser welding and—creating a bond between the second conductive section and the contact element, preferably by soldering.
    Type: Application
    Filed: May 9, 2022
    Publication date: July 18, 2024
    Inventors: Yuqiang Zhang, Jianning Yang, Wei Shi, Liang Tang
  • Patent number: 12038330
    Abstract: There is described a polarimeter generally having a substrate; a polarization splitter on the substrate polarization splitting an incoming light beam into light beams; an interferometry circuit on the substrate forming polarization components from the light beams, and output waveguides outputting the polarization components.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: July 16, 2024
    Assignee: UNIVERSITÉ LAVAL
    Inventors: Zhongjin Lin, Wei Shi
  • Patent number: 12037224
    Abstract: A crane extension and installation device includes an extension device, a winch, a pulley and a cable. A main arm includes a vertical slide rail, the main arm is inclined relative to vertical, and three second pulleys at different heights of the slide rail are installed in the vertical direction of the slide rail, and the second pulley can slide vertically along the slide rail and can be fixed at a certain position of the slide rail. The extension device includes a number of cantilever beams connected end to end. The front end of the extension device is a cantilever beam, and a fixed pulley is installed on the lower peripheral surface of the extension device. The end face of the cantilever beam is equipped with a vertical lower arm through a joint, and the bottom end of the lower arm has a first pulley fixed by the joint.
    Type: Grant
    Filed: May 30, 2020
    Date of Patent: July 16, 2024
    Assignee: DALIAN UNIVERSITY OF TECHNOLOGY
    Inventors: Wei Shi, Zhengru Ren, Zhaobo Song, Zhiyu Jiang, Lixian Zhang, Ke Ma
  • Patent number: 12040592
    Abstract: A substrate may include a thermally conductive metal core having a top side and a bottom side, a first dielectric coating on the top side of the metal core, a second dielectric coating on the bottom side of the metal core, a first metal circuit layer formed above the first dielectric coating, and a second metal circuit layer formed under the second dielectric coating. In some implementations, the first dielectric coating and the second dielectric coating have thicknesses below sixty micrometers and respective thermal resistances under fifteen degrees Celsius per watt. In some implementations, one or more electrical currents flowing vertically across a dielectric coating have a low parasitic inductance based on the thickness of the dielectric coating, and the metal core may dissipate heat flowing across the dielectric coating and into the metal core.
    Type: Grant
    Filed: August 24, 2021
    Date of Patent: July 16, 2024
    Assignee: Lumentum Operations LLC
    Inventors: Wei Shi, Hao Huang, Siu Kwan Cheung, Huanlin Zhu, Lijun Zhu
  • Publication number: 20240223143
    Abstract: An offset voltage compensation circuit and an isolation amplifier device including the same are provided. The offset voltage compensation circuit includes a first amplifier, a second amplifier, a first current source, a second current source, a first resistor and a second resistor. The first amplifier has a first input connected to a first differential input node and a first output connected to a first differential output node. The second amplifier has a first input connected to a second differential input node and a second output connected to a second differential output node. The first current source is connected to the first amplifier for providing a first current. The second current source is connected to the second amplifier for providing a second current. The first current source is controlled according to the second current and a difference between a first initial output voltage and a second initial output voltage.
    Type: Application
    Filed: December 3, 2023
    Publication date: July 4, 2024
    Inventors: WEI SHI, DARMAYUDA IMADE
  • Publication number: 20240197900
    Abstract: The present application relates to a disaccharide linker, a disaccharide-small molecule drug conjugate and a sugar chain fixed-point antibody-drug conjugate, a preparation method and the use thereof. The structure of the disaccharide linker is as shown in the following formula I. The present invention provides a new-type fixed-point and quantitative antibody-drug conjugate form, and the stability and cytotoxicity of the antibody-drug conjugate are improved.
    Type: Application
    Filed: February 22, 2022
    Publication date: June 20, 2024
    Inventors: Wei HUANG, Feng TANG, Wei SHI, Shang JIAO, Siqi WANG
  • Patent number: 12011693
    Abstract: A zeolite membrane and a preparation method thereof are provided. The method includes: adding an organic binder solution dropwise to zeolite, and thoroughly grinding and stirring; blade-coating a resulting mixture on a substrate at a given thickness; and drying to obtain the zeolite membrane. The preparation of a zeolite membrane does not require a complicated hydrothermal crystal growth process, and the membrane can be prepared directly from natural zeolite or artificial zeolite. A prepared zeolite membrane has the characteristics of simple preparation process, low cost, prominent water permeability, high contaminant rejection rate and high zeolite load. The zeolite membrane, when used for the rejection of contaminants in water, can not only remove macromolecular contaminants in water, but also efficiently remove ammonia nitrogen by way of ion exchange, which is suitable for advanced treatment of wastewater.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: June 18, 2024
    Assignee: TONGJI UNIVERSITY
    Inventors: Zhiwei Wang, Wei Shi, Huimin Zhou, Xueye Wang
  • Publication number: 20240195151
    Abstract: In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs. The emitter assembly may include a plurality of conductive pillars electrically connected to the VCSEL chip. The emitter assembly may include a dummy pillar, electrically isolated from the VCSEL chip, mating with a slot. The VCSEL chip may include one of the dummy pillar or the slot.
