Abstract: Provided is an electronic device, including a main body, a first functional module, a linkage mechanism, and a second functional module. The first functional module is slidably provided on the main body between a first position and a second position. The linkage mechanism is provided on the main body and is connected to the first functional module. The second functional module is linked to the linkage mechanism and is provided on the main body in a turnover manner, in which when the first functional module is located at the first position, the second functional module is covered by the first functional module, and when the first functional module moves to the second position and the second functional module is exposed, the second functional module is driven by the linkage mechanism to be turned up.

Abstract: The invention relates to a power tool with an electrically controlled commutating assembly comprising: an electrically controlled commutating assembly and a control unit; the electrically controlled commutating assembly has an electromagnetic unit; the electromagnetic unit is capable of performing a change in displacement due to electromagnetic action; the control unit has a control member, the control member is capable of changing a working direction of a power tool, and displacement of the electromagnetic unit is capable of actuating the control member of the control unit to make the power tool switch the working direction.

Abstract: A cable-driven beater mechanism for a percussion instrument has a base, a transmission shaft pivotally mounted on the base, a beater connected to the transmission shaft, a cable transmission assembly, a restoring spring and a cable. An elongated guiding slot is formed in the standing plate. The cable transmission assembly is pivotally mounted on the base and protrudes into the guiding slot. The cable and the transmission shaft are connected via the cable transmission assembly. Pulling force from a player is transferred via the cable to pivot the transmission shaft and the beater. The restoring spring returns the transmission shaft and the beater to an original position. The cable moves along a straight line during operation to reduce rubbing and repeated bending of the cable, which prolongs service life of the cable, reduces noise during operation, and allows the beater to respond more swiftly to the pulling force.

Abstract: The present disclosure relates to an apparatus that includes a bottom electrode and a dielectric structure. The dielectric structure includes a first dielectric layer on the bottom electrode and the first dielectric layer has a first thickness. The apparatus also includes a blocking layer on the first dielectric layer and a second dielectric layer on the blocking layer. The second dielectric layer has a second thickness that is less than the first thickness. The apparatus further includes a top electrode over the dielectric structure.

Abstract: A semiconductor package includes dies, a redistribution structure, a conductive structure and connectors. The conductive plate is electrically connected to contact pads of at least two dies and is disposed on redistribution structure. The conductive structure includes a conductive plate and a solder cover, and the conductive structure extend over the at least two dies. The connectors are disposed on the redistribution structure, and at least one connector includes a conductive pillar. The conductive plate is at same level height as conductive pillar. The vertical projection of the conductive plate falls on spans of the at least two dies.

Abstract: A structure includes an encapsulating material, and a coil including a through-conductor. The through-conductor is in the encapsulating material, with a top surface of the through-conductor coplanar with a top surface of the encapsulating material, and a bottom surface of the through-conductor coplanar with a bottom surface of the encapsulating material. A metal plate is underlying the encapsulating material. A slot is in the metal plate and filled with a dielectric material. The slot has a portion overlapped by the coil.

Abstract: The present invention relates to an electric motor and an electric tool equipped with the electric motor. The electric motor includes a rotor, a stator, a coil module wound around the stator, a Hall unit and a wiring circuit unit. The Hall unit includes a Hall circuit board disposed around a rotating shaft of the rotor, and a Hall module for sensing rotation of the rotor. The wiring circuit unit is independent of the Hall circuit board and includes a three-phase power source interface. The wiring circuit unit electrically connects coils of the coil module to the power source interfaces respectively by groups. By separately disposing the Hall unit and the wiring circuit unit independently, a volume of the Hall circuit board can be reduced, and an area blocking an airflow path of a heat dissipation unit can be reduced, so heat dissipation effect of the electric motor and the electric tool can be improved.

Abstract: A semiconductor structure including at least one integrated circuit component is provided. The at least one integrated circuit component includes a first semiconductor substrate and a second semiconductor substrate electrically coupled to the first semiconductor substrate, wherein the first semiconductor substrate and the second semiconductor substrate are bonded through a first hybrid bonding interface, and at least one of the first semiconductor substrate or the second semiconductor substrate includes at least one first embedded capacitor.

Abstract: A semiconductor device includes a first die embedded in a molding material, where contact pads of the first die are proximate a first side of the molding material. The semiconductor device further includes a redistribution structure over the first side of the molding material, a first metal coating along sidewalls of the first die and between the first die and the molding material, and a second metal coating along sidewalls of the molding material and on a second side of the molding material opposing the first side.

Abstract: A semiconductor structure includes an etching stop layer over an inter-layer dielectric (ILD) layer; a low-k dielectric layer over the etching stop layer; and a tapered conductor extending through the low-k dielectric layer and the etching stop layer and partially through the ILD layer; wherein the tapered conductor includes a recess disposed within the ILD layer and indented towards the etching stop layer and the low-k dielectric layer, and a protrusion surrounding the recess and protruded from the etching stop layer towards the ILD layer.

