Abstract: A method for manufacturing an antenna printed circuit board includes the following steps: providing a flexible-rigid printed circuit board comprising a flexible region and a rigid region. The flexible region comprises at least one first connecting pad and at least one second connecting pad arranged opposite sides of the rigid region. At least one antenna module is attached to the first connecting pad through a conductive paste. The antenna module is fixed on the rigid region by a first reflow soldering process. At least one radio frequency integrated circuit structure is attached to the second connecting pad through a conductive paste. The radio frequency integrated circuit is fixed on the rigid region by a second reflow soldering process. A gap between the antenna module and the rigid region and a gap between the radio frequency integrated circuit structure and the rigid region are filled with dielectric materials and cured.

Abstract: A wavelength conversion member includes a substrate, a phosphor layer, and a ventilated blade. The substrate is configured to rotate based on an axis. The phosphor layer is disposed on the substrate. The ventilated blade is disposed on the substrate and has a pore density between 10 ppi and 500 ppi or a volume porosity between 5% and 95%.

Abstract: A display system is provided. The display system includes a virtual reality display apparatus, an autostereoscopic display apparatus, and a host. In response to a processing unit of the host receiving a specific input signal, the processing unit generates a display-mode control signal, executes an image-conversion software development kit of an OpenVR driver to convert a virtual-reality (VR) stereoscopic image, that is generated by a VR application executed by the host, into an autostereoscopic image, and writes the autostereoscopic image to a second image buffer of the host. In response to the display-mode control signal, the autostereoscopic display apparatus is switched to an autostereoscopic display mode, and a multiplexing circuit of the host selects the autostereoscopic image stored in the second image buffer as an output image signal, and sends the output image signal to the autostereoscopic display apparatus for displaying.

Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a plurality of vias, a signal transmitting portion, a heater and a sensing material. The plurality of vias penetrates the substrate, wherein each of the plurality of vias includes a conductive or semiconductive portion surrounded by an oxide layer. The signal transmitting portion is disposed in the substrate, wherein adjacent vias of the plurality of vias surrounds the signal transmitting portion. The heater is electrically connected to the signal transmitting portion, and the sensing material is disposed over the heater and electrically connected to the substrate. A method of manufacturing a semiconductor structure is also provided.

Abstract: An improved conductive feature for a semiconductor device and a technique for forming the feature are provided. In an exemplary embodiment, the semiconductor device includes a substrate having a gate structure formed thereupon. The gate structure includes a gate dielectric layer disposed on the substrate, a growth control material disposed on a side surface of the gate structure, and a gate electrode fill material disposed on the growth control material. The gate electrode fill material is also disposed on a bottom surface of the gate structure that is free of the growth control material. In some such embodiments, the gate electrode fill material contacts a first surface and a second surface that are different in composition.

Abstract: There is provided a photographing device having two output interfaces that respectively used to output a first image frame and a second image frame. The first image frame is provided to a processor of the photographing device to perform the feature extraction and tag the second image frame accordingly. The tagged second image frame is for the image recording of an external back end.

Abstract: A resource integration method includes the following steps: a receiving module receives access information from a guest operating system on the host device; the access information is used to determine whether the frame rate is lower than a frame rate threshold; when the receiving module determines that the frame rate is lower than the frame rate threshold, the receiving module transmits an external resource request signal to the receiving module; after the receiving module receives the external resource request signal, a resource management module (which is located in the bridge module) selects an optimal external device from a specific category (among a plurality of categories in a candidate list), and a calculation operation or a storage operation corresponding to the specific category is transmitted to the optimal external device for calculation or storage by the bridge module.

Abstract: A tramp metal removing device has a primary housing to define a product flow path for being passed by a stream of raw materials and a moving path. A secondary housing is connected to the primary housing. A plurality of drawer units are sequentially stacked on the primary housing and secondary housing. Each drawer unit has a frame, a plurality of magnetic members and a scraping assembly. The frame is coupled with the primary and secondary housings in a movable way. Each of magnetic members is secured on the frame and has a magnetic section and a non-magnetic section. The scraping assembly is coupled with the frame in a way that it is only moveable in the secondary housing for removing tramp metals of a stream of raw materials in a two-stage manner.

Abstract: In one example, a computing device may include an antenna, a tuning circuit to tune the antenna, a wireless local area network (WLAN) module coupled to the antenna, a system firmware to boot up the computing device, and a look-up table residing in the system firmware. The system firmware may receive channel information from the WLAN module, determine a state of the antenna corresponding to the received channel information using the look-up table, and tune a frequency of the antenna corresponding to the determined state via the tuning circuit.

Abstract: A network switch and a network switch system thereof are provided. The network switch includes a plurality of connection ports and a processing circuit. When any of the connection ports receives a first abnormal message packet and one of the connection ports is in a disabled state, the processing circuit sets the connection port in the disabled state to switch to an enabled state, and the processing circuit does not forward the first abnormal message packet in the single loop network. When one of the connection ports is abnormal and each of the connection ports forming the single loop network is in the enabled state, the processing circuit sets the abnormal connection port to switch to the disabled state, and transmits a second abnormal message packet to other network switches in the single loop network through another connection port that is not abnormal.

