Patents by Inventor Wen Chu

Wen Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10325089
    Abstract: Techniques for a resource management advice service are provided. In some examples, resource management advice and/or instructions may be provided for use with mobile devices, mobile applications, cloud applications, and/or other web-based applications. For example a mobile client may request to perform one or more resource management operations associated with a service provider. Based at least in part on the requested operation and/or the particular service provider, advice and/or instructions for managing the resource may be provided.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: June 18, 2019
    Assignee: Oracle International Corporation
    Inventors: Ajay Sondhi, Ching-Wen Chu, Beomsuk Kim
  • Publication number: 20190172457
    Abstract: A notebook computer including a foldable body, a display unit, a touch pad, a keyboard, a first control unit, a wake-up unit, and a voice-assistant system, a second control unit electrically connected to the first control unit, the wake-up unit, and the voice-assistant system is provided. The first control unit is electrically connected to the display unit, the touch pad, and the keyboard. When the foldable body is in a folded and closed state, the display unit, the touch pad, and the keyboard are inactivated, the notebook computer is in a first mode. In the first mode, a user drives the wake-up unit to generate a wake-up signal being transmitted to the second control unit to activate the first control unit and the voice-assistant system. The notebook computer is transformed to a second mode, wherein the display unit, the touch pad, and the keyboard are still inactivated or sleeping.
    Type: Application
    Filed: November 29, 2018
    Publication date: June 6, 2019
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Yu-Wen Cheng, Wang-Hung Yeh, Hsin-Chieh Fang, Shu-Hsien Chu, Chun-Wen Wang
  • Publication number: 20190165110
    Abstract: The present disclosure provides a semiconductor structure, including providing a metal layer, an adhesion-enhancing layer over the metal layer, a dielectric stack over the adhesion-enhancing layer, a contact penetrating the dielectric stack and the adhesion-enhancing layer and connecting with the metal layer, a barrier layer disposed between the contact and the dielectric stack, and a high-k dielectric layer disposed between the contact and the barrier layer.
    Type: Application
    Filed: April 25, 2018
    Publication date: May 30, 2019
    Inventors: YAO-WEN CHANG, GUNG-PEI CHANG, CHING-SHENG CHU, CHERN-YOW HSU
  • Patent number: 10300104
    Abstract: The present disclosure provides various molecular constructs having a targeting element and an effector element. Methods for treating various diseases using such molecular constructs are also disclosed.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: May 28, 2019
    Assignee: IMMUNWORK INC.
    Inventors: Tse-Wen Chang, Hsing-Mao Chu, Chun-Yu Lin, Wei-Ting Tian
  • Publication number: 20190157141
    Abstract: A method for manufacturing a semiconductor structure includes following operations. A sacrificial layer is formed over the conductive layer, wherein the sacrificial layer includes a first sacrificial portion over the first conductive portion, and a second sacrificial portion over the second conductive portion, and a first thickness of the first sacrificial portion is larger than a second thickness of the second sacrificial portion. The first sacrificial portion and the second sacrificial portion of the sacrificial layer, and the second conductive portion of the conductive layer are removed, with at least a portion of the first conductive portion remaining over the bottom of the trench.
    Type: Application
    Filed: September 13, 2018
    Publication date: May 23, 2019
    Inventors: YU-HSIANG LIAO, YA-HUEI LI, LI-WEI CHU, CHUN-WEN NIEH, HUNG-YI HUANG, CHIH-WEI CHANG, CHING-HWANQ SU
  • Patent number: 10298435
    Abstract: Embodiments generally relate to link state change detection and notification within a server with embedded or directly integrated network switch. In a server configuration in which there is no longer a distinct separation between a network switch and a network interface card (NIC), the server can no longer immediately detect a change in the link state of any of the switch's ports. This can lead to connection failure. A Link State Policy Table is thus implemented within the embedded or integrated switch, capable of changing the NIC link state according to one or more pre-defined or user-defined policy settings. The server is then notified of the change in the NIC link state, and can release an old IP address or request a new IP address accordingly.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: May 21, 2019
    Assignee: Quanta Computer Inc.
    Inventors: Ching-Chih Shih, Yu-Chu Huang, Wen-Yuan Hung
  • Patent number: 10297690
    Abstract: A semiconductor device includes a gate structure formed over a channel region of the semiconductor device, a source/drain region adjacent the channel region, and an electrically conductive contact layer over the source/drain region. The source/drain region includes a first epitaxial layer having a first material composition and a second epitaxial layer formed over the first epitaxial layer. The second epitaxial layer has a second material composition different from the first composition. The electrically conductive contact layer is in contact with the first and second epitaxial layers. A bottom of the electrically conductive contact layer is located below an uppermost portion of the first epitaxial layer.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: May 21, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Kun-Mu Li, Liang-Yi Chen, Wen-Chu Hsiao
  • Patent number: 10293018
    Abstract: The present disclosure provides various molecular constructs having a targeting element and an effector element. Methods for treating various diseases using such molecular constructs are also disclosed.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: May 21, 2019
    Assignee: IMMUNWORK INC.
