Abstract: A keyboard includes a key module and a base. The key module includes at least a second anchor portion. The base has a first anchor portion corresponding to the second anchor portion that is engageable with each other to couple the key module with the base. The base further has a signal transmission module to form electric connection with the key module. The keyboard thus formed is thinner. Assembly is simpler and production cost is lower.

Abstract: A positioning device for clipping apparatus includes a hollow body which has an open side on one side that holds a track portion and an anchor portion on another side. The body houses a sliding member having a clipping unit and a harness arm. The harness arm is connected to the track portion to form a displacement path of the sliding member. The clipping unit includes an upper clipping portion and a lower clipping portion. The upper clipping portion is driven by the sliding member to move close to the lower clipping portion. A linking means connects an elastic element to the anchor portion and the sliding member so that the elastic element can be stretched and retracted against the displacement path of the sliding member to provide a returning elastic force to the sliding member. Thereby the sliding member can be positioned rapidly on each displacement path.

Abstract: A fixing structure for mounting a data storage device in a computer body is provided. The data storage device has two opposite side surfaces. The fixing structure includes two mounting brackets and at least one pull strap. Each mounting bracket is disposed to a corresponding one of the side surfaces. The data storage device is disposed in the computer body via the mounting brackets. The pull strap is connected to at least one of the mounting brackets. The pull strap is extendable to an outside of the computer body when the data storage device is disposed in the compute body.

Abstract: A manufacturing method of metal oxide semiconductor transistor is provided. A substrate is provided. A source/drain extension region is formed in the substrate. A pad material layer with low dielectric constant is formed on the substrate. A trench is formed in the substrate and the pad material layer. A gate dielectric layer is formed on the surface of the substrate in the trench. A stacked gate structure is formed in the trench, wherein the top surface of a conductive layer of the stacked gate structure is higher than the surface of the pad material layer. A spacer material layer is formed conformably on the substrate. Portions of the spacer material layer and the pad material layer are removed so as to form a pair of first spacers and a pair of pad blocks. A source/drain is formed on the substrate beside the stacked gate structure.

Abstract: A circular piezoelectric apparatus includes an electrode assembly which has an independent electrode located on a perimeter side wall of the circular piezoelectric apparatus and two separated electrodes located respectively at two opposite surfaces of the circular piezoelectric apparatus, a first structure located between the two separated electrodes that has a polarized direction coincided with a first axial direction directing from one electrode of the two separated electrodes to the other electrode thereof, and a second structure surrounding the first structure about the first axial direction and having a polarized direction coincided with a radial direction of the perimeter. One of the three electrodes is electrically connected a ground electrode to provide a voltage source for supplying an input voltage and a load through at least a conductive wire, and another electrode is electrically connected to an input electrode of the voltage source through another conductive wire.

Abstract: A backlight module actuation method aims to modulate a unsaturated luminance cycle in a dimming cycle for a backlight module in the condition of a saturated luminance. An oscillation amplitude time series of the duty cycle of a transformer at the rear end is set according to the dimming cycle to form a switch kinetic energy in the unsaturated luminance cycle. The switch kinetic energy can eliminate the parasite capacitance generated when the backlight module is in the condition of the saturated luminance.

Abstract: The present invention includes a wheel mounted onto an electronic device through a holding rack and turnable freely under an external force. The wheel has a click portion to generate signals that consists of concave and convex portions formed radially and equally spaced from one another. A signal generation means is provided including at least two legs and a conductive element located between the two legs having an elastic return force. The conductive element is moved to connect the two legs due to rotation of the click portion to generate instruction signals. A friction force is generated when the conductive element is connected to the click portion. A rotation resistant force is generated when the conductive element and the rotating click portion are connected. A composite force is formed by the force to generate rotation and the rotation resistant force. The composite force forms an inverse relationship with the weight of the wheel.

Abstract: An improved LCD back light panel lamp connecting structure. A high voltage end and a feedback end of the adjacent cold cathode fluorescent lamp (CCFL) modules alternate, and the feedback end of the CCFL is coupled to a single return board. The return board is coupled to a pulse width modulation (PWM) control unit so that the return board feeds back the current to the PWM control unit. The high voltage end of the CCFL is coupled to a transformer.

Abstract: A method for directly forming patterns on face membrane by vacuum absorption is to have foamed polyurethane (PU) injected on the surface of substratum cloth to form a face membrane. Then, the face membrane is heated at a preset temperature by a preheating box to be continuously kept in a softened condition before it is not thoroughly hardened. Subsequently, a roller having functions of vacuum absorption and cooling has its superficial patterns quickly pressed and absorbed on the heated face membrane by vacuum absorbing force, and simultaneously the patterns on the face membrane is quickly cooled off and fixed in shape by the roller, thus shortening a producing process, saving factory equipment, conforming to environmental conservation and economizing energy source.

Abstract: The present invention includes a directional wheel which has a roller movable under a force. The roller has two sides forming a first and a second leaning portions that are held by a first and a second support structures. The first support structure and the second support structure have respectively a first moving end and a second moving end movable by the first leaning portion and the second leaning portion. A first contact and a second contact are provided respectively in the moving range of the first and second moving ends to connect the first and second moving ends to generate signals. The first and second leaning portions keep two sides of the direction wheel in a balanced manner in regular conditions. The directional wheel is movable under a force to synchronously move the first and second support structures in the direction of the force to generate a corresponding signal.