Abstract: A method of system information transmission for a network in a wireless communication system is disclosed. The method comprises broadcasting essential minimum system information (SI) of a cell of the wireless communication system with fixed scheduled on a downlink broadcast channel, wherein the essential minimum SI includes scheduling information for non-essential minimum SI of at least one of the cell and an auxiliary cell or a frequency location, the non-essential minimum SI is broadcasted with dynamically scheduled on a downlink shared channel, and the scheduling information includes a time and frequency resource configuration and an availability information for indicating whether the cell broadcasts the non-essential minimum SI.

Abstract: An augmented reality screen system includes an augmented reality device and a host. The augmented reality device is configured to take a physical mark through a camera. The host is configured to receive the physical mark, determine position information and rotation information of the physical mark, and fetch a virtual image from a storage device through a processor of the host. The processor transmits an adjusted virtual image to the augmented reality device according to the position information and the rotation information, and the augmentation device projects the adjusted virtual image to a display of the augmented reality device. The adjusted virtual image becomes a virtual extended screen, and the virtual extended screen and the physical mark are simultaneously displayed on the display of the augmented reality device.

Abstract: A semiconductor device includes an active region, a LOCOS region formed within the active region and that extends vertically above a top surface of the active region, a gate region formed above the top surface of the active region, and a polysilicon resistor having a bottom surface that is offset vertically and physically isolated from a top surface of the LOCOS region. The active region includes a source region laterally disposed from the gate region, a drain region laterally disposed from the gate region, and a drift region laterally disposed between the gate region and the drain region. The polysilicon resistor is formed above the drift region. The active region further includes a first charge balance region formed in the active region below the drift region.

Abstract: A polyester film is provided. The polyester film includes 10 wt % to 100 wt % of a regenerated polyester resin. The regenerated polyester resin includes a physically regenerated polyester resin and a chemically regenerated polyester resin. Based on a total weight of the regenerated polyester resin being 100 wt %, an amount of the chemically regenerated polyester resin is larger than or equal to 5 wt %.

Abstract: The present application provides a upadacitinib salt compound and a preparation method therefor. The salt involved in the method in the present application has an easy preparation operation, a cheap raw material easy to get, and a good purification effect on upadacitinib, and is beneficial to industrial production.

Abstract: The present disclosure is applicable to the technical field of loudspeaker and provides a method and apparatus for reducing continuous-wakeup delay of Bluetooth loudspeaker and a Bluetooth loudspeaker. The method for reducing continuous-wakeup delay of Bluetooth loudspeaker includes: resetting a wakeup flag bit to wait for a next wakeup when receiving a stop-recording instruction which is sent by a terminal equipment through a Bluetooth serial port communication protocol; and executing a wakeup-interruption operation again after a preset wakeup keyword is received. According to the present disclosure, time delay under a continuous-wakeup mode can be greatly reduced and a response speed of continuous-wakeup can be improved.

Abstract: The integrated CMOS-MEMS device includes a CMOS structure, a cap structure, and a MEMS structure. The CMOS structure, fabricated on a first substrate, includes at least one conducting layer. The cap structure, including vias passing through the cap structure, has an isolation layer deposited on its first side and has a conductive routing layer deposited on its second side. The MEMS structure is deposited between the first substrate and the cap structure. The integrated CMOS-MEMS device also includes a conductive connector that passes through one of the vias and through an opening in the isolation layer on the cap structure. The conductive connector conductively connects a conductive path in the conductive routing layer on the cap structure with the at least one conducting layer of the CMOS structure.

Abstract: A resource integration method includes the following steps: allowing a host operating system of a host device to communicate with an external device; using a bridge module to obtain external device information; receiving an access command from a guest operating system to the host device; receiving a hardware processing result from the host device; selectively transmitting the access command to the external device through the bridge module; and receiving the hardware processing result from the external device at a receiving module. The hardware processing result corresponds to the access command. The host device executes the virtual environment on the host operating system. The guest operating system runs in the virtual environment. The guest operating system executes an application program. The application program is used to issue the access command.

Abstract: A MEMS support structure and a cap structure are provided. At least one vertically-extending trench is formed into the MEMS support structure or a portion of the cap structure. A vertically-extending outgassing material portion having a surface that is physically exposed to a respective vertically-extending cavity is formed in each of the at least one vertically-extending trench. A matrix material layer is attached to the MEMS support structure. A movable element laterally confined within a matrix layer is formed by patterning the matrix material layer. The matrix layer is bonded to the cap structure. A sealed chamber containing the movable element is formed. Each vertically-extending outgassing material portion has a surface that is physically exposed to the sealed chamber, and outgases a gas to increase the pressure in the sealed chamber.