Patents by Inventor Wei Yu

Wei Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12068808
    Abstract: Embodiments of this application provide a data sending method, an apparatus, a device, and a readable storage medium. A server determines a first transmission point from a coordinated set, and determines a first downlink sending weight of the first transmission point. Then, the server determines a second downlink sending weight of a second transmission point based on the first downlink sending weight, and sends the second downlink sending weight to the second transmission point. When sending a data stream to an electronic device, the second transmission point determines a downlink sending weight corresponding to the data stream from a matrix, weights the data stream, and sends the weighted data stream to the electronic device.
    Type: Grant
    Filed: January 19, 2023
    Date of Patent: August 20, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yunfeng Sun, Qingtian Xue, Wei Yu, Min Wen, Gang Wei, Qunfang Lou
  • Patent number: 12066606
    Abstract: An image lens assembly includes four lens groups: a first lens group, a second lens group, a third lens group and a fourth lens group along an optical path. The four lens groups include nine lens elements: a first lens element with positive refractive power, a second lens element with negative refractive power, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element, an eighth lens element and a ninth lens element along the optical path. At least one lens element of the image lens assembly has at least one inflection point. At least five lens elements of the image lens assembly are made of plastic material. When focusing or zooming, the first lens group and the fourth lens group stay stationary, while the second lens group and the third lens group move along an optical axis.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: August 20, 2024
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Kuan-Ting Yeh, Wei-Yu Chen
  • Patent number: 12066551
    Abstract: A wideband interference mitigation module is coupled to an output of a primary downconverter to process the digital intermediate frequency signal. A selective filtering module is associated with a secondary downconverter that comprises a digital harmonic-resistant translator. The selective filtering module comprises: (a) a low-pass filter that is configured as an anti-aliasing digital filter consistent with a target receive bandwidth to suppress aliasing associated with the analog-to-digital conversion, and (b) narrow band rejection filter to filter the digital baseband signal to reduce or to mitigate electromagnetic interference, where the narrow band rejection filter is configured for adaptive control responsive to detection by the wideband interference mitigation module of certain interference in the received radio frequency signal.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: August 20, 2024
    Assignee: DEERE & COMPANY
    Inventors: Wei Yu, Richard G. Keegan, Mark P. Kaplan, Brian C. Goodrich, David M. Li
  • Patent number: 12068395
    Abstract: A method includes forming a semiconductor fin protruding higher than a top surface of an isolation region. The semiconductor fin overlaps a semiconductor strip, and the semiconductor strip contacts the isolation region. The method further includes forming a gate stack on a sidewall and a top surface of a first portion of the semiconductor fin, and etching the semiconductor fin and the semiconductor strip to form a trench. The trench has an upper portion in the semiconductor fin and a lower portion in the semiconductor strip. A semiconductor region is grown in the lower portion of the trench. Process gases used for growing the semiconductor region are free from both of n-type dopant-containing gases and p-type dopant-containing gases. A source/drain region is grown in the upper portion of the trench, wherein the source/drain region includes a p-type or an n-type dopant.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: August 20, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Meng-Ku Chen, Ji-Yin Tsai, Jeng-Wei Yu, Yi-Fang Pai, Pei-Ren Jeng, Yee-Chia Yeo, Chii-Horng Li
  • Publication number: 20240274302
    Abstract: Disclosed are a system and method of predicting sensitivity of Klebsiella against MeropeneM, which belong to bioinformatics art. The system comprises a computer readable storage medium on which is stored a computer program. An Exp (?k) power value calculation method is implemented when said computer program is executed by a processor. Said Exp(?k) power value calculation method comprises following computing steps: S1: k value is calculated according to formula I: Formula ? I ? - 1.44 + 0. ? × ( ? ? ) - 0.66 × ( ? ? ) + 0. ? × ( ? ? ) + 3.04 ? × ( ? ? ) - 0.46 × ( ? ? ) ? indicates text missing or illegible when filed S2: Exp(?k) power value with natural constant e as base and ?k as exponent is calculated; wherein, C1-C5 are respectively the number of mphA, marA, Klebsiella pneumoniae KpnE, KPC-1, floR gene copies in the candidate Klebsiella strain.