Abstract: A Quad Flat Non-leaded (QFN) chip package including a patterned conductive layer, a first solder resist layer, a chip, a plurality of bonding wires and a molding compound is provided. The patterned conductive layer has a first surface and a second surface opposite to each other. The first solder resist layer is disposed on the first surface, wherein a part of the first surface is exposed by the first solder resist layer. The chip is disposed on the first solder resist layer, wherein the first solder resist layer is between the patterned conductive layer and the chip. The bonding wires are electrically connected to the chip and the patterned conductive layer exposed by the first solder resist layer. The molding compound encapsulates the pattern conductive layer, the first solder resist layer, the chip and the bonding wires.

Abstract: A chip package includes a patterned conductive layer, a first solder resist layer, a second solder resist layer, a chip, bonding wires and a molding compound. The patterned conductive layer has a first surface and a second surface opposite to each other. The first solder resist layer is disposed on the first surface. The second solder resist layer is disposed on the second surface, wherein a part of the second surface is exposed by the second solder resist layer. The chip is disposed on the first solder resist layer, wherein the first solder resist layer is disposed between the patterned conductive layer and the chip. The bonding wires are electrically connected to the chip and the patterned conductive layer exposed by the second solder resist layer. The molding compound encapsulates the pattern conductive layer, the first solder resist layer, the second solder resist layer, the chip and the bonding wires.

Abstract: A keyboard includes a key module and a base. The key module includes at least a second anchor portion. The base has a first anchor portion corresponding to the second anchor portion that is engageable with each other to couple the key module with the base. The base further has a signal transmission module to form electric connection with the key module. The keyboard thus formed is thinner. Assembly is simpler and production cost is lower.

Abstract: A chip package including a base, a chip, a molding compound and a plurality of outer terminals is provided. The base is essentially consisted of a patterned circuit layer having a first surface and a second surface opposite to each other and a solder mask disposed on the second surface, wherein the solder mask has a plurality of first openings by which part of the patterned circuit layer is exposed. The chip is disposed on the first surface and is electrically connected to the patterned circuit layer. The molding compound covers the pattern circuit layer and fixes the chip onto the patterned circuit layer. The outer terminals are disposed in the first openings and electrically connected to the patterned circuit layer.

Abstract: A semiconductor device is provided. The semiconductor device has a gate structure, a source region, a drain region, and a pair of dielectric barrier layers. The gate structure is formed on a substrate. The source region and the drain region are formed in the substrate next to the gate structure, and a channel region is formed between the source region and the drain region underneath the gate structure. The pair of dielectric barrier layers is respectively formed in the substrate underneath the gate structure between the source region and the drain region. The dielectric barrier layers are used for reducing the drain induced barrier lowering effect in a nanometer scale device.

Abstract: A portable electronic apparatus including a host and a display unit pivotally connected to the host is provided. The display unit includes a panel module, a first plate having a plate body and a plurality of positioning structures provided on the plate body, and a second plate. The panel module is locked at the first plate by the positioning structures and tightly fits with the first plate. The second plate is connected to the first plate, and the panel module is held between the first plate and the second plate.

Abstract: In a computer system, a card holder is removably attached to a bracket to hold an add-in card in an I/O connector. The card holder is capable of being slid onto the bracket and a side edge of the add-in card.

Abstract: A multi-direction input device for computers includes a directional wheel, a sliding member and a plurality of electrodes. The directional wheel has a rotational degree-of-freedom and two moving degree-of-freedom to be moved downwards, perform forward rolling, backward rolling and sideward moving thereby to connect corresponding electrodes to generate corresponding signals. In regular conditions the sliding member can be in cooperation with a movable contact to support the directional wheel. When the directional wheel is moved downwards the sliding member drives a corresponding electrode to generate a click signal.

Abstract: A piezoelectric plate electric connection structure aims to receive an input voltage from a voltage source and goes through a polarization process to deliver an output voltage. It has an input electrode on a piezoelectric plate to receive input from the voltage source and an output electrode to deliver the output voltage that are located on two surfaces normal to the polarization direction. One surface has an independent electrode. Another surface has two separated electrodes. The input electrode and output electrode are respectively the independent electrode and one of the separated electrodes. The input and output electrodes are spaced by the piezoelectric plate which is dielectric and pressure-resistant. Thus discharge phenomenon can be prevented between the input electrode and the output electrode.

Abstract: A chip-stacked package structure comprises a lead frame, a first chip, and a second chip. The led frame is composed of a plurality of inner leads and a plurality of outer leads. The plurality of inner leads comprises a plurality of first inner leads in parallel and a plurality of second inner leads in parallel, wherein the ends of first inner leads and the ends of second inner leads are arranged in rows facing each other at a distance. The active surface of first chip is fixedly connected to the lower surface of first inner leads and second inner leads via a first adhesive layer. A plurality of metal pads is provided near the central area of the active surface of first chip and is exposed. A second adhesive layer is formed on the back surface of second chip for fixedly connecting the back surface of second chip and the upper surface of first inner leads and second inner leads.