    Type: Application
    Filed: March 31, 2023
    Publication date: June 13, 2024
    Inventors: Wei SHI, Joseph LEIGH, Suhit Ranjan DAS, Huanlin ZHU, Raman SRINIVASAN, Gianluca BACCHIN, Yuefa LI, Jacob U. LOPEZ RUVALCABA, Lijun ZHU, Qianhuan YU
  • Publication number: 20240195145
    Abstract: In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs respectively associated with a plurality of first electrical contacts. A first spacing of the plurality of first electrical contacts may define a first pitch. The emitter assembly may include a redistribution layer, disposed on the VCSEL chip, to increase the first pitch of the plurality of first electrical contacts. The emitter assembly may include a carrier having a plurality of second electrical contacts. A second spacing of the plurality of second electrical contacts may define a second pitch greater than the first pitch. The emitter assembly may include a plurality of conductive pillars that electrically connect the plurality of first electrical contacts and the plurality of second electrical contacts via the redistribution layer. The plurality of conductive pillars may be arranged according to the second spacing.
    Type: Application
    Filed: March 31, 2023
    Publication date: June 13, 2024
    Inventors: Wei SHI, Joseph LEIGH, Eric R. HEGBLOM, Suhit Ranjan DAS, Huanlin ZHU, Raman SRINIVASAN, Gianluca BACCHIN, Yuefa LI, Jacob U. LOPEZ RUVALCABA, Lijun ZHU, Qianhuan YU
  • Publication number: 20240195152
    Abstract: In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs. The emitter assembly may include a plurality of conductive pillars electrically connected to the VCSEL chip, and a conductive pillar, of the plurality of conductive pillars, may have a solder cap at an end of the conductive pillar. The emitter assembly may include a pin extending into the solder cap.
    Type: Application
    Filed: March 31, 2023
    Publication date: June 13, 2024
    Inventors: Wei SHI, Joseph LEIGH, Suhit Ranjan DAS, Huanlin ZHU, Raman SRINIVASAN, Gianluca BACCHIN, Yuefa LI, Jacob U. LOPEZ RUVALCABA, Lijun ZHU, Qianhuan YU
  • Publication number: 20240195153
    Abstract: In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs in a bottom-emitting configuration, and multiple VCSELs, of the plurality of VCSELs, may be grouped in a cluster. The emitter assembly may include a carrier, and the VCSEL chip may be in a flip chip configuration with the carrier. The emitter assembly may include a conductive pillar electrically connected to the multiple VCSELs grouped in the cluster.
    Type: Application
    Filed: March 31, 2023
    Publication date: June 13, 2024
    Inventors: Wei SHI, Joseph LEIGH, Suhit Ranjan DAS, Huanlin ZHU, Raman SRINIVASAN, Gianluca BACCHIN, Yuefa LI, Jacob U. LOPEZ RUVALCABA, Lijun ZHU, Qianhuan YU
  • Patent number: 12010416
    Abstract: An embedded ceramic substrate package includes a ceramic substrate embedded in one or more layers. The one or more layers include at least a bulk molding compound (BMC) and a redistribution layer (RDL). At least a portion of the one or more layers includes electrical signal trace routing. The embedded ceramic substrate package is attached to an image sensor that is configured to capture light projected onto a surface of the image sensor.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: June 11, 2024
    Assignee: Apple Inc.
    Inventors: Wei Shi, Adar Magen
  • Publication number: 20240183259
    Abstract: The present invention relates generally to processes for adding a chemical composition to a produced water mixture upstream of a pad related to a well to be fracked. The added chemical composition comprises a drag reducing agent, or a biocide, or a scale inhibitor, or any combination thereof. The produced water mixture comprising the added chemical composition may then be transferred in a pipeline to the well to be fracked. This offers a number of advantages that may include, for example, reducing the footprint at the pad, improved efficacy of biocide, reduced time to transfer produced water, and/or reduced pumping time during the fracking.
    Type: Application
    Filed: February 9, 2024
    Publication date: June 6, 2024
    Inventors: Dawit Yenesew Dagnaw, Yifan Li, Brian Paul Price, Nabijan Nizamidin, Wei Shi, Omar Visairo, Kristen Anne Belcourt, Leonardo F. Chaves Leal, Aleisha Nichole Guiler, Amos Sunghyun Kim, Neil Robert Steil Dilorenzo
  • Publication number: 20240170374
    Abstract: A semiconductor package includes a lead frame that includes a die pad and a first lead extending away from the die pad, a semiconductor die mounted on the die pad, a load path connection that electrically connects a first load terminal of the semiconductor die with the first lead, and a magnetic sensor arrangement mounted directly on a region of the lead frame which forms part of the load path connection, wherein the magnetic sensor arrangement comprises a magnetic current sensor that is configured to measure a current flowing through the load path connection and an electrical isolation layer that electrically isolates the magnetic current sensor from the lead frame.