    Type: Application
    Filed: November 29, 2023
    Publication date: August 15, 2024
    Inventors: Qiwen Yang, Jing CHEN, Wei Yu, Jun Wang, Xiaobing Chu, Shiyu Chen, Qian Zhang, Yao Yao
  • Publication number: 20240276546
    Abstract: Examples pertaining to collision handling between multi-Universal Subscriber Identity Module (multi-USIM or MUSIM) gaps and Type-1 measurement gap (MG) in mobile communications are described. A multiple-Universal Subscriber Identity Modules (MUSIM) user equipment (UE) determines that there is a collision between a Type-1 MG and at least one MUSIM gap. The MUSIM UE then prioritizes the Type-1 MG or the at least one MUSIM gap to keep one of the Type-1 MG and the at least one MUSIM gap while dropping the other of the Type-1 MG and the at least one MUSIM gap.
    Type: Application
    Filed: January 24, 2024
    Publication date: August 15, 2024
    Inventors: Ogeen Hanna Toma Toma, Tsang-Wei Yu
  • Patent number: 12062604
    Abstract: A semiconductor structure includes a redistribution structure, topmost and bottom conductive terminals. The redistribution structure includes a topmost pad in a topmost dielectric layer, a topmost under-bump metallization (UBM) pattern directly disposed on the topmost pad and the topmost dielectric layer, a bottommost UBM pad embedded in a bottommost dielectric layer, and a bottommost via laterally covered by the bottommost dielectric layer. Bottom surfaces of the topmost pad and the topmost dielectric layer are substantially coplanar, bottom surfaces of the bottommost UBM pad and the bottommost dielectric layer are substantially coplanar, the bottommost via is disposed on a top surface of the bottommost UBM pad, top surfaces of the bottommost via and the bottommost dielectric layer are substantially coplanar. The topmost conductive terminal lands on a recessed top surface of the topmost UBM pattern, and the bottommost conductive terminal lands on the planar bottom surface of the bottommost UBM.
    Type: Grant
    Filed: July 11, 2023
    Date of Patent: August 13, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Lin Ho, Chin-Liang Chen, Jiun-Yi Wu, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen
  • Patent number: 12062414
    Abstract: A system and a method for predicting susceptibility of genus Klebsiella to amikacin are provided. The system includes a calculating unit containing a computer-readable storage medium stored with a computer program; the computer program is used to, when is executed by a processor, implement a calculation method for an Exp(?k) power value, and the calculation method for the Exp(?k) power value includes: step 1, calculating a k value according to formula I; and step 2, calculating the Exp(?k) power value with an Euler's constant e as a base and a ?k value as an exponential; and C1 to C5 are respectively copy numbers of an arr-2 gene, an acrB gene, an armA gene, an oqxB gene, and a rmtB gene in to-be-predicted Klebsiella strains. When the method and the system are adopted to predict the susceptibility of the genus Klebsiella to amikacin, an accuracy rate is about 98.8%.
    Type: Grant
    Filed: November 15, 2023
    Date of Patent: August 13, 2024
    Assignees: Peking Union Medical College Hospital, Chinese Academy of Medical Sciences, Hangzhou Matridx Biotechnology Co Ltd
    Inventors: Qiwen Yang, Jing Chen, Wei Yu, Jun Wang, Xiaobing Chu, Shiyu Chen, Qian Zhang, YiQun Mi
  • Patent number: 12062541
    Abstract: Methods and structures includes providing a substrate, forming a prelayer over a substrate, forming a barrier layer over the prelayer, and forming a channel layer over the barrier layer. Forming the prelayer may include growing the prelayer at a graded temperature. Forming the barrier layer is such that the barrier layer may include GaAs or InGaAs. Forming the channel layer is such that the channel layer may include InAs or an Sb-based heterostructure. Thereby structures are formed.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: August 13, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited & National Chiao-Tung University
    Inventors: Hung-Wei Yu, Yi Chang, Tsun-Ming Wang
  • Publication number: 20240267809
    Abstract: Apparatus and methods are provided for enhanced cell change procedure. In one novel aspect, downlink synchronization on the target cell is performed before performing one or more UE L1/L2/L3 processing procedures. In one embodiment, the command for cell change is a cell switch command. In one embodiment, the cell switch command is carried by a MAC control element (CE). In one embodiment, the command for cell change is a conditional handover command, and wherein the UE performs downlink synchronization on the target cell when at least one handover condition is met. In one embodiment, the cell switch procedure is a random access channel (RACH) based cell switch. In another embodiment, the cell switch procedure is a RACH-less cell switch procedure.
