Abstract: An apparatus for manufacturing a semiconductor device may include a chamber, a chuck provided in the chamber, and a biased power supply physically connected with the chuck. The apparatus may include a target component provided over the chuck and the biased power supply, and a magnetron assembly provided over the target component. The magnetron assembly may include a plurality of outer magnetrons and a plurality of inner magnetrons, and a spacing between each adjacent magnetrons of the plurality of outer magnetrons may be different from a spacing between each adjacent magnetrons of the plurality of inner magnetrons.

Abstract: A manufacturing method for a child carrying device includes the following steps: providing a mold and disposing a main body of the child carrying device into the mold, and injecting a foam material into a cavity of the mold and foaming the foam material so as to form a flexible layer integrated with the main body. The manufacturing method disposes the main body into the mold and directly forms a flexible layer on the main body, so that the flexible layer ensures safety and comfort of the child carrying device while saves the necessity to dispose a seat pad or a cushion and fixing structures on the main body, and thereby reduces the cost and the work-hour of assembly, and the overall weight of the child carrying device can be reduced by omitting the fixing structures.

Abstract: In an embodiment, a system includes: a base; and a rod set comprising multiple rods connected to the base, wherein each rod of the rod set comprises multiple fingers disposed in a vertically-stacked relationship to each other and separated respectively from each other by respective slots, wherein each slot is configured to receive a bevel of a wafer, and wherein each of the multiple fingers comprises a rounded end at a furthest extension.

Abstract: A manufacturing method for a car safety seat includes the following steps: providing a mold and disposing a main body of the car safety seat into the mold, and injecting a foam material into a cavity of the mold and foaming the foam material so as to form a flexible layer integrated with the main body. A pressure in the cavity is between 1.5 bar and 5.0 bar. The manufacturing method disposes the main body into the mold and directly forms a flexible layer on the main body, so that the flexible layer ensures safety and comfort of the car safety seat while saves the necessity to dispose a seat pad or a cushion and fixing structures on the main body, and thereby reduces the cost and the work-hour of assembly, and the overall weight of the car safety seat can be reduced by omitting the fixing structures.

Abstract: An insulation resistance detection system for an electric vehicle is used to detect a positive insulation resistance between a positive electrode of a battery of the electric vehicle and an equipment grounding point, and detect a negative insulation resistance between a negative electrode of the battery and the equipment grounding point. The insulation resistance detection system includes a negative detection circuit, a positive detection circuit, and a control unit. The control unit controls the negative detection circuit to be charged to generate a first capacitor voltage, and controls the positive detection circuit to be charged to generate a second capacitor voltage. The control unit determines whether the negative insulation resistance is abnormal according to the first capacitor voltage and a battery voltage of the battery, and determines whether the positive insulation resistance is abnormal according to the second capacitor voltage and the battery voltage.

Abstract: A method for packet filtering in a network switch includes: utilizing an access control list circuit to filter received packets, wherein the access control list circuit compares header information of the received packets with an access control list to filter the received packets, where the access control list has at least one entry, and rule information in the entry includes only a portion of an IP address; and utilizing a routing circuit to further filter packets that pass the access control list circuit, wherein the routing circuit compares header information of the packets that pass the access control list circuit with a routing table to filter the packets, wherein the routing table has at least one entry, and rule information in the entry includes an entire IP address.

Abstract: Various embodiments of the present disclosure are directed towards an electronic device that comprises a semiconductor substrate having a first surface opposite a second surface. The semiconductor substrate at least partially defines a cavity. A first microelectromechanical systems (MEMS) device is disposed along the first surface of the semiconductor substrate. The first MEMS device comprises a first backplate and a diaphragm vertically separated from the first backplate. A second MEMS device is disposed along the first surface of the semiconductor substrate. The second MEMS device comprises spring structures and a moveable element. The spring structures are configured to suspend the moveable element in the cavity. A segment of the semiconductor substrate continuously laterally extends from under a sidewall of the first MEMS device to under a sidewall of the second MEMS device.

Abstract: A network switch and a network switch system thereof are provided. The network switch includes a plurality of connection ports and a processing circuit. When any of the connection ports receives a first abnormal message packet and one of the connection ports is in a disabled state, the processing circuit sets the connection port in the disabled state to switch to an enabled state, and the processing circuit does not forward the first abnormal message packet in the single loop network. When one of the connection ports is abnormal and each of the connection ports forming the single loop network is in the enabled state, the processing circuit sets the abnormal connection port to switch to the disabled state, and transmits a second abnormal message packet to other network switches in the single loop network through another connection port that is not abnormal.

Abstract: An electronic device is provided, including a frame, a working panel, and a spacer. The frame includes a side wall. The working panel is disposed on the frame. The spacer is disposed between the frame and the working panel. At least a portion of the working panel and at least a portion of the spacer are in direct contact with an adhesive.

