Abstract: A random code generator includes a memory cell, two write buffers and two sensing circuits. The memory cell includes a first program path between a first source line and a first bit line, a second program path between the first source line and a second bit line, a first read path between a second source line and a third bit line, and a second read path between a third source line and a fourth bit line. The two write buffers are connected with the first bit line and the second bit line, respectively. The two sensing circuits are connected with the third bit line and the fourth bit line, respectively. The two sensing circuits generate a first output signal and the second output signal to the corresponding write buffers according to the read currents in the corresponding read paths.

Abstract: A single-poly non-volatile memory unit includes: a semiconductor substrate having a first conductivity type; first, second and third OD regions disposed on the semiconductor substrate and separated from each other by an isolation region, wherein the first OD region and the second OD region are formed in a first ion well, and the first ion well has a second conductivity type; a first memory cell disposed on the first OD region, a second memory cell disposed on the second OD region. The first memory cell and the second memory cell exhibit an asymmetric memory cell layout structure with respect to an axis. An erase gate is disposed in the third OD region.

Abstract: An erasable programmable non-volatile memory includes a memory array and a sensing circuit. The memory array includes a general memory cell and a reference memory cell, which are connected with a word line. The sensing circuit includes a current comparator. The read current in the program state of the general memory cell is higher than the read current in the program state of the reference memory cell. The erase efficiency of the general memory cell is higher than the erase efficiency of the reference memory cell. When a read action is performed, the general memory cell generates a read current to the current comparator, and the reference memory cell generates a reference current to the current comparator. According to the reference current and the read current, the current comparator generates an output data signal to indicate a storage state of the general memory cell.

Abstract: A storage cell includes a selection circuit, a first memory transistor, and a second memory transistor. The selection circuit is coupled to a source line and a common node. When the selection circuit is turned on, the selection circuit forms an electrical connection between the source line and the common node. The first memory transistor has a first terminal coupled to the common node, a second terminal coupled to a first bit line, and a control terminal coupled to a control line. The second memory transistor has a first terminal coupled to the common node, a second terminal coupled to a second bit line, and a control terminal coupled to the control line. The first memory transistor and the second memory transistor are 2-dimension charge-trapping devices or 3-dimension charge-trapping devices.

Abstract: A testing method is provided for testing a memory die of a non-volatile memory. The testing method includes the following steps. Firstly, an erase action is performed on plural memory cells of the memory die. Then, a stress is applied to the plural memory cells of the memory die. Then, a read action is performed on the plural memory cells of the memory die to have the plural memory cells generate plural off currents, and a maximum off current is acquired from the plural off currents. Then, a specified test criterion set is selected from plural test criterion sets according to the maximum off current, and the memory die is tested according to plural test currents or plural test voltages of the specified test criterion set.

Abstract: An erasable programmable non-volatile memory includes a first select transistor, a first floating gate transistor, a second select transistor and a second floating gate transistor. A select gate and a first source/drain terminal of the first select transistor receive a first select gate voltage and a first source line voltage, respectively. A first source/drain terminal and a second source/drain terminal of the first floating gate transistor are connected with a second source/drain terminal of the first select transistor and a first bit line voltage, respectively. A select gate and a first source/drain terminal of the second select transistor receive a second select gate voltage and a second source line voltage, respectively. A first source/drain terminal and a second source/drain terminal of the second floating gate transistor are connected with the second source/drain terminal of the second select transistor and a second bit line voltage, respectively.

Abstract: A memory structure including a first select transistor, a first floating gate transistor, a second select transistor, a second floating gate transistor, and a seventh doped region is provided. The first select transistor includes a select gate, a first doped region, and a second doped region. The first floating gate transistor includes a floating gate, the second doped region, and a third doped region. The second select transistor includes the select gate, a fourth doped region, and a fifth doped region. The second floating gate transistor includes the floating gate, the fifth doped region, and a sixth doped region. A gate width of the floating gate in the second floating gate transistor is greater than a gate width of the floating gate in the first floating gate transistor. The floating gate covers at least a portion of the seventh doped region.

Abstract: A single-poly non-volatile memory unit includes: a semiconductor substrate having a first conductivity type; first, second and third OD regions disposed on the semiconductor substrate and separated from each other by an isolation region, wherein the first OD region and the second OD region are formed in a first ion well, and the first ion well has a second conductivity type; a first memory cell disposed on the first OD region, a second memory cell disposed on the second OD region. The first memory cell and the second memory cell exhibit an asymmetric memory cell layout structure with respect to an axis. An erase gate is disposed in the third OD region.

Abstract: A nonvolatile memory structure includes a first PMOS transistor and a first floating-gate transistor on a first active region in a substrate, a second PMOS transistor and a second floating-gate transistor on a second active region in the substrate, and an n-type erase region in the substrate. A source line connects with sources of the first and the second PMOS transistors. A bit line connects with drains of the first and the second floating-gate transistors. A word line connects with first and the second select gates in the first and the second PMOS transistors respectively. An erase line connects with the n-type erase region. The first floating-gate transistor includes a first floating gate with an extended portion extending on a first portion of the n-type erase region. The second floating-gate transistor includes a second floating gate with an extended portion extending on a second portion of the n-type erase region.

Abstract: A nonvolatile memory structure includes a substrate, a select transistor, and a floating-gate transistor. The substrate includes an oxide defined (OD) region and an erase region. The select transistor is disposed on the OD region, and the floating-gate transistor is disposed on the OD region between the select transistor and the erase region, wherein the floating gate has an extended portion capacitively coupled to the erase region, and the extended portion has an extending direction parallel to a first direction. The OD region further has an addition region protruding in a second direction and partially overlapped with the floating gate, in which the second direction is vertical to the first direction.