    Type: Application
    Filed: February 8, 2024
    Publication date: August 8, 2024
    Inventors: Miao Wang, Tsang-Wei Yu
  • Publication number: 20240264412
    Abstract: A photographing optical lens assembly includes seven lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The first lens element has negative refractive power. The third lens element has positive refractive power. The fourth lens element has negative refractive power. The sixth lens element has an image-side surface being convex in a paraxial region thereof. The seventh lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof. The image-side surface of the seventh lens element has at least one critical point in an off-axis region thereof. There is an air gap in a paraxial region between all adjacent lens elements of the seven lens elements.
    Type: Application
    Filed: April 3, 2024
    Publication date: August 8, 2024
    Applicant: LARGAN PRECISION CO., LTD.
    Inventor: Wei-Yu CHEN
  • Publication number: 20240264269
    Abstract: Methods and apparatus for a radar system having an array including a series of concentric rings of array elements, wherein the concentric rings that have a shape defined by respective ellipses that increase in size from a center that is common to the respective ellipses. The series of concentric rings can include multiple groups of the concentric rings, wherein the concentric rings in each successive group are larger in size than the concentric rings in the first group.
    Type: Application
    Filed: February 6, 2023
    Publication date: August 8, 2024
    Applicant: Raytheon Company
    Inventors: Shane D. Blair, Yueh-Chi Chang, Wayne Kim, JR., Wei Yu, Patrick J. Makridakis
  • Publication number: 20240265994
    Abstract: A system and a method for predicting susceptibility of genus klebsiella to amikacin are provided. The system includes a calculating unit containing a computer-readable storage medium stored with a computer program; the computer program is used to, when is executed by a processor, implement a calculation method for an Exp(?k) power value, and the calculation method for the Exp(?k) power value includes: step 1, calculating a k value according to formula I; and step 2, calculating the Exp(?k) power value with an Euler's constant e as a base and a ?k value as an exponential; and C1 to C5 are respectively copy numbers of an arr-2 gene, an acrB gene, an armA gene, an oqxB gene, and a rmtB gene in to-be-predicted klebsiella strains. When the method and the system are adopted to predict the susceptibility of the genus klebsiella to amikacin, an accuracy rate is about 98.8%.
    Type: Application
    Filed: November 15, 2023
    Publication date: August 8, 2024
    Inventors: Qiwen Yang, Jing Chen, Wei Yu, Jun Wang, Xiaobing Chu, Shiyu Chen, Qian Zhang, YiQun Mi
  • Publication number: 20240266316
    Abstract: An embodiment is a device including a substrate comprising conductive pads, a package component bonded to the conductive pads of the substrate with solder connectors, the package component comprising an integrated circuit die, the integrated circuit die comprising die connectors, one of the solder connectors coupled to each of the die connectors and a corresponding conductive pad of the substrate, a first dielectric layer laterally surrounding each of the die connectors and a portion of the solder connectors, and a second dielectric layer being between the first dielectric layer and the substrate, the second dielectric layer laterally surrounding each of the conductive pads of the substrate.