Abstract: A stereo image generation method and an electronic apparatus using the same are provided. The stereo image generation method includes the following steps. A two-dimensional (2D) original image corresponding to a first viewing angle is obtained, and a depth map of the 2D original image is estimated. Interpupillary distance information of a user is detected. A pixel shift processing is performed on the 2D original image according to the interpupillary distance information and the depth map to generate a reference image corresponding to a second viewing angle. An image inpainting processing is performed on the reference image to obtain a restored image. The restored image and the 2D original image are merged to generate a stereo image conforming to a stereo image format.

Abstract: A side by side image detection method and an electronic apparatus using the same are provided. The side by side image detection method includes the following steps. A first image with a first image size is obtained. A second image with a second image size that conforms to a side-by-side image format is detected within the first image by using a convolutional neural network model.

Abstract: A composite material and a foam prepared from the composite material are provided. The composite material includes a network polymer, a fluorine-containing polymer fiber, and a reinforcement fiber. The polymer network is a crosslinking reaction product of a polymer and an oligomer, wherein the polymer is polyamide, polyester, polyurethane, or a combination thereof, and the oligomer is a vinyl aromatic-co-acrylate oligomer with an epoxy functional group. The oligomer has a weight percentage of 1% to 10%, based on the weight of the network polymer. The ratio of the weight of the reinforcement fiber to the total weight of the network polymer and the fluorine-containing polymer fiber is from 1:9 to 4:6.

Abstract: A semiconductor structure includes: a first device; a second device contacted with the first device, wherein a chamber is formed between the first device and the second device; a first hole disposed in the second device and defined between a first end with a first circumference and a second end with a second circumference; a second hole disposed in the second device and aligned to the first hole; and a sealing object for sealing the second hole. The first end links with the chamber, and the first circumference is different from the second circumference, the second hole is defined between the second end and a third end with a third circumference, and the second circumference and the third circumference are smaller than the first circumference.

Abstract: An electronic device includes a first substrate; a second substrate arranged opposite to the first substrate; a first electrode layer disposed on the first substrate; a display medium layer disposed between the first electrode layer and the second substrate; and a first metal element, wherein the first metal element is fixed on the first electrode layer through a conductive glue and an insulating glue; wherein in a normal direction of the first substrate, the conductive glue and the insulating glue are overlapped.

Abstract: The present disclosure provides an antibody-containing aqueous formulation, comprising a therapeutically effective amount of an anti-interleukin-6 receptor antibody, a protein stabilizer, a surfactant, and a buffer. The buffer is an acetate buffer or a histidine buffer, and the antibody-containing aqueous formulation has a pH ranging from 4.5 to 6.5.

Abstract: A wavelength conversion element includes a base plate and a rotating device. The base plate has a first surface and a second surface. The first surface is configured to allow a fluorescent layer to dispose on. The base plate includes some first grooves and some second grooves. The first grooves are disposed on the first surface around a center of the base plate. The second grooves are disposed on the second surface around the center. The first grooves and the second grooves are staggered from each other along a rotating direction. The base plate has some through holes. Each of the through holes communicates with the second surface and the corresponding first groove. The rotating device is connected with the base plate and configured to drive the base plate to rotate about an axis along the rotating direction. The axis passes through the center.

Abstract: Provided herein is an aptamer specific to coagulation factor XIII (FXIII) and its uses thereof. Accordingly, the present aptamer is useful as a bio-tool to label thrombi, and/or as a targeting molecule to deliver drugs to thrombotic area. Therefore, the present disclosure also pertains to methods for treating diseases associated with FXIII, such as thrombosis.

Abstract: In a method for manufacturing a semiconductor device, a fin structure is formed over a substrate, an isolation insulating layer is formed over the substrate such that an upper portion of the fin structure protrudes from the isolation insulating layer, a first dielectric layer is formed on the upper portion of the fin structure, a cover layer is formed on the first dielectric layer, the cover layer is partially removed from an upper part of the upper portion of the fin structure with the first dielectric layer, the first dielectric layer is removed from the upper part of the upper portion of the fin structure, a second dielectric layer is formed on the upper part of the upper portion of the fin structure, and a gate electrode is formed on the second dielectric layer and the first dielectric layer disposed on an lower part of the upper portion of the fin structure.

Abstract: A sputtering target assembly, sputtering apparatus, and method, the target assembly including a backing plate having an aperture formed therein; and a target bonded to a front surface of the backing plate. The aperture is disposed on the backing plate such that a first end of the aperture is sealed by a portion of the target that is predicted by a sputtering target erosion profile to have the highest etching rate during a corresponding sputtering process.