Abstract: A luminous keyboard includes a cap which has a bottom lid with a first light directing zone formed thereon. The cap also has a first light blocking surface on an outer surface corresponding to the first light directing zone. At least one luminous unit is provided to provide light to the first light directing zone so that the light projects to the first light directing zone is diffused and blocked by the first light blocking surface, and finally projected to a keyboard portion to illuminate keycaps. The bottom lid replaces the light directing layer used in the conventional luminous keyboards. Thus the interior space of the keyboard can be shrunk to make fabrication and assembly of the keyboard simpler. The keyboard thus formed is thinner and lighter and suitable for mass production.

Abstract: A chip stacked package structure and applications are provided, wherein the chip stacked package structure comprises a substrate, a first chip, circuit board and a second chip. The substrate has a first surface and an opposite second surface. The first chip having a first active surface and an opposite first rear surface is electrically connected to first surface of substrate serving by a flip chip bonding process. The circuit board has a dielectric layer set on the first rear surface and a patterned conductive layer set on the dielectric layer is electrically connected to the substrate via a bonding wire. The second chip set on the patterned conductive layer has a plurality of second pads formed on a second active surface thereof and eclectically connected to the patterned conductive layer.

Abstract: A chip stacked package structure and applications are provided, wherein the chip stacked package structure comprises a substrate, a first chip, a patterned circuit layer and a second chip. The substrate has a first surface and an opposite second surface. The first chip with a first active area and an opposite first rear surface is electrically connected to first surface of substrate by a flip chip bonding process. The patterned circuit layer set on the dielectric layer is electrically connected to the substrate via a bonding wire. The second chip set on the patterned circuit layer has a second active area and a plurality of second pads formed on the second active area, wherein the second bonding pad is electrically connected to the patterned circuit layer.

Abstract: A means for being electrically connected to an electrode of a piezo-electric plate is adapted for connecting the piezo-electric plate to a circuit board disposed under the piezo-electric plate. The piezo-electric plate and the circuit board are respectively provided with a first electrode and a second electrode corresponding to the first electrode. The means includes a conductive element and an elastic element. The conductive element includes at least two connecting surfaces electrically connected to each other and respectively electrically connected to the first electrode and the second electrode. The elastic element is joined with the conductive element and located between the piezo-electric plate and the circuit board.

Abstract: A leadframe employed by a leadless package comprises a plurality of package units and an adhesive tape. Each of the package units has a die pad with a plurality of openings and a plurality of pins disposed in the plurality of openings. The adhesive tape is adhered to the surfaces of the plurality of package units and fixes the die pad and the plurality of pins.

Abstract: The present invention discloses an inverter test device and a method thereof, which provides a single-load environment or a multi-load test environment to test electrical performance of an inverter or inverters, including: unbalanced current comparison, phase comparison, current/voltage deviation, and fusion heat (I2T), and record the test results, wherein the test method of the present invention is implemented with the procedures, which can be executed in a computer or a similar device to undertake control and data processing, and the electrical signals acquired by the inverter test device are processed, compared and calculated in order to realize the abovementioned tests of unbalanced current comparison, phase comparison, current/voltage deviation, and fusion heat (I2T).

Abstract: A sideward clipping apparatus aims to clip and release an article through double-depressing actions in cyclic operations. It has a sliding member which includes an upper clipping portion and a lower clipping portion that are coupled through a first base and a second base. The lower clipping portion synchronously drives the upper clipping portion through the first base at an initial force receiving state to form a first fan moving track. The lower clipping portion is in contact with the sliding member and moved vertically to a second position under the force to drive the upper clipping portion through the second base to form a second fan moving track. Thereby the upper clipping portion and the lower clipping portion form a clipping space when the sliding member is moved to the second position to accurately clip the article.

Abstract: A switch control circuit includes a N-channel MOSFET, a first bleeder unit, a P-channel MOSFET and a second bleeder unit. The N-channel MOSFET has a first input terminal, a first output terminal and a first control terminal. The first output terminal is connected to ground. The first bleeder unit has a voltage-dividing function to the voltage from an input and output interface of a computer. The first bleeder unit is connected with the first control terminal and the first output terminal of the N-channel MOSFET. The P-channel MOSFET has a second input terminal, a second output terminal and a second control terminal. The second output terminal is connected to the working voltage terminal of the external hard disk. The second bleeder unit is connected between the external power supply and the first input terminal of the N-channel MOSFET. The P-channel MOSFET is connected with the first bleeder unit.

Abstract: A chip package without a core, including a patterned circuit layer, a chip, a solder mask, a molding compound and multiple outer terminals, is provided. The patterned circuit layer has a first surface and a second surface opposite to each other. The chip disposed on the first surface is electrically connected to the patterned circuit layer. The solder mask disposed on the second surface has a plurality of first openings by which part of the patterned circuit layer is exposed. The molding compound with a plurality of through holes cover the pattern circuit layer and fix the chip onto the patterned circuit layer. Each outer terminal disposed in the through hole is electrically connected to the patterned circuit layer.

Abstract: An improved LCD back light panel lamp connecting structure comprises cold cathode fluorescent lamps (CCFL), and adjacent CCFL modules having high voltage ends and feedback ends arranged alternately, and the feedback ends on both sides of the CCFLs respectively coupled to two return boards. The feedback end of the CCFL is coupled to a proximate return board, and the return board is disposed separately at both ends of the CCFLs. Two return boards are coupled to a pulse width modulation (PWM) control unit so that the two return boards feed back the current to the PWM control unit. The high voltage end of the CCFL is coupled to a transformer.