    Inventors: Tse-Wen Chang, Hsing-Mao Chu, Li-Yun Du
  • Publication number: 20190146357
    Abstract: A method for manufacturing a structure on a substrate includes projecting an image of a reference pattern onto a substrate having a first patterned layer, the first patterned layer including first alignment marks and first overlay measurement marks, and the reference pattern including second alignment marks and second overlay measurement marks, aligning, based on the first alignment marks and the second alignment marks, the first patterned layer to the image of the reference pattern, obtaining a pre-overlay mapping of the first overlay measurement marks and the second overlay measurement marks, and determining compensation data indicative of information of the pre-overlay mapping of the first overlay measurement marks and the second overlay measurement marks.
    Type: Application
    Filed: April 27, 2018
    Publication date: May 16, 2019
    Inventors: Wen-Yun WANG, Hua-Tai LIN, Chia-Chu LIU
  • Publication number: 20190148187
    Abstract: A detaping machine is adapted for removing a tape from a frame, the tape includes a wafer mounting area and a periphery area surrounding the wafer mounting area. The detaping machine includes a carrier and a detaping module. The carrier is for supporting the tape and the frame. The detaping module includes an elastic pressing device and a detaping head, wherein the periphery area of the tape is adapted to be pressed by the elastic pressing device, and the wafer mounting area of the tape is adapted to be pressed by the detaping head. A detaping method is further provided.
    Type: Application
    Filed: January 22, 2018
    Publication date: May 16, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Sheng Kuo, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo, Wen-Chin Kan, Yang-Ann Chu
  • Publication number: 20190140515
    Abstract: A speed reducing device includes a motor and a speed reducing mechanism. The motor includes a stator portion and a rotor portion. The rotor portion includes a first eccentric ring and a second eccentric ring. The speed reducing mechanism is partially accommodated within the rotor portion. The speed reducing mechanism includes a first roller assembly, a second roller assembly, a third roller assembly, a first cycloid disc set and a second cycloid disc set. The first roller assembly includes at least one first roller. The second roller assembly includes at least one second roller. The third roller assembly includes an output shaft and at least one third roller. The first cycloid disc set is mounted around the output shaft and disposed within the first eccentric ring. The second cycloid disc set is mounted around the output shaft and disposed within the second eccentric ring.
    Type: Application
    Filed: November 1, 2018
    Publication date: May 9, 2019
    Inventors: Ching-Hsiung Tsai, Chi-Wen Chung, En-Yi Chu
  • Publication number: 20190137332
    Abstract: A dual sensor module includes a substrate, a light source, a first encapsulant, a second encapsulant, a photodetector, and an electrode. The light source is disposed on the substrate. The first encapsulant is formed over the light source. The photodetector is disposed on the substrate. The second encapsulant is formed over the photodetector. The electrode is electrically connected to the substrate and is entirely located between the light source and the photodetector. A dual sensing accessory and a dual sensing device having the dual sensor module for detecting optical and electrical properties are also provided.
    Type: Application
    Filed: August 1, 2018
    Publication date: May 9, 2019
    Inventors: CHANG-SHENG CHU, YU-TANG LI, YEH-WEN LEE, CHIH-HSUN FAN, LUNG-PIN CHUNG, JYH-CHERN CHEN, SHUANG-CHAO CHUNG
  • Publication number: 20190135610
    Abstract: Structures and formation methods of a semiconductor device structure are provided. A semiconductor device structure includes a first dielectric layer and a second dielectric layer over a semiconductor substrate. A cavity penetrates through the first dielectric layer and the second dielectric layer. The semiconductor device structure also includes a first movable membrane between the first dielectric layer and the second dielectric layer. The first movable membrane is partially exposed through the cavity. The first movable membrane includes first corrugated portions arranged along an edge of the cavity.
    Type: Application
    Filed: January 18, 2018
    Publication date: May 9, 2019
    Inventors: Yi-Chuan Teng, Chun-Yin Tsai, Chia-Hua Chu, Chun-Wen Cheng
  • Publication number: 20190140106
    Abstract: A thin film transistor including a flexible substrate, a semiconductor layer, a first gate, and a first gate dielectric layer is provided. The semiconductor layer is located on the flexible substrate. The first gate is located on the flexible substrate and corresponds to a portion of the semiconductor layer. The first gate dielectric layer is located between the first gate and the semiconductor layer. The first gate dielectric layer is in contact with the semiconductor layer, and the hydrogen atom concentration of the first gate dielectric layer is less than 6.5×1020 atoms/cm3. A method of manufacturing the thin film transistor is also provided.