    Type: Application
    Filed: November 22, 2022
    Publication date: May 23, 2024
    Inventors: Shu Hui Goh, Gianluca Camuso, Thai Kee Gan, Wolfgang Raberg, Wolfgang Scholz, Elvis Wei Shi, Joo Teng Teoh, Hui Wen Goh, Chiao Eing Lim
  • Publication number: 20240154389
    Abstract: A multi-electrode device is provided. The device improves electrical-to-optical (E-O) frequency response in vertical cavity surface emitting laser (VCSEL) array. An electrode is used in a near quasi-single-mode (QSM) VCSEL array having zinc diffusion apertures for enhancing high-speed data transmission. By forming a distance less than 20 microns between the centers of every two neighboring apertures in the VCSEL array being compact 2×2-coupled, high-speed data transmission is significantly enhanced. The present invention exhibits good electro-optical frequency response suppression and good 3-decibel E-O bandwidth. Concerning the maximum QSM optical output power and the Gaussian-like optical far-field with a narrow diverging angle, significant improvement in dynamic performance do not sacrifice static performance.
    Type: Application
    Filed: January 31, 2023
    Publication date: May 9, 2024
    Inventor: Jin-Wei Shi
  • Publication number: 20240150438
    Abstract: Antibodies that bind SARS-CoV spike protein, SARS-CoV-2 spike protein, and methods of using same for treating or preventing conditions associated with SARS or COVID-19 and for detecting SARS-CoV or SARS-CoV-2.
    Type: Application
    Filed: March 31, 2023
    Publication date: May 9, 2024
    Applicants: AbCellera Biologics Inc., The United States of America, as represented by the Secretary, Department of Health and Human Svcs.
    Inventors: Kathryn WESTENDORF, Stefanie ZENTELIS, Krithika MUTHURAMAN, Kevin JEPSON, Ester FALCONER, John MASCOLA, Barney GRAHAM, Kizzmekia CORBETT, Julie LEDGERWOOD, Lingshu WANG, Olubukola ABIONA, Wei SHI, Wing-pui KONG, Yi ZHANG, Bryan Edward JONES, Denisa FOSTER, Julian DAVIES, Qing CHAI, Christopher Carl FRYE, Ganapathy GOPALRATHNAM, Jörg HENDLE, John Michael SAUDER, Jeffrey Streetman BOYLES, Anna PUSTILNIK
  • Publication number: 20240146014
    Abstract: The present disclosure discloses a hundred-kilowatts-level monolithic fiber laser based on auxiliary lasers and hybrid cladding pumping scheme. Multi-wavelength auxiliary lasers and a signal laser are simultaneously coupled into a core of a gain fiber, and the gain fiber provides gains for the auxiliary lasers and the signal laser under multi-wavelength cladding pumping. The multi-wavelength auxiliary lasers and the signal laser are sequentially amplified under the action of gain competition, and the amplification of signal laser is suppressed at a front segment of the gain fiber, while the signal laser is effectively amplified at a rear segment of the gain fiber after the multi-wavelength auxiliary lasers are reabsorbed; quantum defects generated are reduced, and uniformly distributed thermal loads will be achieved, and the bearing capacity of laser power is improved, thereby further achieving inhibition on the transverse mode instability effect.
    Type: Application
    Filed: May 18, 2023
    Publication date: May 2, 2024
    Inventors: Wei SHI, Chaodu SHI, Shijie FU, Xun DENG, Quan SHENG, Jianquan YAO
  • Publication number: 20240125592
    Abstract: The present disclosure relates to a beam measuring device, a sample processor including the beam measuring device, and a method of measuring a beam using the beam measuring device. The beam measuring device includes a detection unit and a light impediment unit. The light impediment unit is located between the detection unit and a light source, and is configured to generate a shadow area on the detection unit by blocking transmission of part of a beam coming from the light source. The detection unit is configured to measure the shadow area, and to determine whether the beam is divergent or inclined with respect to a predetermined optical axis based on the measurement of the shadow area. The beam measuring device may shorten the optical detection channel and ensure the detection accuracy, thereby having a compact structure. In addition, the beam measuring device may measure divergence angle and directionality, respectively.
    Type: Application
    Filed: July 21, 2023
    Publication date: April 18, 2024
    Applicant: Beckman Coulter Biotechnology (Suzhou) Co., Ltd.
    Inventors: Wei SHI, Ruifeng MIAO, Zhonghui CHEN, Jianhua WANG