    Type: Application
    Filed: June 5, 2023
    Publication date: August 8, 2024
    Inventors: Wei-Yu Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Chao-Wei Chiu, Hsin Liang Chen
  • Publication number: 20240265995
    Abstract: Disclosed are a system and method of predicting sensitivity of Klebsiella against Cefoxitin, which belong to bioinformatics art. The system comprises a computer readable storage medium on which is stored a computer program. An Exp (?k) power value calculation method is implemented when the computer program is executed by a processor. The Exp(?k) power value calculation method comprises following computing steps: S1: k value is calculated according to formula I: k = 0.032 - 0.557 × ( C ? 1 - 1.008 0.317 ) + 0.054 × ( C ? 2 - 0.667 1.326 ) + 2.878 × ( C ? 3 - 0.552 1.121 ) + 1.021 × ( C ? 4 - 0.072 0.377 ) + 0.772 × ( C ? 5 - 0.036 0.292 ) Formula ? I S2: Exp(?k) power value with natural constant e as base and ?k as exponent is calculated; wherein, C1-C5 are respectively the number of ramA, sul1, KPC-1, DHA-1, bleomycin resistance determinant gene copies in the candidate Klebsiella strain.
    Type: Application
    Filed: November 29, 2023
    Publication date: August 8, 2024
    Inventors: Qiwen Yang, Jing CHEN, Wei YU, Jun WANG, Xiaobing CHU, Shiyu CHEN, Qian ZHANG, Yao YAO
  • Patent number: 12057450
    Abstract: A method includes forming a gate stack on a first portion of a semiconductor fin, removing a second portion of the semiconductor fin to form a recess, and forming a source/drain region starting from the recess. The formation of the source/drain region includes performing a first epitaxy process to grow a first semiconductor layer, wherein the first semiconductor layer has straight-and-vertical edges, and performing a second epitaxy process to grow a second semiconductor layer on the first semiconductor layer. The first semiconductor layer and the second semiconductor layer are of a same conductivity type.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: August 6, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jung-Chi Tai, Yi-Fang Pai, Tsz-Mei Kwok, Tsung-Hsi Yang, Jeng-Wei Yu, Cheng-Hsiung Yen, Jui-Hsuan Chen, Chii-Horng Li, Yee-Chia Yeo, Heng-Wen Ting, Ming-Hua Yu
  • Patent number: 12055793
    Abstract: A photographing lens assembly includes eight lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element and an eighth lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof. The sixth lens element has an image-side surface being concave in a paraxial region thereof. The seventh lens element has an image-side surface being concave in a paraxial region thereof. The eighth lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof, and the image-side surface of the eighth lens element has at least one critical point in an off-axis region thereof.
    Type: Grant
    Filed: August 22, 2023
    Date of Patent: August 6, 2024
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Cheng-Chen Lin, Yu-Tai Tseng, Wei-Yu Chen
  • Publication number: 20240252090
    Abstract: A system for determining cardiovascular characteristics is to be disposed on the body of a subject. The body has a detection area. The system includes a detector member and a processor. The detector member includes at least sixteen precordial electrodes which are to be placed on the chest of the subject within the detection area and which produce at least sixteen electrocardiogram (ECG) signals. The processor calculates at least twenty-four characteristic values based on the ECG signals. The characteristic values serve as basis for determining a location of chronic or acute myocardial ischemia in the body and a region of chronic or acute myocardial ischemia in the heart of the subject.
    Type: Application
    Filed: May 17, 2022
    Publication date: August 1, 2024
    Applicants: CHI-HUA FOUNDATION
    Inventors: Chau-Chung WU, Meng-Tsung LO, Wei-Yu CHEN, Zeus HARNOD, Tiffany WU
  • Patent number: 12051655
    Abstract: A package structure and a method of forming the same are provided. The package structure includes a die, an encapsulant, a redistribution layer (RDL) structure, a passive device, and a plurality of dummy items. The encapsulant laterally encapsulates the die. The RDL structure is disposed on the die and the encapsulant. The passive device is disposed on and electrically bonded to the RDL structure. The plurality of dummy items are disposed on the RDL structure and laterally aside the passive device, wherein top surfaces of the plurality of dummy items are higher than a top surface of the passive device.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: July 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jen-Jui Yu, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Wei-Yu Chen, Chih-Chiang Tsao, Chao-Wei Chiu
  • Patent number: D1040409
    Type: Grant
    Filed: May 13, 2024
    Date of Patent: August 27, 2024
    Inventor: Wei Yu