    Type: Application
    Filed: March 6, 2018
    Publication date: May 9, 2019
    Applicants: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Tai-Jui Wang, Yung-Hui Yeh, Jui-Wen Yang, Hsiao-Chiang Yao, Chun-Hung Chu
  • Patent number: 10276677
    Abstract: Semiconductor device structures and methods for forming the same are provided. A method for forming a semiconductor device structure includes forming a gate structure over a semiconductor substrate. The method also includes forming spacer elements adjoining sidewalls of the gate structure. The method further includes forming a protection material layer over the gate structure. The formation of the protection material layer includes a substantial non-plasma process. In addition, the method includes depositing a dielectric material layer over the protection material layer. The deposition of the dielectric material layer includes a plasma-involved process.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: April 30, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Wen Huang, Yun-Wen Chu, Hong-Hsien Ke, Chia-Hui Lin, Shin-Yeu Tsai, Shih-Chieh Chang
  • Patent number: 10269648
    Abstract: Methods of fabricating a semiconductor device structure are provided. The method includes forming a fin structure over a substrate. The method also includes forming a gate structure over the fin structure. The method further includes epitaxially growing a source/drain structure covering the fin structure. In addition, the method includes epitaxially growing a capping layer over the source/drain structure. The capping layer has a top portion and a lower portion under the top portion. The top portion has a first thickness and the lower portion has a second. A ratio of the first thickness to the second thickness is in a range of about 1.01 to about 2. The method also includes etching the top portion and the lower portion of the capping layer. The method further includes forming a silicide layer over the source/drain structure and a contact over the silicide layer.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: April 23, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Kun-Mu Li, Chih-Chiang Chang, Wen-Chu Hsiao
  • Publication number: 20190105151
    Abstract: The present invention provides a device and method for inserting an IOL into an eye of a patient. The IOL injector is configured to automatically load an IOL into the injector by folding and aligning the IOL into a lens cartridge of the injector without manual manipulation of the IOL by the physician during the procedure. The injector is configured to properly orient and align the IOL within the injector and maintain proper alignment throughout delivery of the IOL to the eye of a patient and thereby ensuring that the IOL is properly positioned and oriented at a predetermined location in the eye.
    Type: Application
    Filed: October 5, 2017
    Publication date: April 11, 2019
    Inventors: Wen-Chu Tseng, Ming-Yen Shen, William Lee
  • Publication number: 20190097006
    Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a gate structure, a first source/drain structure, and a contact structure. The gate structure has a gate dielectric layer over a first fin structure. The first source/drain structure is positioned in the first fin structure and adjacent to the gate structure. The first source/drain structure includes a first epitaxial layer in contact with the top surface of the first fin structure and a second epitaxial layer over the first epitaxial layer and extending above a bottom surface of the gate dielectric layer. The contact structure extends into the first source/drain structure. The top surface of the first fin structure is between a top surface and a bottom surface of the first source/drain structure.
    Type: Application
    Filed: August 13, 2018
    Publication date: March 28, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kun-Mu LI, Wei-Yang LEE, Wen-Chu HSIAO
  • Publication number: 20190039957
    Abstract: A low-temperature co-fired microwave dielectric ceramic material includes: (a) 85 wt % to 99 wt % ceramic material comprising Mg2SiO4, Ca2SiO4, CaTiO3, and CaZrO3, wherein a weight ratio of Mg2SiO4 relative to Ca2SiO4 is of (1-x): x, a weight ratio of CaTiO3 relative to CaZrO3 is of y:z, and a weight ratio of entities of Mg2SiO4 and Ca2SiO4 relative to CaTiO3 is of (1-y-z):y, 0.2?x?0.7, 0.05?y?0.2, 0.05?z?0.4; and (b) 1 wt % to 15 wt % glass material composed of Li2O, BaO, SrO, CaO, B2O3, and SiO2.
    Type: Application
    Filed: October 11, 2018
    Publication date: February 7, 2019
    Inventors: Li-Wen Chu, Kuei-Chih Feng, Chih-Hao Liang
  • Patent number: D849667
    Type: Grant
    Filed: January 14, 2018
    Date of Patent: May 28, 2019
    Assignee: Qingdao Sentury Tire Co., Ltd.
    Inventors: Wen Sun, Yanmei Zhang, Jingjing Chu, Yixin Zhang