Abstract: A method of system information transmission for a network in a wireless communication system is disclosed. The method comprises broadcasting essential minimum system information (SI) of a cell of the wireless communication system with fixed scheduled on a downlink broadcast channel, wherein the essential minimum SI includes scheduling information for non-essential minimum SI of at least one of the cell and an auxiliary cell or a frequency location, the non-essential minimum SI is broadcasted with dynamically scheduled on a downlink shared channel, and the scheduling information includes a time and frequency resource configuration and an availability information for indicating whether the cell broadcasts the non-essential minimum SI.

Abstract: The present disclosure relates to a method of forming an integrated chip structure. The method includes forming a plurality of interconnect layers within a dielectric structure over a substrate. A dielectric layer arranged along a top of the dielectric structure is patterned to define a via hole exposing an uppermost one of the plurality of interconnect layers. An extension via is formed within the via hole and one or more conductive materials are formed over the dielectric layer and the extension via. The one or more conductive materials are patterned to define a sensing electrode over and electrically coupled to the extension via. A microelectromechanical systems (MEMS) substrate is bonded to the substrate. The MEMs substrate is vertically separated from the sensing electrode.

Abstract: A 3D display system and a 3D display method are provided. The 3D display system includes a 3D display, a memory and one or more processors. The memory records a plurality of modules, and the processor accesses and executes the modules recorded by the memory. The modules include a bridge interface module and a 3D display service module. When an application is executed by the processor, the bridge interface module creates a virtual extend screen, and moves the application to the virtual extend screen. The bridge interface module obtains a 2D content frame of the application from the virtual extend screen by a screenshot function. The 3D display service module converts the 2D content frame into a 3D format frame by communicating with a third-party software development kit, and provides the 3D format frame to the 3D display for displaying.

Abstract: A method for preparing a supported carbon catalyst, the method includes at least the following steps: contacting a gas containing an organic silicon source with a silicon oxide-based material to obtain a precursor; contacting the precursor with a gas containing an organic carbon source to obtain the supported carbon catalyst. The temperature and energy consumption of the chemical vapor deposition of heteroatom-containing carbon material on silica-based materials can be greatly reduced in this method, and the cost of the catalyst can be effectively reduced.

Abstract: An optical element includes a bottom surface, a total reflection surface above the bottom surface, a recess recessed from the bottom surface toward the total reflection surface and first and second light exit surfaces. The optical element has a central axis perpendicular to the bottom surface. The total reflection surface has a peripheral boundary away from the central axis. The first light exit surface is connected to the peripheral boundary of the total reflection surface and extends toward the bottom surface away from the central axis. The second light exit surface is connected to the first light exit surface, extends away from the central axis, and is connected to the bottom surface. Each of the first and second light exit surfaces is consisted of at least one linear sub-refractive surface. Each linear sub-refractive surface is a straight line in any cross section passing through the central axis.

Abstract: A semiconductor structure includes a substrate, a sensing device disposed over the substrate and including a plurality of protruding members protruded from the sensing device; a sensing structure disposed adjacent to the sensing device and including a plurality of sensing electrodes protruded from the sensing structure towards the sensing device; and an actuating structure disposed adjacent to the sensing device and configured to provide an electrostatic force on the sensing device based on a feedback from the sensing structure. Further, a method of manufacturing the semiconductor structure is also disclosed.

Abstract: A semiconductor device includes: a first fin and a second fin extending from a substrate and an epitaxial source/drain region. The epitaxial source/drain region includes a first portion grown on the first fin and a second portion grown on the second fin, and the first portion and the second portion are joined at a merging boundary. The epitaxial source/drain region further includes a first subregion extending from a location level with a highest point of the epitaxial source/drain region to a location level with a highest point of the merging boundary, a second subregion extending from the location level with the highest point of the merging boundary to a location level with a lowest point of the merging boundary, and a third subregion extending from the location level with the lowest point of the merging boundary to a location level with a top surface of an STI region.

Abstract: Structures and formation methods of a semiconductor device structure are provided. The method includes forming a first dielectric layer over a substrate and forming a first recess in the first dielectric layer. The method also includes conformally forming a first movable membrane over the first dielectric layer. In addition, the first movable membrane has a first corrugated portion in the first recess. The method further includes forming a second dielectric layer over the first movable membrane and partially removing the substrate, the first dielectric layer, and the second dielectric layer to form a cavity. In addition, the first corrugated portion of the first movable membrane is partially sandwiched between the first dielectric layer and the second dielectric layer.

Abstract: A method for performing access control in a memory device, the associated memory device and the controller thereof are provided. The method includes: according to at least one predetermined arrangement pattern, writing a plurality of sets of symbols into a plurality of storage regions of a memory as a plurality of redundant array of independent disks (RAID) groups, respectively; and utilizing a RAID engine circuit in the memory device to perform a plurality of operations related to data protection, such as: determining a series of reading patterns corresponding to the predetermined arrangement pattern; according to a reading pattern of the series of reading patterns, reading a plurality of symbols from each RAID group of the RAID groups; and performing exclusive-OR (XOR) operations on the symbols to convert the symbols into at least one XOR result, for performing data protection.

Abstract: In example implementations, an apparatus is provided. The apparatus includes an accelerometer, a plurality of fan blades, a coil magnet and a processor. The accelerometer is coupled to a motor to measure an amount of vibration. The plurality of fan blades is coupled to the motor. Each one of the plurality of fan blades comprises a magnet. The coil magnet is coupled to a fan housing that encloses the motor, the plurality of fan blades and the accelerometer. The processor is communicatively coupled to the motor, the accelerometer, and the coil magnet. The processor activates the coil magnet to control a balance of the plurality of fan blades in response to an amount of vibration measured by the accelerometer that exceeds a threshold.

