Abstract: A collapsible supplemental illumination device for a sighting device, including an illumination unit, a damping motion unit, a locking mechanism, and a position detection device. The damping motion unit is fixedly mounted on a main body of the sighting device. The damping motion unit is connected to the locking mechanism. The position detection device is provided on the locking mechanism. The illumination unit is rotatably connected to the damping motion unit through the locking mechanism. A control method of the collapsible supplemental illumination device is further provided.

Abstract: The present invention provides an Active Tire Auto-Location systems for tire pressure monitor sensors and an operating method. The system includes a host, wheel axle rotation detection devices and tire pressure monitor sensors. By allowing the wireless tire pressure detector to receive and compare the rotation information of a toothed ring from the wheel axle rotation detection device and the tire rotation information from the wireless tire pressure detector, each wireless tire pressure detector can identify which wheel axle rotation detection device that corresponds to it. At the same time, the tire position where each wireless tire pressure detector is situated can also be determined. Compared to prior art, it is still possible for the present invention to determine the tire position where each wireless tire pressure detector is situated, without the need for additional modification to the host, thus significantly reducing the inconvenience in replacing tire pressure monitor sensors.

Abstract: A tire auto-location system for a tire pressure monitor sensor and operating method thereof are provided. The tire auto-location system for a tire pressure monitor sensor includes a host, a plurality of axle rotation detection devices, and a plurality of tire pressure monitor sensors. By allowing the host to receive and compare the corresponding gear ring rotation data transmitted by the plurality of axle rotation detection devices and the corresponding tire rotation data transmitted by the plurality of tire pressure monitor sensors, the location of each tire pressure monitor sensor can be confirmed. At the same time, since the host and the tire pressure monitor sensor have two-way transmission functions, the host can react quickly and promptly command the tire pressure monitor sensor to stop sensing and transmitting after completing the calculation.

Abstract: An electromagnetic wave guidance and beam reshaping structure is favorable to incorporate a radiation source antenna into an energy focusing system. The electromagnetic wave guidance and beam reshaping structure includes a substrate, a plurality of metal patterns and a plurality of hollow structures. The substrate includes a central portion and a peripheral portion that surrounds the central portion. The plurality of metal patterns are disposed on the central portion. The plurality of hollow structures are disposed in the peripheral portion. The metal patterns are axisymmetrically arranged with respect to a central axis of the substrate, and the hollow structures are axisymmetrically arranged with respect to the central axis of the substrate.

Abstract: A correction method for image color range conversion and an image-processing system are provided. In the correction method, when an image is received, an actual color range of the image can be obtained by counting a pixel value of the image. A color range can be a full color range or a limited color range. If the actual color range is inconsistent with the color range recorded in an image packet, the image-processing system performs a color-range correction procedure. A linear mapping method can be incorporated for converting pixels of the image from the limited color range to the full color range. In particular, the color-range correction procedure can be gradually performed in a multi-stage manner, so as to accurately and smoothly convert the color range of the image for a subsequent image-processing procedure.

Abstract: Disclosed is an optical emission assembly including a body, an adapter, two light-emitting assemblies, a multiplexer and a converging lens. The body is provided with a first positioning groove, a second positioning groove, an accommodation groove, and a through hole. The accommodation groove communicates with the first and second positioning grooves and the through hole. A groove bottom of the first positioning groove communicates with a groove bottom of the second positioning groove. The adapter is connected to the body and disposed corresponding to the through hole. When the two light-emitting assemblies are installed in the first and second positioning grooves, each light-emitting chip of each light-emitting assembly emits beams towards the accommodation groove to make the multiplexer disposed at the bottom of the accommodation groove combine the beams into one beam. The converging lens is disposed in the through hole to converge the one beam on the adapter.

Abstract: A package structure including a first semiconductor die, at least one second semiconductor die conductive terminals and an insulating encapsulation is provided. The at least one second semiconductor die is stacked on and electrically connected to the first semiconductor die. The conductive terminals are disposed on and electrically connected to the first semiconductor die. The insulating encapsulation laterally encapsulates the first semiconductor die, the at least one second semiconductor die and the conductive terminals, wherein the conductive terminals protrude from a surface of the insulating encapsulation. Furthermore, a method for forming the above-mentioned is also provided.

Abstract: Disclosed is an optical emission assembly including a heat dissipation base, an adapter, a light-emitting assembly, a multiplexer, a cooling chip, a converging lens, a housing, and a heat-conducting glue. The heat dissipation base includes a first heat dissipation plate and a second heat dissipation plate forming a T-shaped or an L-shaped structure. The light-emitting assembly and the multiplexer are disposed on the second heat dissipation plate. The multiplexer combines light beams emitted by light-emitting chips of the light-emitting assembly into one light beam, and then the one light beam enters the adapter through the converging lens. The cooling chip is disposed on the first heat dissipation plate. The heat dissipation base and the cooling chip are disposed in the housing, and the cooling chip corresponds to a through hole of the housing. The heat-conducting glue is filled in the through hole and between the cooling chip and the housing.