Abstract: An electric bicycle having an improved effect of heat dissipation has a body, a driving device, and a battery. The body has a frame, a rear wheel, and a front wheel, wherein the rear wheel and the front wheel are mounted to the frame. The driving device is mounted to the body and has a motor and a shell. The motor is connected with the frame and has a front end near the front wheel and a rear end near the rear wheel. The shell covers the motor and has multiple inlets and multiple outlets disposed therethrough. The multiple inlets are located near the front end of the motor. The multiple outlets are located near the rear end of the motor. The battery is electrically connected to the motor. The front wheel, the battery, the motor, and the rear wheel are serially aligned.

Abstract: A semiconductor structure includes a transceiver, a molding surrounding the transceiver, and a RDL disposed over the transceiver. The RDL includes an antenna and a dielectric layer. The antenna is disposed over and electrically connected to the transceiver. The dielectric layer surrounds the antenna. The antenna includes an elongated portion and a via portion. The elongated portion extends over the molding, and the via portion is electrically connected to the transceiver.

Abstract: A semiconductor chip including a die substrate, a plurality of first bonding structures, a plurality of conductive elements, at least one integrated device, a plurality of conductive posts and a protection layer is provided. The first bonding structures are disposed on the die substrate. The conductive elements are disposed on the die substrate adjacent to the first bonding structures. The integrated device is disposed on the die substrate over the first bonding structures, wherein the integrated device includes a plurality of second bonding structures and a plurality of conductive pillars, and the second bonding structures are hybrid bonded to the first bonding structures. The conductive posts are disposed on the conductive elements and surrounding the integrated device. The protection layer is encapsulating the integrated device and the conductive posts.

Abstract: A brushless motor stator includes a stator core and a stator winding. The stator core has a stator frame, a coil carrier and multiple pole shoes. The coil carrier is mounted on one of the two openings of the stator frame and has a tooth base and multiple teeth. The teeth are formed on a top surface of the tooth base. The pole shoes are formed on the inner annular surface of the stator frame. The stator winding is formed by using a single wire to wind around the tooth base, the multiple teeth and the multiple pole shoes, and passing through three of the multiple slots of the coil carrier to extend beyond the outer annular surface of the stator frame to form three extended segments to correspond to U-phase, V-phase and W-phase output terminals of a motor, thereby reducing the number of spot-welding on a wiring board.

Abstract: A structure includes an encapsulating material, and a coil including a through-conductor. The through-conductor is in the encapsulating material, with a top surface of the through-conductor coplanar with a top surface of the encapsulating material, and a bottom surface of the through-conductor coplanar with a bottom surface of the encapsulating material. A metal plate is underlying the encapsulating material. A slot is in the metal plate and filled with a dielectric material. The slot has a portion overlapped by the coil.

Abstract: A semiconductor structure including at least one integrated circuit component is provided. The at least one integrated circuit component includes a first semiconductor substrate and a second semiconductor substrate electrically coupled to the first semiconductor substrate, wherein the first semiconductor substrate and the second semiconductor substrate are bonded through a first hybrid bonding interface, and at least one of the first semiconductor substrate or the second semiconductor substrate includes at least one first embedded capacitor.

Abstract: Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a fin structure over a semiconductor substrate. The semiconductor device structure also includes a gate stack covering a portion of the fin structure, and the gate stack includes a work function layer and a metal filling over the work function layer. The semiconductor device structure further includes an isolation element over the semiconductor substrate and adjacent to the gate stack. The isolation element is in direct contact with the work function layer and the metal filling.

Abstract: A virtual make-up system and a virtual make-up coloring method are provided. The system includes a first electronic device and a second electronic device. The first electronic device obtains a first image by using an image capturing circuit. The first electronic device analyzes the first image to obtain make-up information including a color, and transmits the makeup information to the second electronic device. The second electronic device displays a second image including a character by a display, and obtains a portion to be colored of the character in the second image. The second electronic device colors the color to the portion to be colored of the character according to the make-up information, and displays the colored portion by the display.

Abstract: A semiconductor chip including a die substrate, a plurality of first bonding structures, a plurality of conductive elements, at least one integrated device, a plurality of conductive posts and a protection layer is provided. The first bonding structures are disposed on the die substrate. The conductive elements are disposed on the die substrate adjacent to the first bonding structures. The integrated device is disposed on the die substrate over the first bonding structures, wherein the integrated device includes a plurality of second bonding structures and a plurality of conductive pillars, and the second bonding structures are hybrid bonded to the first bonding structures. The conductive posts are disposed on the conductive elements and surrounding the integrated device. The protection layer is encapsulating the integrated device and the conductive posts.