Abstract: A micro-electro mechanical system (MEMS) humidity sensor includes a first substrate, a second substrate and a sensing structure. The second substrate is substantially parallel to the first substrate. The sensing structure is between the first substrate and the second substrate, and bonded to a portion of the first substrate and a portion of the second substrate, in which the second substrate includes a conductive layer facing the sensing structure, and a first space between the first substrate and the sensing structure is communicated with or isolated from outside, and a second space between the conductive layer and the sensing structure is communicated with an atmosphere, and the sensing structure, the second space and the conductive layer constitute a capacitor configured to measure permittivity of the atmosphere, and humidity of the atmosphere is derived from the permittivity of the atmosphere, pressure of the atmosphere and temperature.

Abstract: A fin field effect transistor (FinFET) device structure and method for forming FinFET device structure are provided. The FinFET structure includes a substrate and a fin structure extending above the substrate. The FinFET structure includes an epitaxial structure formed on the fin structure, and the epitaxial structure has a first height. The FinFET structure also includes fin sidewall spacers formed adjacent to the epitaxial structure. The sidewall spacers have a second height and the first height is greater than the second height, and the fin sidewall spacers are configured to control a volume and the first height of the epitaxial structure.

Abstract: A micro-electromechanical systems (MEMS) device includes a MEMS substrate having a first opening, a second opening, and a membrane layer comprising a first membrane disposed over the first opening and a second membrane disposed over the second opening. The MEMS device also includes a carrier substrate bonded to a first side of the MEMS substrate, the carrier substrate having a first cavity exposing the first membrane and a second cavity exposing the second membrane, and a cap substrate bonded to a second side of the MEMS substrate. The cap substrate has a third cavity connected to the first opening and a fourth cavity connected to the second opening. The first membrane, the first cavity, and the third cavity are part of a pressure sensor. The fourth cavity extends completely through the cap substrate. The second membrane, the second cavity, and the fourth cavity are part of a microphone.

Abstract: An electrical connector connecting with a cable electrically includes a mating member, a printed circuit board connected with the mating member and the cable electrically, a light source positioned on the printed circuit board, a detector controlling the light source, a light transmissive member permitting transmission of a light emitted from the light source therethrough, a metal shell enclosing the light transmissive member and the printed circuit board, and a detective member connecting the detector and the metal shell electrically.

Abstract: The invention provides a system for speech keyword detection and associated method. The system includes a speech keyword detector, an activity predictor and a decision maker. The activity predictor obtains sensor data provided by a plurality of sensors, and processes the sensor data to provide an activity prediction result indicating a probability for whether a user is about to give voice keyword. The decision maker processes the activity prediction result and a preliminary keyword detection result of the speech keyword detection to provide a keyword detection result.

Abstract: A sensor assembly is provided for a portable electronic device. The sensor assembly includes a proximity sensor and a module including shielding. The proximity sensor is connected to the shielding such that the shielding selectively functions as a sensor electrode for the proximity sensor.

Abstract: A communication system is provided. The communication system includes a main electronic device and an auxiliary electronic device. The auxiliary electronic device would send a connection sound wave signal. When the main electronic device receives the connection sound wave signal, the main electronic device sends a positioning signal. When the auxiliary electronic device receives the positioning signal, the auxiliary electronic device sends a positioning sound wave signal to the main electronic device. Moreover, the main electronic device determines a relative position of the auxiliary electronic device and the main electronic device according to the positioning sound wave signal, and displays an operating icon on a display unit of the main electronic device according to the relative position.

Abstract: A wireless network connection method for an electronic device is provided, in which a first signal is transmitted to additional electronic device and is utilized to identify the electronic device. When the additional electronic device identifies the electronic device through the first signal, it establishes wireless communication between the electronic device and the additional electronic device. A second signal is transmitted to the additional electronic device. The second signal is an audio signal to instruct the additional electronic device to maintain the wireless communication.

Abstract: A method for allocating port assignments for transmitting a reserved network stream across a network node comprises determining a cycle time associated with a network node. The method also comprises establishing, for at least one port of the network node, a plurality of virtual layers associated with the cycle time, wherein each of the plurality of virtual layers is divided into 2n equally-spaced slots per cycle (where n>0). The method further comprises receiving a reserved stream request associated with transmission of a reserved stream across the node, and determining a number of slots required to transmit the reserved stream. The method also comprises assigning one or more slots associated with a port of the network node to the transmission of packets associated with the reserved stream based on the determined number of slots. The method further comprises transmitting the stream according to the slot assignment associated with the port of the network node.

Abstract: A device and a method for forming a device are disclosed. The device includes a substrate with a high voltage (HV) device region. The HV device region is defined with first and second device isolation regions and an internal dielectric region which are shallow trench isolation (STI) regions. A HV transistor is disposed in the HV device region. The HV transistor includes a gate dielectric layer on the substrate, a gate disposed on the gate dielectric layer, and a source region disposed in the substrate adjacent to the gate and first device isolation region while a drain region disposed in the substrate adjacent to the second device isolation region. A drift well and a body well are disposed in the substrate. At least one buried RESURF region is disposed under the internal dielectric region.