Abstract: A semiconductor device includes a first die extending through a molding compound layer, a first dummy die having a bottom embedded in the molding compound layer, wherein a height of the first die is greater than a height of the first dummy die, and an interconnect structure over the molding compound layer, wherein a first metal feature of the interconnect structure is electrically connected to the first die and a second metal feature of the interconnect structure is over the first dummy die and extends over a sidewall of the first dummy die.

Abstract: A super resolution (SR) image generating device includes a receiving circuit, a first configurable basic block pool circuit, a first shuffle circuit, a second configurable basic block pool circuit, and a second shuffle circuit. The receiving circuit is arranged to receive an input image. The first configurable basic block pool circuit is arranged to configure multiple first basic blocks according to the input image for performing convolution operations, to generate multiple first operation results. The first shuffle circuit is arranged to shuffle the multiple first operation results to generate a first SR output image. The second configurable basic block pool circuit is arranged to configure multiple second basic blocks according to the input image for performing convolution operations, to generate multiple second operation results. The second shuffle circuit is arranged to shuffle the multiple second operation results to generate a second SR output image.

Abstract: A method includes forming isolations extending into a semiconductor substrate, recessing the isolation regions, wherein a semiconductor region between the isolation regions forms a semiconductor fin, forming a first dielectric layer on the isolation regions and the semiconductor fin, forming a second dielectric layer over the first dielectric layer, planarizing the second dielectric layer and the first dielectric layer, and recessing the first dielectric layer. A portion of the second dielectric layer protrudes higher than remaining portions of the first dielectric layer to form a protruding dielectric fin. A portion of the semiconductor fin protrudes higher than the remaining portions of the first dielectric layer to form a protruding semiconductor fin. A portion of the protruding semiconductor fin is recessed to form a recess, from which an epitaxy semiconductor region is grown. The epitaxy semiconductor region expands laterally to contact a sidewall of the protruding dielectric fin.

Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region

Abstract: An imaging optical lens assembly includes nine lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element, an eighth lens element and a ninth lens element. The first lens element has positive refractive power. The eighth lens element with positive refractive power has an image-side surface being convex in a paraxial region thereof. The ninth lens element has an image-side surface being concave in a paraxial region thereof, and the image-side surface of the ninth lens element has at least one convex critical point in an off-axis region thereof.

Abstract: A computing device can include a processor; memory accessible to the processor; a display operatively coupled to the processor; and an external shell assembly that includes an array of electronic components, where the array of electronic components includes transducers.

Abstract: A method of activating multiple secondary cells can include receiving on a primary cell (PCell) at a user equipment (UE) a first medium access (MAC) control element (CE) for activating a first secondary cell (SCell) and a second SCell for the UE in a wireless communication system. The first and second SCells can operate in a same band. No active serving cell operates on the same band for the UE. In response to that the first SCell is a known SCell, the second SCell is an unknown SCell, and both the first and second SCells operate in the same band that is a frequency range 2 (FR2) band, the first and second SCells can be activated in parallel without performing cell search and reference signal received power (RSRP) measurement and reporting over the first and second SCells.

Abstract: A method and a testing apparatus related to wafer testing are provided. In the method, testing raw data is obtained by a testing apparatus operating with a Unix-related system. The testing raw data is a testing result of probe testing on one or more wafers by the testing apparatus. The testing raw data is converted into converted data by the testing apparatus. The converted data is related to the defect information of the wafer. Analyzed data is generated by the testing apparatus according to the converted data. The analyzed data is used for a graphical interface. Therefore, real-time defect analysis during the testing procedure may be provided.

Abstract: An image capturing optical lens system includes four lens elements, which are, in order from an object side to an image side along an optical path, a first lens element, a second lens element, a third lens element and a fourth lens element. The first lens element has an object-side surface being convex in a paraxial region thereof. The third lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The fourth lens element has negative refractive power.

Abstract: A photographing optical lens system includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element and an eighth lens element. The second lens element has positive refractive power. The eighth lens element has an image-side surface being concave in a paraxial region thereof, wherein the image-side surface of the eighth lens element has at least one convex shape in an off-axis region thereof, and both an object-side surface and the image-side surface thereof are aspheric. The photographing optical lens system has a total of eight lens elements. An air gap in a paraxial region is located between every two lens elements of the photographing optical lens system that are adjacent to each other.

Abstract: A controller is configured to control the adaptive notch filter and to execute a search technique (e.g., artificial intelligence (AI) search technique) to converge on filter coefficients and to recursively adjust the filter coefficients of the adaptive notch filter in real time to adaptively adjust one or more filter characteristics (e.g., maximum notch depth or attenuation, bandwidth of notch, or general magnitude versus frequency response of notch).

Abstract: A latch includes at least one first standard cell logic gate and at least one second standard cell logic gate. The first standard cell logic gate includes a first input terminal, a second input terminal, a third input terminal, and a first output terminal. The second standard cell logic gate includes a fourth input terminal, a fifth input terminal, a sixth input terminal, and a second output terminal. The first input terminal and the second input terminal receive a first input signal. The third input terminal receives a first output signal. The first output terminal outputs a second output signal. The fourth input terminal receives the second output signal. The fifth input terminal and the sixth input terminal receive a second input signal. The second output terminal outputs the first output signal.