Abstract: A method for operating a NVM cell is disclosed. The NVM cell includes a select transistor and a floating gate transistor serially connected to the select transistor on an N well. The floating gate transistor includes a floating gate and a floating gate extension capacitively coupled to an erase gate region. The method includes erasing the NVM cell by applying an N well voltage VNW to the N well, wherein VNW>0V; applying a source line voltage VSL to a source doping region of the select transistor, wherein VSL=0V; applying a word line voltage VWL to a select gate of the select transistor, wherein VWL=0V; applying a bit line voltage VBL to a drain doping region of the floating gate transistor, wherein VBL=0V; and applying an erase line voltage VEL to the erase gate region, wherein VEL=VEE.

Abstract: A nonvolatile memory cell includes a semiconductor substrate, a first OD region, a second OD region for forming an erase gate region, and a trench isolation region separating the first OD region from the second OD region. A select transistor is disposed on the first OD region. A floating gate transistor is serially connected to the select transistor and is disposed on the first OD region. The floating gate transistor includes a floating gate overlying the first OD region. A floating gate extension continuously extends from the floating gate to the second OD region. A shallow junction diffusion region is situated directly under the floating gate extension within the second OD region.

Abstract: A nonvolatile memory (NVM) cell includes a semiconductor substrate having a first OD region and a second OD region for forming an erase gate (EG) region. The second OD region is spaced apart from the first OD region and is separated from the first OD region by a trench isolation region. A select transistor is disposed on the first OD region. A floating gate transistor is serially connected to the select transistor and is also disposed on the first OD region. The floating gate transistor includes a floating gate overlying the first OD region. A first floating gate extension continuously extends from the floating gate to the second OD region. The first floating gate extension comprises a P+ doped segment and an N+ doped segment with a P+/N+ interface therebetween.

Abstract: A single-poly nonvolatile memory cell includes an SOI substrate having a semiconductor layer, a first OD region and a second OD region on the semiconductor layer, an isolation region separating the first OD region from the second OD region, a PMOS select transistor disposed on the first OD region, and a PMOS floating gate transistor disposed on the first OD region. The PMOS floating gate transistor is serially connected to the PMOS select transistor. The PMOS floating gate transistor comprises a floating gate overlying the first OD region. A floating gate extension is continuously extended from the floating gate to the second OD region and is capacitively coupled to the second OD region.

Abstract: A method for operating a NVM cell is disclosed. The NVM cell includes a select transistor and a floating gate transistor serially connected to the select transistor on an N well. The floating gate transistor includes a floating gate and a floating gate extension capacitively coupled to an erase gate region. The method includes erasing the NVM cell by applying an N well voltage VNW to the N well, wherein VNW>0V; applying a source line voltage VSL to a source doping region of the select transistor, wherein VSL=0V; applying a word line voltage VWL to a select gate of the select transistor, wherein VWL=0V; applying a bit line voltage VBL to a drain doping region of the floating gate transistor, wherein VBL=0V; and applying an erase line voltage VEL to the erase gate region, wherein VEL=VEE .

Abstract: A nonvolatile memory (NVM) cell includes a semiconductor substrate having a first OD region and a second OD region for forming an erase gate (EG) region. The second OD region is spaced apart from the first OD region and is separated from the first OD region by a trench isolation region. A select transistor is disposed on the first OD region. A floating gate transistor is serially connected to the select transistor and is also disposed on the first OD region. The floating gate transistor includes a floating gate overlying the first OD region. A first floating gate extension continuously extends from the floating gate to the second OD region. The first floating gate extension comprises a P+ doped segment and an N+ doped segment with a P+/N+ interface therebetween.

Abstract: A semiconductor device and a method for fabricating the same are provided. The semiconductor device includes a substrate, a memory device, and a select transistor. The memory device is located on the substrate. The select transistor is located on the substrate and electrically connected to the memory device. The select transistor includes a select gate, a first dielectric layer, and a second dielectric layer. The select gate is located on the substrate. The first dielectric layer is adjacent to the second dielectric layer, and located between the select gate and the substrate. The first dielectric layer is closer to the memory device than the second dielectric layer. The thickness of the first dielectric layer is greater than the thickness of the second dielectric layer.

Abstract: A nonvolatile memory cell includes a semiconductor substrate, a first OD region, a second OD region for forming an erase gate region, and a trench isolation region separating the first OD region from the second OD region. A select transistor is disposed on the first OD region. A floating gate transistor is serially connected to the select transistor and is disposed on the first OD region. The floating gate transistor comprises a floating gate overlying the first OD region. A floating gate extension continuously extends from the floating gate to the second OD region. A shallow junction diffusion region is situated directly under the floating gate extension within the second OD region.

Abstract: A memory cell includes a program select transistor, a program element, a read select transistor, a read element, and an erase element. The program select transistor is coupled to a program source line, a program select line, and a program control line. The program element is coupled to the second terminal of the program select transistor, a program bit line, and the program control line. The read select transistor is coupled to a read source line, a read select line, and a bias control line. The read element is coupled to the second terminal of the read select transistor, a read bit line, and the bias control line. The erase element is coupled to an erase control line. A floating gate is coupled to the erase element, the program element and the read element.

Abstract: A non-volatile memory cell includes a substrate, a select gate, a floating gate, and an assistant control gate. The substrate includes a first diffusion region, a second diffusion region, a third diffusion region, and a fourth diffusion region. The select gate is formed above the first diffusion region and the second diffusion region in a polysilicon layer. The floating gate is formed above the second diffusion region, the third diffusion region and the fourth diffusion region in the polysilicon layer. The assistant control gate is formed above the floating gate in a metal layer, wherein an area of the assistant control gate overlaps with at least half an area of the floating gate.