Abstract: The present invention provides an optical imaging structure, which comprises a windshield. The windshield includes a first glass layer and a second glass layer spaced with the first glass layer by a fixed distance. A horizontal curvature of the first glass layer and the second glass layer is greater than 3.5 meters. A vertical curvature of the first glass layer and the second glass layer is greater than the horizontal curvature. When an optical imaging device works with the windshield for imaging, the double-image phenomenon may be reduced.

Abstract: A vehicle includes a battery connecting module and a processor. The battery connecting module is configured to couple to at least one rechargeable battery. The processor is configured to: determine whether the battery module is coupled to a charging device; in response to the battery module being coupled to the charging device, transmit a permission request to a server; and in response to receiving a charging permission corresponding to the permission request from the server, allow the at least one rechargeable battery to be charged by the charging device.

Abstract: The present disclosure provides biochips and methods of fabricating biochips. The method includes combining three portions: a transparent substrate, a first substrate with microfluidic channels therein, and a second substrate. Through-holes for inlet and outlet are formed in the transparent substrate or the second substrate. Various non-organic landings with support medium for bio-materials to attach are formed on the first substrate and the second substrate before they are combined. In other embodiments, the microfluidic channel is formed of an adhesion layer between a transparent substrate and a second substrate with landings on the substrates.

Abstract: A micro-electro mechanical system (MEMS) device includes a MEMS substrate, at least one movable element laterally confined within a matrix layer that overlies the MEMS substrate, and a cap substrate bonded to the matrix layer through bonding material portions. A first movable element selected from the at least one movable element is located inside a first chamber that is laterally bounded by the matrix layer and vertically bounded by a first capping surface that overlies the first movable element. The first capping surface includes an array of downward-protruding bumps including respective portions of a dielectric material layer. Each of the downward-protruding bumps has a vertical cross-sectional profile of an inverted hillock. The MEMS device can include, for example, an accelerometer.

Abstract: A harness system includes an upper buckle, an upper strap and a restraining assembly including an anti-sliding structure and a beam structure. A through slot is formed on the upper buckle. The upper strap passes through the through slot. The beam structure is slidably disposed on the upper buckle. The anti-sliding structure is disposed on at least one of the beam structure and a wall of the through slot. The upper strap is engaged by the anti-sliding structure for restraining a sliding movement of the upper buckle relative to the upper strap and toward a shoulder portion when the upper strap is forced to drive the beam structure to slide relative to the upper buckle and toward the wall of the through slot.

Abstract: In some embodiments, a sensor is provided. The sensor includes a microelectromechanical systems (MEMS) substrate disposed over an integrated chip (IC), where the IC defines a lower portion of a first cavity and a lower portion of a second cavity, and where the first cavity has a first operating pressure different than an operating pressure of the second cavity. A cap substrate is disposed over the MEMS substrate, where a first pair of sidewalls of the cap substrate partially define an upper portion of the first cavity, and a second pair of sidewalls of the cap substrate partially define an upper portion of the second cavity. A sensor area comprising a movable portion of the MEMS substrate and a dummy area comprising a fixed portion of the MEMS substrate are both disposed in the first cavity. A pressure enhancement structure is disposed in the dummy area.

Abstract: A method for manufacturing an antenna printed circuit board includes the following steps: providing a flexible-rigid printed circuit board comprising a flexible region and a rigid region. The flexible region comprises at least one first connecting pad and at least one second connecting pad arranged opposite sides of the rigid region. At least one antenna module is attached to the first connecting pad through a conductive paste. The antenna module is fixed on the rigid region by a first reflow soldering process. At least one radio frequency integrated circuit structure is attached to the second connecting pad through a conductive paste. The radio frequency integrated circuit is fixed on the rigid region by a second reflow soldering process. A gap between the antenna module and the rigid region and a gap between the radio frequency integrated circuit structure and the rigid region are filled with dielectric materials and cured.

Abstract: A resistive memory device and a reliability enhancement method thereof are provided. The reliability enhancement method includes the following steps. A forming operation is performed on a plurality of memory cells. The formed memory cells are read to respectively obtain a plurality of formed currents. A reference current is set according to a statistic value of the formed currents. A setting operation is performed on the memory cells. A ratio between a set current of each of the memory cells and the reference current is calculated, and a physical status of each of the memory cells is judged according to the ratio. It is determined whether to perform a fix operation of each of the memory cells or not according to physical status.

Abstract: The disclosure is directed to a method used by a user equipment for implementing NTN to NT communication and a user equipment using the same method. In one of the exemplary embodiments, the disclosure is directed to a method used by a user equipment for implementing NTN to NT communication. The method would include not limited to: receiving a cell search and measurement configuration from a non-terrestrial network (NTN) comprises information of at least one carrier frequency and at least one NTN tracking area (TA) associated with the carrier frequency; initiating a cell search and measurement procedure; and performing the cell search and measurement procedure by applying the cell search and measurement configuration.

Abstract: A data accessing method using data protection with aid of an Advanced Encryption Standard (AES) processing circuit, and associated apparatus such as memory device, memory controller, and the AES processing circuit are provided. The data accessing method includes: utilizing the memory controller to start receiving first protected data corresponding to a read request from predetermined storage space; utilizing the AES processing circuit to start performing decryption processing on the first protected data to obtain decrypted data; utilizing the AES processing circuit to start performing encryption processing on other data to obtain encrypted data to be second protected data corresponding to a write request; and utilizing the memory controller to start sending the second protected data to the predetermined storage space, for storing the second protected data into the predetermined storage space. The AES processing circuit can perform encryption and decryption simultaneously.