Abstract: A chip stacked package structure and applications are provided, wherein the chip stacked package structure comprises a substrate, a first chip, a patterned circuit layer and a second chip. The substrate has a first surface and an opposite second surface. The first chip with a first active area and an opposite first rear surface is electrically connected to first surface of substrate by a flip chip bonding process. The patterned circuit layer set on the dielectric layer is electrically connected to the substrate via a bonding wire. The second chip set on the patterned circuit layer has a second active area and a plurality of second pads formed on the second active area, wherein the second bonding pad is electrically connected to the patterned circuit layer.

Abstract: Provided are semiconductor die flip chip packages and semiconductor die flip chip package components where certain properties of the packages/components are controlled to facilitate management of the package stresses. Also provided are fabrication methods for such packages and package components. For instance, the thickness of a die can be controlled such that the stress generated/experienced by the die is minimized. As such, the package stress is managed to suitable levels for incorporation of a low-K Si die and/or a thin package substrate. Further, a thin die can be attached to a heat spreader to increase the rigidity for easier handling during fabrication of the semiconductor die flip chip package.

Abstract: A thermoelectric device is provided. The thermoelectric device includes a P-type thermoelectric component, an N-type thermoelectric component, and an electrically conductive layer. Each of the P-type thermoelectric component and the N-type thermoelectric component includes a substrate and a nanowire structure. The conductive layer connects the P-type thermoelectric component set with the N-type thermoelectric component set. The thermoelectric device is adapted for recycling heat generated by the heat source, and for effectively converting the heat into electrical energy.

Abstract: A multi-direction input device for computers includes a direction wheel, a toggle mechanism and a plurality of electrodes. The direction wheel has one-degree of rotational freedom and two-degree of freedom to perform clicking, forward rolling, backward rolling, leftward moving and rightward moving operations. Thereby mating electrodes are electrically connected to generate corresponding signals. In normal conditions, the toggle mechanism and a movable contact jointly support the direction wheel. When the direction wheel is depressed, the toggle mechanism drives and connects a corresponding electrode to generate a click signal.

Abstract: A chip package including a circuit substrate, a chip, a B-staged adhesive layer, a leadframe, a number of first bonding wires, a number of second bonding wires, and a number of third bonding wires. The chip is disposed on the circuit substrate. The B-staged adhesive layer is disposed on the circuit substrate. The leadframe is disposed on the circuit substrate and includes a number of leads. Portions of the leads are embedded in the B-staged adhesive layer, and an end of each of the leads is exposed by the B-staged adhesive layer. The first bonding wires are electrically connected between the chip and the circuit substrate. The second bonding wires are electrically connected between the chip and the leads. The third bonding wires are electrically connected between the leads and the circuit substrate. In addition, a manufacturing method of a chip package is also provided.

Abstract: A chip package including a base, a chip, a molding compound and a plurality of outer terminals is provided. The base is essentially consisted of a patterned circuit layer having a first surface and a second surface opposite to each other and a solder mask disposed on the second surface, wherein the solder mask has a plurality of first openings by which part of the patterned circuit layer is exposed. The chip is disposed on the first surface and is electrically connected to the patterned circuit layer. The molding compound covers the pattern circuit layer and fixes the chip onto the patterned circuit layer. The outer terminals are disposed in the first openings and electrically connected to the patterned circuit layer.

Abstract: A multi-chip package includes a carrier, a first chip, a relay circuit substrate, a number of first bonding wires, a number of second bonding wires, a second chip, a number of third bonding wires, and an adhesive layer. The first chip is disposed on the carrier. The relay circuit substrate is disposed on the first chip. The first bonding wires are electrically connected between the first chip and the relay circuit substrate. The second bonding wires are electrically connected between the relay circuit substrate and the carrier. The second chip is disposed on the carrier and is stacked with the first chip. The third bonding wires are electrically connected between the second chip and the carrier. The adhesive layer is adhered between the first chip and the second chip. In addition, a manufacturing method of a multi-chip package is also provided.

Abstract: A pixel circuit includes an LED having an anode that receives a driving current and a cathode that receives a scan signal, and a driving circuit including: a switch unit operable according to a voltage signal, and adapted for permitting transfer of a data signal when operating in an on state; a capacitor having a first end coupled to the switch unit, and a second end; a first transistor having a first terminal that is coupled to the second end of the capacitor, a second terminal that is coupled to the anode of the LED, and a control terminal that is coupled to the first end of the capacitor; and a second transistor having a first terminal that is adapted for coupling to the voltage source, a second terminal that is coupled to the first terminal of the first transistor, and a control terminal that is adapted for receiving a reference voltage.

Abstract: A chip stacked package structure and applications are provided. The chip-stacked package structure includes a main substrate, a baseboard substrate, and a molding compound. The main substrate has a substrate and a first chip. The substrate has a first surface and a second surface opposite to the first surface. The first chip is disposed on the first surface and electrically connected to the substrate via first bumps. The baseboard substrate has a third surface and a fourth surface faced towards the substrate. The baseboard substrate includes a core layer having a plurality of first through holes and a first accommodation space in which the first chip is received. The second chip is disposed on the third surface of the baseboard substrate. The molding compound is used to encapsulate the main substrate, and the baseboard substrate.