Abstract: The invention provides a packaging method for ultraviolet light emitting diode, comprising: (S1) providing a carrier, connected to an electrode; (S2) fixing an UV LED chip on the carrier and electrically connecting the UV LED chip to the electrodes; (S3) covering the UV LED chip with transparent silicon-and-oxygen-containing solution; and (S4) performing a thermal curing process.

Abstract: A semiconductor structure includes a first magnetic layer, an insulative oxide layer, an oxygen trapping layer and a cap layer. The insulative oxide layer is over the first magnetic layer. The oxygen trapping layer is over the insulative oxide layer. The oxygen concentration of the oxygen trapping layer is less than an oxygen concentration of the insulative oxide layer. The cap layer is over the oxygen trapping layer.

Abstract: A structure and a formation method of a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a cap substrate and a MEMS substrate bonded with the cap substrate. The MEMS substrate includes a first movable element and a second movable element. The MEMS device also includes a first enclosed space surrounded by the MEMS substrate and the cap substrate, and the first movable element is in the first enclosed space. The MEMS device further includes a second enclosed space surrounded by the MEMS substrate and the cap substrate, and the second movable element is in the second enclosed space. In addition, the MEMS device includes a pressure-changing layer in the first enclosed space.

Abstract: A device includes a substrate, a first structure, a second structure, a third structure and a bumper. The first structure is over the substrate. The second structure is over the substrate, wherein the second structure has a first end coupled to the first structure. The third structure is over the substrate, wherein the third structure is coupled to a second end of the second structure. The bumper is between the substrate and the third structure, wherein the bumper is a multi-layered bumper including a first conductive feature, a dielectric feature and a second conductive feature. The dielectric feature is over the first conductive feature. The second conductive feature is over the dielectric feature and electrically connected to the first conductive feature.

Abstract: A micro electromechanical system (MEMS) device includes a MEMS section attached to a substrate, and a cap bonded to a first surface of the substrate. The MEMS device further includes a carrier bonded to a second surface of the substrate opposite the first surface, wherein the carrier is free of active devices, and the cap and the carrier define a vacuum region surrounding the MEMS section. The MEMS device further includes a bond pad on a surface of the carrier opposite the MEMS section, wherein the bond pad is electrically connected to the MEMS section.

Abstract: A semiconductor structure includes a first magnetic layer, an insulative oxide layer, an oxygen trapping layer and a cap layer. The insulative oxide layer is over the first magnetic layer. The oxygen trapping layer is over the insulative oxide layer. The oxygen concentration of the oxygen trapping layer is less than an oxygen concentration of the insulative oxide layer. The cap layer is over the oxygen trapping layer.

Abstract: A display apparatus includes a plurality of first pixel units and a plurality of second pixel units. Each of the first pixel units includes at least one first color sub-pixel, at least one second color sub-pixel, at least one third color sub-pixel and at least one fourth color sub-pixel arranged in a first configuration. Each of the second pixel units includes the at least one first color sub-pixel, the at least one second color sub-pixel, the at least one third color sub-pixel and the at least one fourth color sub-pixel arranged in a second configuration different from the first configuration. The first pixel units and the second pixel units are alternately disposed to make all of the pixel units adjacent to each of the first pixel units be the second pixel units, and all of the pixel units adjacent to each of the second pixel units be the first pixel units.

Abstract: A chemical mechanical polishing slurry for polishing a stainless steel substrate is provided, which comprises a content 10˜50 wt % of abrasive particles, a content 0.001˜2.0 wt % of a coolant, a content 0.001˜1.0 wt % of an oxidant, a content 10˜5000 ppm of a lubricity improver, and a content 10˜5000 ppm of a foam inhibitor. A particle size of the abrasive particles is in a range of 20˜500 nm. The alkaline polishing slurry according to the present invention is capable of increasing the polishing performance, surface quality, and surface passivation effect after the chemical-mechanical polishing process.

Abstract: Some embodiments of the present disclosure provide a semiconductor structure, including a substrate having a top surface; a first doped region in proximity to the top surface; a non-doped region positioned in proximity to the top surface and adjacent to the first doped region, having a first width; a metal gate positioned over the non-doped region and over a portion of the first doped region, having a second width. The first width is smaller than the second width, and material constituting the non-doped region is different from material constituting the substrate.

Abstract: A device includes a substrate, a first structure, a second structure, a third structure and a bumper. The first structure is over the substrate. The second structure is over the substrate, wherein the second structure has a first end coupled to the first structure. The third structure is over the substrate, wherein the third structure is coupled to a second end of the second structure. The bumper is between the substrate and the third structure, wherein the bumper is a multi-layered bumper including a first conductive feature, a dielectric feature and a second conductive feature. The dielectric feature is over the first conductive feature. The second conductive feature is over the dielectric feature and electrically connected to the first conductive feature.