Abstract: A chip package structure including a circuit pattern, a frame, a first adhesive layer, a plurality of leads, an insulating adhesive layer, a chip, a plurality of first bonding wires, a plurality of second bonding wires, and a molding compound is provided. The frame and leads are disposed around the circuit pattern. The first adhesive layer fastens the frame and the circuit pattern. The insulating adhesive layer is disposed between the leads and the frame. The chip has a plurality of bonding pads and is disposed on the first adhesive layer. The first bonding wires electrically connect the bonding pads individually to the circuit pattern. The second bonding wires electrically connect the leads individually to the circuit pattern. Thus, the bonding pads are electrically connected with the leads through the first bonding wires, the circuit pattern, and the second bonding wires. The molding compound covers foregoing components.

Abstract: A dynamic random access memory (DRAM) is provided. The dynamic random access memory includes a deep trench capacitor disposed in a first trench of a substrate, a conductive layer disposed in a second trench of the substrate, a gate structure, and a conductive layer disposed on the surface of the substrate at two sides of the gate structure. The depth of the second trench is smaller than the depth of the first trench, and the second trench partially overlaps with the first trench. The conductive layer disposed in the second trench is electrically connected with the conductive layer of the deep trench capacitor. The gate structure is disposed on the substrate. The conductive layer at one side of the gate structure is electrically connected with the conductive layer disposed in the second trench.

Abstract: Provided are semiconductor low-K Si die wire bonding packages with package stress control and fabrication methods for such packages. The packages include molding interface material applied onto the low-K Si die. In general, the molding interface material is selectively applied onto the low-K Si die surface in order to minimize to safe levels the package stress experienced by the low-K Si die. Selective application includes defining various combinatorial patterns of coated and non-coated regions. In addition, selective application may also include a general application of molding interface material to create a stress buffer zone. The results are packages with less stress experienced by the low-K Si die and so improved reliability (in compliance with industry specifications).

Abstract: A security system having corresponding intelligent voice response and a voice response method thereof aims to output a corresponding intelligent voice response message according to the identification (ID) of visitors. The security system includes a trigger unit to detect action conditions of a visitor and generates a trigger signal, an ID system which has a safe person list, a database containing at least one voice message and an ID unit linking to the database to get the ID information of the visitors and compare with the safe person list to generate an ID signal, and a control unit to get the trigger signal and ID signal, and the voice message from the database to make voice response to the visitor through an output unit.

Abstract: A dynamic random access memory (DRAM) is provided. The dynamic random access memory includes a deep trench capacitor disposed in a first trench of a substrate, a conductive layer disposed in a second trench of the substrate, a gate structure, and a conductive layer disposed on the surface of the substrate at two sides of the gate structure. The depth of the second trench is smaller than the depth of the first trench, and the second trench partially overlaps with the first trench. The conductive layer disposed in the second trench is electrically connected with the conductive layer of the deep trench capacitor. The gate structure is disposed on the substrate. The conductive layer at one side of the gate structure is electrically connected with the conductive layer disposed in the second trench.

Abstract: A rotary structure for radiation fans mainly includes a seat for housing a radiation fan and two brackets coupling with the seat to hold two sleeves. The two sleeves are coupled with two rotary ends of a spindle of the radiation fan to confine the spindle to rotate about a single axis. Thereby the spindle can rotate without skewing while the radiation fan is operating, and impact and noise generation can be prevented.

Abstract: A chip package including a metal layer, a film-like circuit layer, a chip, a lead matrix and an encapsulant is provided. The film-like circuit layer disposed on the metal layer includes an insulating film disposed on the metal layer and a circuit layer disposed on the insulating film. The circuit layer has a plurality of conductive traces. The chip disposed above the metal layer is electrically connected to the conductive traces. The lead matrix having a plurality of leads is disposed outside the chip. At least part of the leads are electrically connected to the conductive traces. The encapsulant at least encapsulates the chip, the film-like circuit layer, at least part of the leads, and at least part of the metal layer.

Abstract: A mechanical wheel instruction apparatus to replace the conventional wheel structure that uses a grating switch to output signal. The invention has a mechanical conductive terminal set to output instruction signals when become conductive. The apparatus of the invention has a wheel which has a rotation side with convex sections located on the perimeter in an equally spaced manner. Every two neighboring convex sections are interposed by a concave section. A base board is provided to electrically connect to a contact leg assembly which has a forward contact leg and a reverse contact leg located on the convex sections and a common contact leg located on the concave section. When the wheel is subject to a force and rotates, the convex section pushes the forward contact leg and the reverse contact leg to contact the common contact leg to output a forward rotation instruction and a reverse rotation instruction. The invention may be fabricated at a lower cost than the grating switch and save installation space.

Abstract: A piezoelectric power supply includes a power supply unit to provide DC intermediate voltage power output to drive a high voltage output unit of a first load through a first piezoelectric plate and a low voltage output unit of a second load through a second piezoelectric plate. Thereby the power supply can provide a low voltage secondary power output to reduce cost and improve power output flexibility and efficiency. It can be used on display devices such as gas discharge lamps, and also provide additional low voltage secondary power for peripheral devices such as speakers, lamps, ear sets, USB connection ports and the like.

Abstract: A multi-instruction switch includes a base, a control disk, a plurality of electrodes and a conductive element. The control disk is located above the base and can rotate relative to the base to issue instructions. The conductive element is bent to form a common contact end in the middle portion and a first contact end and a second contact end on two ends to connect respectively to a common electrode, a first electrode and a second electrode. By rotating the control disk, a guiding portion located on an inner peripheral rim of the control disk can move the conductive element in a biased manner so that the common electrode and the first electrode or the second electrode are electrically connected to generate a leftward or rightward rotational instruction. Meanwhile a rotational click is produced. The structure is simple and the fabrication cost is lower.