Abstract: The invention provides a light uniform device and a digital light processing (DLP) projection system applying the said light uniform device. The light uniform device comprises a light incident surface, a light emergent surface and a light uniform portion defined therebetween. The light incident surface and the light emergent surface have a first contour and a second contour, respectively. And a first projection image of the second contour that is projected onto a projection plane forms a rotational angle about a longitudinal axial direction corresponding to a second projection image of the first contour projected onto the projection plane. Thereby, the light sources may simply be disposed in the projection system to provide uniform light beams that entirely cover the DMD (digital micromirror device) after being uniformed by the light uniform device. Neither of the light sources need to be inclined following with the DMD, nor is additional relay lens needed in imaging.

Abstract: A chip stacked package structure and applications are provided, wherein the chip stacked package structure comprises a substrate, a first chip, a patterned circuit layer and a second chip. The substrate has a first surface and an opposite second surface. The first chip with a first active area and an opposite first rear surface is electrically connected to first surface of substrate by a flip chip bonding process. The patterned circuit layer set on the dielectric layer is electrically connected to the substrate via a bonding wire. The second chip set on the patterned circuit layer has a second active area and a plurality of second pads formed on the second active area, wherein the second bonding pad is electrically connected to the patterned circuit layer.

Abstract: A ladder drum for adjusting and regulating the angular orientation and closure of horizontal slats of a venetian blind, of the type incorporating ladder cords or tape ladders, having a polygonal profiled structure comprising a series of planar sidewalls defining a substantially hollow interior. The number of sidewalls defining the polygonal structure is greater than four sidewalls, and less than or equal to twelve sidewalls, with each adjacent plane sidewall having an internal angular orientation in the range of 90° to 150°. To enhance the uniform closure of the slats of a horizontal blind, the polygonal ladder drum is more preferably in the form of an uneven hexagon that is either formed from injection molded plastics or a metal die stamping. The opposing top and bottom sidewalls are greater in measurement than the remaining mediate sidewalls, with at least two opposing mediate sidewalls having attachment means to insert and retain ladder cords in a counter balanced relation.

Abstract: A circuit structure for a lamp set which includes a socket, a lamp assembly mounted onto the socket and an electrode portion. The lamp assembly surrounds a housing space inside to hold a power distribution dock connecting to the socket. The power distribution dock has a holding space to hold a power conversion element which is electrically connected to the electrode portion to receive external electric power and transform to starting power to drive the lamp assembly to generate light. The power distribution dock and the power conversion element are located in the housing space. Thus the total height of the socket is reduced and the lamp set can be shrunk to a smaller size.

Abstract: A pellet article forming apparatus includes a bottom mold and a top mold. The bottom mold has at least one forming cavity to hold polymer powder. The forming cavity has a first arched surface at the bottom that has an edge extended to form a first compression surface and an opening to hold a thrust member. The top mold is located above the bottom mold and has a second arched surface opposing the first arched surface. The second arched surface has another edge formed a second compression surface corresponding to the first compression surface. The top mold and the bottom mold are movable against each other to provide a compression force to the polymer powder held in the forming cavity to form a desired pellet article. The pellet article thus formed has a desired genuine spherical surface. Damage of the molds that might otherwise occur due to compression can be prevented.

Abstract: A self-luminous keyboard with brightness-enhanced keycaps of the present invention comprises a baseplate, a substrate arranged above the baseplate, a plurality of keycaps coupled to the substrate and able to move up and down, a circuit board triggered by the contact of the keycap to output a signal, and a light emitting element. The substrate has a plurality of via-holes each corresponding to one keycap. There is a light transmission path from the light emitting element through the via-hole to the keycap. In each light transmission path, there is a light concentration member, and the light emitted by the light emitting element is concentrated by the light concentration member and then transmitted to the keycap. Thereby, the brightness of the keycaps is enhanced to be higher than the brightness of the gap between the adjacent keycaps, and the recognizability thereof is promoted.

Abstract: A notebook computer with force feedback for gaming is provided. A vibrating plate is disposed on a host, and a vibration generating device is disposed at the bottom of the vibrating plate to generate vibration when a computer game is executed. Thus, a user playing the computer game may feel the force feedback. Additionally, to prevent vibration from affecting the normal operation of the host, a damper is disposed between the host and the vibrating plate to prevent vibration from being transmitted to the host.

Abstract: In a computer system, a card holder is removably attached to a bracket to hold an add-in card in an I/O connector. The card holder is capable of being slid onto the bracket and a side edge of the add-in card.

Abstract: A portable computer including a host and an input device is provided. The host has a accommodating space and a first wireless transmission unit. The input device is detachably disposed in the accommodating space and has a touch pad, a plurality of control buttons and a second wireless transmission unit. The touch pad and the control buttons are electrically connected to the second wireless transmission unit. The second wireless transmission unit is used for performing wireless transmission with the first wireless transmission unit.